Fault Diagnosis of Wafer Acceptance Test and Chip Probing Between Front-End-of-Line and Back-End-of-Line Processes.

Sat, 01 Jan 2022 00:00:00 +0100

Shu-Kai S. Fan , Chun-Wei Cheng, Du-Ming Tsai :
Fault Diagnosis of Wafer Acceptance Test and Chip Probing Between Front-End-of-Line and Back-End-of-Line Processes. IEEE Trans Autom. Sci. Eng. 19(4): 3068-3082 (2022)