MICRF114

Low-Power Integrated Sub-GHz Wireless RF Transmitter

General Features
• Fully Integrated Low-Power Sub-GHz RF
Transmitter
• Single-Pin Crystal Oscillator with Integrated
Programmable Load Capacitor
• Wide Operating Voltage Range: 1.8V to 3.6V
• Industrial Temperature Range: -40°C to +85°C
• Low-Current Consumption: 0.2 µA in Sleep mode,
11.7 mA in +10 dBm Transmit mode
• Fast Turn-On and Turn-Off Times
• Small Footprint 6-pin SOT-23 Package

RF/Analog Features
• Fully Integrated VCO and PLL Loop Filter
• Single-Ended RF Output with Easy Antenna
Matching
• Wide Operating Frequency Range: 285 MHz to
445 MHz
• Transmit Power Programmable in 1 dB steps from Pin Diagram
-2 dBm to +13 dBm
• Data Rate: Up to 115.2 kbps NRZ, 57.6 kbps
Manchester Encoded
• On-Off Keying (OOK) Modulation with Power 6-pin SOT-23
Ramp-Up Control
• Complies with US (FCC) and Canada (IC)
Standards
SCK 1 6 OSC
Digital Features
• Simple and Flexible 2-pin Proprietary SDI 2 5 VSS
Microcontroller (MCU) Interface
• Supports Proprietary Remote Control Protocols VDD 3 4 RFO
Applications
• Remote Keyless Entry (RKE)
• Garage Door Opener (GDO)
• Alarm and Security Systems
• Command and Control
• Wireless Sensors
• Industrial Sensing and Control
• Smart Energy

 2015 Microchip Technology Inc. Preliminary DS50002416A-page 1

MICRF114
Table of Contents
1.0 Hardware Description................................................................................................................................................................... 3
2.0 Functional Description.................................................................................................................................................................. 7
3.0 Typical Performance Curves .......................................................................................................................................................11
4.0 Application Circuit....................................................................................................................................................................... 19
5.0 Electrical Characteristics ............................................................................................................................................................ 23
6.0 Packaging Information................................................................................................................................................................ 27
Appendix A:Revision History................................................................................................................................................................ 30
The Microchip Web Site ....................................................................................................................................................................... 31
Customer Change Notification Service ................................................................................................................................................ 31
Customer Support ................................................................................................................................................................................ 31
Product Identification System............................................................................................................................................................... 32

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DS50002416A-page 2 Preliminary  2015 Microchip Technology Inc.

 MICRF114
1.0 HARDWARE DESCRIPTION The MICRF114 is optimized for battery-powered
applications. It features low-current consumption and
can operate over a wide supply voltage range. Internal
1.1 Overview
circuits sensitive to supply voltage variations run from
The MICRF114 is a simple, low-cost OOK transmitter the on-chip Low Dropout (LDO) regulator. To reduce
with programmable output power. It is primarily pin count and system Bill of Materials (BOM), the LDO
intended for command and control applications such as regulator does not need an external capacitor for
RKE and GDO. The transmitter is synthesizer based stability, and the single-pin reference oscillator has a
for high-frequency accuracy. It operates on a single integrated programmable crystal load capacitor. The
frequency that is determined by the frequency of the single-ended RF output enables easy matching to
crystal connected to the built-in reference oscillator. monopole antennas with a minimal number of external
This frequency can be selected from a wide range. The components.
more popular transmit frequencies require readily A 2-wire proprietary MCU interface is used to program
available crystal frequencies. For example, a the parameters of the MICRF114 to select its operating
433.92 MHz transmit frequency requires a 13.56 MHz mode and to input the transmit data packet. A built-in
crystal. The RF performance of the transmitter is self-calibration circuit ensures consistent performance
compliant with FCC and IC regulations and with some over the operating frequency range and against
Japanese standards. European Telecommunications temperature variations. Initial calibration is
Standards Institute (ETSI) requirements can be met at automatically performed during Power-on Reset
low-radiated power. (POR). Recalibration can be initiated by the MCU that
controls the application when required.

1.2 Block Diagram

Figure 1-1 shows the MICRF114 block diagram.

