Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing.

J. P. Rebrasse

A. Aubert J. P. Rebrasse Lionel Dantas de Morais Nathalie Labat Hélène Frémont Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing. 1688-1691 2010 50 Microelectron. Reliab. 9-11 https://doi.org/10.1016/j.microrel.2010.07.036 db/journals/mr/mr50.html#AubertRMLF10

A. Aubert Lionel Dantas de Morais J. P. Rebrasse Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations. 1144-1148 2008 48 Microelectron. Reliab. 8-9 https://doi.org/10.1016/j.microrel.2008.07.004 db/journals/mr/mr48.html#AubertMR08

S. Debleds J. P. Rebrasse Lionel Dantas de Morais I. Frapreau R. Perdreau B. Morillon Localization of sensitive areas of power AC switch under thermal laser stimulation. 1569-1573 2007 47 Microelectron. Reliab. 9-11 https://doi.org/10.1016/j.microrel.2007.07.018 db/journals/mr/mr47.html#DebledsRMFPM07

Lionel Dantas de Morais F. Allanic F. Roqueta J. P. Rebrasse Thermal approach of defects generation on copper/organic dielectric interface due to SEM inspections. 1614-1618 2007 47 Microelectron. Reliab. 9-11 https://doi.org/10.1016/j.microrel.2007.07.056 db/journals/mr/mr47.html#MoraisARR07

F. Allanic A. Aubert S. Debleds I. Frapreau Hélène Frémont Nathalie Labat Lionel Dantas de Morais B. Morillon R. Perdreau F. Roqueta