BibTeX records: Sunkyu Kong

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@inproceedings{DBLP:conf/emccompo/KimJKKCLK15,
  author       = {Jonghoon J. Kim and
                  Daniel H. Jung and
                  Heegon Kim and
                  Sunkyu Kong and
                  Sumin Choi and
                  Jaemin Lim and
                  Joungho Kim},
  title        = {TSV-based current probing structure using magnetic coupling in 2.5D
                  and 3D {IC}},
  booktitle    = {10th International Workshop on the Electromagnetic Compatibility of
                  Integrated Circuits, {EMC} Compo 2015, Edinburgh, UK, November 10-13,
                  2015},
  pages        = {212--215},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/EMCCompo.2015.7358359},
  doi          = {10.1109/EMCCOMPO.2015.7358359},
  timestamp    = {Wed, 16 Oct 2019 14:14:57 +0200},
  biburl       = {https://dblp.org/rec/conf/emccompo/KimJKKCLK15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/KimBKKKJK14,
  author       = {Jonghoon J. Kim and
                  Bumhee Bae and
                  Sukjin Kim and
                  Sunkyu Kong and
                  Heegon Kim and
                  Daniel H. Jung and
                  Joungho Kim},
  title        = {Magnetically-coupled current probing structure consisting of TSVs
                  and RDLs in 2.5D and 3D ICs},
  booktitle    = {2014 International 3D Systems Integration Conference, 3DIC 2014, Kinsdale,
                  Ireland, December 1-3, 2014},
  pages        = {1--6},
  publisher    = {{IEEE}},
  year         = {2014},
  url          = {https://doi.org/10.1109/3DIC.2014.7152151},
  doi          = {10.1109/3DIC.2014.7152151},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/KimBKKKJK14.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/pieee/KimKKKSSCKA13,
  author       = {Jiseong Kim and
                  Jonghoon J. Kim and
                  Sunkyu Kong and
                  Hongseok Kim and
                  In{-}Soo Suh and
                  Nam Pyo Suh and
                  Dong{-}Ho Cho and
                  Joungho Kim and
                  Seungyoung Ahn},
  title        = {Coil Design and Shielding Methods for a Magnetic Resonant Wireless
                  Power Transfer System},
  journal      = {Proc. {IEEE}},
  volume       = {101},
  number       = {6},
  pages        = {1332--1342},
  year         = {2013},
  url          = {https://doi.org/10.1109/JPROC.2013.2247551},
  doi          = {10.1109/JPROC.2013.2247551},
  timestamp    = {Sun, 06 Oct 2024 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/journals/pieee/KimKKKSSCKA13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/3dic/KimKKBJKKLP13,
  author       = {Jonghoon J. Kim and
                  Heegon Kim and
                  Sukjin Kim and
                  Bumhee Bae and
                  Daniel H. Jung and
                  Sunkyu Kong and
                  Joungho Kim and
                  Junho Lee and
                  Kunwoo Park},
  title        = {Non-contact wafer-level {TSV} connectivity test methodology using
                  magnetic coupling},
  booktitle    = {2013 {IEEE} International 3D Systems Integration Conference (3DIC),
                  San Francisco, CA, USA, October 2-4, 2013},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/3DIC.2013.6702328},
  doi          = {10.1109/3DIC.2013.6702328},
  timestamp    = {Wed, 16 Oct 2019 14:14:50 +0200},
  biburl       = {https://dblp.org/rec/conf/3dic/KimKKBJKKLP13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/emccompo/KimKKBJKKLP13,
  author       = {Jonghoon J. Kim and
                  Heegon Kim and
                  Sukjin Kim and
                  Bumhee Bae and
                  Daniel H. Jung and
                  Sunkyu Kong and
                  Joungho Kim and
                  Junho Lee and
                  Kunwoo Park},
  title        = {Design of contactless wafer-level {TSV} connectivity testing structure
                  using capacitive coupling},
  booktitle    = {9th International Workshop on Electromagnetic Compatibility of Integrated
                  Circuits, {EMC} Compo 2013, Nara, Japan, December 15-18, 2013},
  pages        = {158--162},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/EMCCompo.2013.6735192},
  doi          = {10.1109/EMCCOMPO.2013.6735192},
  timestamp    = {Wed, 16 Oct 2019 14:14:57 +0200},
  biburl       = {https://dblp.org/rec/conf/emccompo/KimKKBJKKLP13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/emccompo/BaeKKKK13,
  author       = {Bumhee Bae and
                  Sunkyu Kong and
                  Jonghoon J. Kim and
                  Sukjin Kim and
                  Joungho Kim},
  title        = {Magnetic field coupling on analog-to-digital converter from wireless
                  power transfer system in automotive environment},
  booktitle    = {9th International Workshop on Electromagnetic Compatibility of Integrated
                  Circuits, {EMC} Compo 2013, Nara, Japan, December 15-18, 2013},
  pages        = {238--242},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/EMCCompo.2013.6735207},
  doi          = {10.1109/EMCCOMPO.2013.6735207},
  timestamp    = {Wed, 12 Jun 2019 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/emccompo/BaeKKKK13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}