FIGURE 1-1: MICRF114 ARCHITECTURE BLOCK DIAGRAM

POWER MANAGEMENT
VDD
To Digital
BIAS Block
VSS LDO POR
REFERENCE

Regulated
Supply
SYNTHESIZER

OSC PFD CP VCO PA RFO

1/32

TX Data

SDI DIGITAL BLOCK

MCU Interface Operating mode control
SCK Configuration register Self-Calibration

 2015 Microchip Technology Inc. Preliminary DS50002416A-page 3

MICRF114
1.3 Pin Descriptions
Table 1-1 describes the MICRF114 pins.
TABLE 1-1: MICRF114 PIN DESCRIPTIONS
Pin Name Type Description
1 SCK Digital Input MCU interface serial clock input
2 SDI Digital Input MCU interface serial configuration or TX data input
3 VDD Power Positive supply voltage
4 RFO Analog Output RF TX output
5 VSS Power Ground reference
6 OSC Analog Input Reference crystal connection

1.4 Power Management 1.6 Device Control

The MICRF114 has a single power pin and a single Data transmission start and stop are always initiated by
ground pin. The sensitive analog blocks run from an the MCU. Programmable transmit parameters are
internal LDO, which does not need an external stored in a single 16-bit register. The value in this
capacitor. A bias and reference circuit provides register is kept as long as the supply voltage is present.
reference voltage to the LDO and bias currents to all The MCU can rewrite the register at the beginning of
analog blocks. each transmission. Immediately after POR or at the
The digital block runs from the unregulated supply. This beginning of a transmission, an internal state machine
enables communication with the MCU even when most turns on the various blocks of the MICRF114 with the
of the blocks (including the LDO) are turned off to save required sequence and timing and then performs an
power. Additionally, the MICRF114 retains its self- automatic calibration of the device when required. The
calibration result and user-programmable parameters MCU must wait for these operations to be completed
in this low-power state. To get the highest possible before sending the transmit data packet.
efficiency, the RF Power Amplifier (PA) block runs An initial calibration is done after POR. The calibration
directly from the unregulated supply. result is kept as long as the supply voltage is present.
A POR circuit keeps the MICRF114 in a Reset state Recalibration can be requested by the MCU when
until the supply voltage is sufficient for proper operation required.
of the digital block. The POR event resets the device
control state machine and the Configuration register to 1.7 Crystal Oscillator
their default state. A Reset is also triggered by
The reference frequency source is a single-pin crystal
sufficiently large supply voltage glitches and brown-out.
oscillator. The transmit frequency is 32 times the
reference. Thus, the relative accuracy of the crystal
1.5 MCU Interface oscillator directly determines the accuracy of the
A proprietary 2-wire serial interface consisting of a transmit frequency. The most popular transmit
clock line and a data line is utilized to control the frequencies require standard and off-the-shelf low-cost
operation of the MICRF114 and to input the transmit crystals. The oscillator operates at parallel resonance.
data packet. Special start and stop conditions on these The load capacitor that the crystal requires is
two lines indicate the beginning and end of integrated to minimize the BOM. To accommodate
communication with the MCU. Except during these various crystal types and compensate for PCB parasitic
Start and Stop bits, the MCU must change the data capacitances, the value of this load capacitor is
only when the clock is at logic low. Control and programmable by the MCU.
Configuration bits are sent synchronously, and the The other function of the crystal oscillator is to provide
MICRF114 samples the data on the rising edge of the a relatively accurate clock frequency for the automatic
clock. Transmit data is sent asynchronously with the calibration circuit. As the crystal frequency is
clock held low. During transmission, the serial data line determined by the transmit frequency and can vary
is connected directly to the RF modulator. The over a wide range, the clock is generated by dividing
assembly and timing of the data packet are the the crystal frequency by a programmable number that
responsibilities of the MCU. must be properly set to achieve the expected
performance.

DS50002416A-page 4 Preliminary  2015 Microchip Technology Inc.

 MICRF114
1.8 Frequency Synthesizer
The frequency synthesizer is a fully integrated PLL with
a fixed feedback division ratio. It operates on a single
frequency that is determined by the reference crystal.
The VCO within the PLL operates directly at the
transmit frequency to save power. The VCO also has a
wide tuning range to cover most of the popular
frequencies below 500 MHz.

