Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes.

Ming-Hung Shu Bi-Min Hsu Min-Chuan Hu Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes. 2690-2700 2012 52 Microelectron. Reliab. 11 https://doi.org/10.1016/j.microrel.2012.06.033 db/journals/mr/mr52.html#ShuHH12