1.9 Transmit Path

The main element of the transmit path is the RF Power
Amplifier (PA). Since typical applications use monopole
antennas, the output is single-ended. It must be biased
to VDD using an inductor. This configuration enables
high-voltage swing, thereby reducing the required
supply current for the specified output power. The
output power is programmable by the MCU in 1 dB
steps. This enables the current consumption and
transmit range to be optimized according to the
product requirements of the customers. Additionally,
compliance with the relevant regulations can be
ensured with different antenna gains.
To ease design-in and keep the BOM as low as
possible, the output capacitance of the PA is
programmable by the MCU. As a result, the impedance
matching circuit between the RF output and the
antenna requires fewer elements and is easier to
optimize. A modulator circuit is used to control the
slope of the output power ramping on and off. This is to
prevent steep supply current transients which may
result in a spectrum splatter.

 2015 Microchip Technology Inc. Preliminary DS50002416A-page 5

MICRF114
NOTES:

DS50002416A-page 6 Preliminary  2015 Microchip Technology Inc.

 MICRF114
2.0 FUNCTIONAL DESCRIPTION FIGURE 2-1: INITIALIZATION FLOWCHART

2.1 Initialization
After applying the supply voltage, the MICRF114 is RESET
initialized by its built-in POR circuit. The POR is level
sensitive. It starts to generate a Reset pulse for the N
internal logic when the rising supply voltage (VDD) VDD>VTP?
crosses a given threshold. The threshold level is
Y
chosen so that the operation of the digital circuits is
already guaranteed at the beginning of the Reset wake-up
pulse. sequence A
Initialization first involves resetting all internal state
machines, setting the Configuration register to its calibration
default value, and executing a calibration sequence to
guarantee proper operation of the frequency
synthesizer. Blocks needed for calibration are turned SLEEP
on with the required sequence and timing. The result is
stored after calibration, and all blocks are turned off to
bring the MICRF114 into Sleep mode where it waits for 2.2 Operating Modes
the MCU to initiate transmission. The calibration result
is kept as long as the supply voltage is present. The MICRF114 has two main operating modes:
Figure 2-1 illustrates the simplified initialization • Sleep mode
flowchart where the Reset due to VDD drops or brown- • Transmit mode
out is not shown. Additionally, it is not shown that a
In Sleep mode, all the blocks (except the POR and the
Reset condition in any state or during any sequence
digital block) are powered down and wait to be woken
immediately brings the MICRF114 into its Reset state.
up by the MCU. The current consumption is minimal
One of the advantages of the level-sensitive Reset is because there is no activity within the digital block.
that the generation and length of the Reset pulse are After the wake-up sequence and the associated delay,
mostly independent of the slope of the rising VDD. MICRF114 enters Transmit mode. In Transmit mode,
Another advantage is that it triggers a Brown-out Reset all blocks become active and an RF signal, modulated
(BOR) when VDD goes below the VTP threshold by the data stream sent by the MCU, is transmitted.
voltage. Refer to Figure 2-2. Transmission can be terminated by the MCU without
Abrupt drops of the VDD can disturb the operation of any time-out delay when required and the MICRF114
digital circuits even if the VDD always stays above the immediately goes back to Sleep mode.
threshold level during such a transient. The POR block Section 2.3 “Communication with the MCU” shows
also generates a Reset pulse after this kind of event if the main operating mode flowchart and the associated
the voltage drop exceeds the VTG threshold value. activity on the MCU interface.
FIGURE 2-2: POR OPERATION
VDD

VTG

VTP

0 t
tDP tDP
PORn

VHI

VLO t

Note: VHI follows VDD

 2015 Microchip Technology Inc. Preliminary DS50002416A-page 7

MICRF114
2.3 Communication with the MCU Control and Configuration bits are sent synchronously
after the Start bit. The two control bits, CAL and CFG,
The communication between the MCU and the must always be present. If CAL is high, recalibration is
MICRF114 is one-directional and it is always initiated performed before transmission. In this case, the wake-
by the MCU. It uses a proprietary protocol that supports up time from Sleep mode to Transmit mode is longer. If
switching between the two operating modes, optional CFG is high, the MCU must send 17 additional
request for recalibration, reprogramming of the Configuration bits. The first 16 bits updates the 16-bit
operating parameters (as needed), and transmit data Transmit Parameter register within the MICRF114. The
input. The logic is active-high. Most Significant bit (MSb) is sent first. The last bit must
The communications protocol requires both the lines of always be ‘0’. Figure 2-3 shows the two methods of
Serial Clock (SCK) and Serial Data Input (SDI) to idle starting transmission.
high. However, this is not the state with the lowest The wake-up sequence from Sleep mode to Transmit
current consumption because the SCK input of the mode starts at the rising edge of the last clock pulse.
MICRF114 has an internal pull-down resistor to avoid This is the second or 19th clock, depending on the CFG
unwanted clock transitions during the power-on bit setting.
process. In Sleep mode, the clock line can be pulled
low to minimize the overall supply current.

FIGURE 2-3: COMMUNICATION PROTOCOL

Transmit with quick-start using the default or previously loaded configuration settings.
Recalibration (CAL=1) is not normally needed.

Sleep Wake-up Transmit Sleep

tWK + cal * tCL
Start CAL CFG Asynchronous TX Data Stop

(MCU Waits)
SDI

SCK

Transmit start with configuration settings update.

Recalibration is always needed in case of frequency setting change.

Sleep Wake-up

Start CAL CFG 16 Configuration (Config) bits 0

SDI

SCK

DS50002416A-page 8 Preliminary  2015 Microchip Technology Inc.

 MICRF114
After the wake-up delay, the MICRF114 starts to 2.4 Parameter Selection
automatically transmit. Since the exact timing of this is
unknown by the MCU, keep the transmit data input low All transmit parameters of the MICRF114 are stored in
until the maximum specified wake-up time passes. a single 16-bit register. This is loaded with default
Although the MICRF114 wakes up earlier, it transmits values at POR. The MCU can modify these values
‘0’, that is, no carrier. Transmit data is asynchronous before sending the transmit data. There are four
and directly modulates the RF carrier. The MCU takes distinct parameter fields in the register as shown in
care of all timing and coding of the data in software. Table 2-1. To keep the MCU interface simple, only the
This is feasible due to the typical low-data rates and is complete register as a whole can be updated. Fields
necessary due to the great variety of proprietary that need to remain unchanged must be reloaded with
protocols. The flowchart in Figure 2-4 shows the the same value. For example, the new register value is
MICRF114 states during a normal operation cycle. retained in Sleep mode until the next POR event.

FIGURE 2-4: TOP FLOWCHART

SLEEP

N N
Start? CAL = 1?

Y Y
Read Calibration
Control Bits

N Wake-up
CFG = 1?
Sequence B
Y

Read
Config Bits TRANSMIT

N
Stop?
Wake-up
Sequence A Y

TABLE 2-1: TRANSMIT PARAMETERS OF MICRF114

Default
Bit Range Parameter Field Symbol
Setting Value
<15:13> Transmit Frequency F<2:0> fTX 0x7 425-445 MHz
<12:8> Crystal Load Capacitor X<4:0> CXT 0x16 18 pF
<7:4> RF Transmit Power P<3:0> PTX 0xC +10 dBm
<3:0> RF Output Tuning Capacitor R<3:0> CTX 0x0 0 pF

 2015 Microchip Technology Inc. Preliminary DS50002416A-page 9

MICRF114
Select the transmit frequency parameter to ensure that 2.5 Transmitting
the actual operating frequency, which is determined by
the selected crystal, falls into the frequency range The MICRF114 is normally in Sleep mode. The MCU
defined by the parameter. Refer to Table 2-2. always initiates entry into Transmit mode by sending a
Start bit, the compulsory Control bits, and the optional
TABLE 2-2: FREQUENCY RANGE Configuration bits to the MICRF114, which starts its
fTX range (MHz) wake-up sequence. After the wake-up delay, it
F<2:0> transmits the data present on its SDI pin. The MCU
Min Max holds the SDI pin low for the maximum specified wake-
285 305 0 up time. If calibration is requested, the maximum
305 325 1 specified calibration time must be added to the wake-
up time.
325 345 2
345 365 3 Transmit parameters are not usually changed on the
fly, and recalibration is not necessary. Therefore, the
365 385 4 MCU can use the quick-start transmit sequence as
385 405 5 described in Section 2.3 “Communication with the
405 425 6 MCU”. However, except in the rare case that all default
parameter settings are acceptable for the application,
425 445 7
the first transmission after a POR event must include
Equation 2-1 through Equation 2-1 show that the rest sending the required Configuration bits. Recalibration
of the programmable parameters can be calculated is always needed when the transmit frequency is in a
from the Control bit fields. band that is different from the default value.
The MICRF114 stays in Transmit mode until the MCU
EQUATION 2-1: CRYSTAL LOAD sends a Stop bit and then reverts to Sleep mode
CAPACITOR without any time-out delay.

Crystal Load Capacitor:

CXT = 7 pF + X <4:0> * 0.5 pF

EQUATION 2-2: RF TRANSMIT POWER

RF Transmit Power:
PTX = -2 dBm + P <3:0> dBm

EQUATION 2-3: RF OUTPUT TUNING

CAPACITOR

RF Output Tuning Capacitor:

CTX = 0 pF + R <3:0> * 0.2 pF

The operating frequency, the crystal load capacitor,

and the RF output tuning capacitor settings depend on
the selection of external components and, to a lesser
extent, PCB layout. If these parameters are different
from the default values, it must be set only once during
the first transmission after a POR event.

DS50002416A-page 10 Preliminary  2015 Microchip Technology Inc.

 MICRF114
3.0 TYPICAL PERFORMANCE Harmonic filtering is omitted. The measured power
levels are calculated back to the RFO pin of the
CURVES
MICRF114, taking into account the losses of the
characterization setup. Component values that are
3.1 Characterization Setup valid for the two frequencies are listed in Table 3-1.
The MICRF114 is characterized at the two most
popular frequencies, 315 MHz and 433.92 MHz, over TABLE 3-1: COMPONENT VALUES
the whole operating temperature and supply voltage Frequency
range. The results shown in Section 3.2 “315 MHz Component
Results” and Section 3.3 “433 MHz results” are the 315 MHz 433 MHz
average values taken from three devices, each coming
L1 360 nH 330 nH
from a typical wafer lot. The RF output of the
MICRF114 is matched to 50 ohms to facilitate L2 39 nH 22 nH
connection to a spectrum analyzer. Refer to Figure 3-1. C1 6.8 pF 5.6 pF
C2 9.1 pF 5.6 pF
FIGURE 3-1: MATCHING CIRCUIT
Current consumption is measured with a 50% duty-
SCHEMATIC
cycle OOK modulation at 115.2 kbps data rate. Output
power is measured in unmodulated, Continuous Wave
VDD (CW) mode. The reference spur level and the phase
noise are also measured in CW mode at +10 dBm
(nominal) output power setting. The phase noise is
L1 measured at 1 MHz offset from the carrier.
SMA Connector
MICRF114

L2
50 ohm

RFO C2
C1

 2015 Microchip Technology Inc. Preliminary DS50002416A-page 11

MICRF114
3.2 315 MHz Results
Figure 3-2 through Figure 3-7 show the average values measured at 315 MHz.

FIGURE 3-2: CURRENT CONSUMPTION, 0 dBm POWER SETTING

FIGURE 3-3: OUTPUT POWER, 0 dBm POWER SETTING

DS50002416A-page 12 Preliminary  2015 Microchip Technology Inc.

 MICRF114
FIGURE 3-4: CURRENT CONSUMPTION, +10 dBm POWER SETTING

FIGURE 3-5: OUTPUT POWER, +10 dBm POWER SETTING

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MICRF114
FIGURE 3-6: REFERENCE SPUR LEVEL

FIGURE 3-7: PHASE NOISE

DS50002416A-page 14 Preliminary  2015 Microchip Technology Inc.

 MICRF114
3.3 433 MHz results
Figure 3-8 through Figure 3-13 show the average values measured at 433 MHz.

FIGURE 3-8: CURRENT CONSUMPTION, 0 dBm POWER SETTING

FIGURE 3-9: OUTPUT POWER, 0 dBm POWER SETTING

 2015 Microchip Technology Inc. Preliminary DS50002416A-page 15

MICRF114
FIGURE 3-10: CURRENT CONSUMPTION, +10 dBm POWER SETTING

FIGURE 3-11: OUTPUT POWER, +10 dBm POWER SETTING

DS50002416A-page 16 Preliminary  2015 Microchip Technology Inc.

 MICRF114
FIGURE 3-12: REFERENCE SPUR LEVEL

FIGURE 3-13: PHASE NOISE

 2015 Microchip Technology Inc. Preliminary DS50002416A-page 17

MICRF114
NOTES:

DS50002416A-page 18 Preliminary  2015 Microchip Technology Inc.

 MICRF114
4.0 APPLICATION CIRCUIT Table 4-1 shows the values of the frequency-
dependent components for the two most popular
frequencies. Except for L1, it is recommended to use
4.1 50-ohm Matching Example
0402 SMD components in the matching and filter
Figure 4-1 shows the RF section of the MICRF114 network.
application circuit. The VSS pin potential is the ground TABLE 4-1: COMPONENT VALUES
reference for the whole circuit. The supply voltage
(1.8V to 3.6V) is connected to the VDD pin. Capacitors Frequency
Component
C5 and C6 provide supply bypass (filtering). In every 315 MHz 433 MHz
application, the MICRF114 has to be controlled by an
MCU via the proprietary serial interface (SDI and SCK X1 9.84375 MHz 13.56 MHz
pins). The quartz crystal (X1) connected to the OSC pin L2 39 nH 22 nH
determines the operating frequency which is 32 times C1 9.1 pF 6.8 pF
the crystal resonance frequency.
C2 9.1 pF 5.6 pF
The matching network (L1, L2, C1, and C2) provides
C3 12 pF 8.2 pF
optimum power transfer from the MICRF114 to the
antenna. The filter stage (L3, C3, and C4) removes the L3 27 nH 18 nH
unwanted harmonics. The required harmonic C4 12 pF 8.2 pF
suppression depends on the operating frequency,
antenna characteristics, and regional regulations. This
means the order of the filter (the number of
components) may be different in an actual application
with an integrated antenna.

FIGURE 4-1: SCHEMATIC DIAGRAM

Supply
C5 C6

4.7 nF 470 pF
L1
Matching Filtering
220 nH
L2 C2 L3
VDD RFO 50 ohm
MICRF114

C1 C3 C4 RF Output
SDI VSS

From MCU
SCK OSC
X1

Note: This is a suggested schematic diagram only. Component values for C1 to C4 and L2 to L3 vary according
to operating frequency, antenna characteristics, and regional regulations. Certain components can be
removed.

 2015 Microchip Technology Inc. Preliminary DS50002416A-page 19

MICRF114
4.2 Measurement Results Measurement results are shown in Figure 4-2 through
Figure 4-7. Note that the regulations limit the radiated
The important parameters for regulatory standard com- field strength at a given distance. The maximum usable
pliance are measured on PICtail™ boards for the two power setting at a given frequency and geographic
most popular operating frequencies using the fre- region can be determined only if the antenna gain is
quency-dependent components listed in Table 4-1. The known. The level of the fundamental carrier signal and
MICRF114 operates in CW mode. Harmonics and all possible out-of-band signals – harmonics, spurs,
spurs are measured at +10 dBm output power setting. and integrated phase noise – must be taken into
Matching network, cable, and connector losses are not account. The filter network can be simplified at low-
compensated to ensure that the actual power readings radiated power.
on the spectrum analyzer are slightly less.

FIGURE 4-2: HARMONIC LEVELS AT 315 MHZ

FIGURE 4-3: SPURIOUS LEVELS AT 315 MHZ

DS50002416A-page 20 Preliminary  2015 Microchip Technology Inc.

 MICRF114
FIGURE 4-4: PHASE NOISE AT 315 MHZ

FIGURE 4-5: HARMONIC LEVELS AT 433 MHZ

 2015 Microchip Technology Inc. Preliminary DS50002416A-page 21

MICRF114
FIGURE 4-6: SPURIOUS LEVELS AT 433 MHZ

FIGURE 4-7: PHASE NOISE AT 433 MHZ

DS50002416A-page 22 Preliminary  2015 Microchip Technology Inc.

 MICRF114
5.0 ELECTRICAL CHARACTERISTICS
In Table 5-1 and Table 5-2, all voltages are referenced to the potential on the VSS pin.

TABLE 5-1: ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Min Typ Max Unit Conditions/Notes
VDD Supply Voltage -0.3 — 4.0 V On VDD pin
VIN Voltage on any pin -0.3 — VDD+0.3 V Except VDD and RFO pins
VRF Voltage on RFO pin -0.3 — 9 V RF peak values
VESD Electrostatic Discharge — — 2000 V Any pin combinations, HBM
IIN Current into any pin -25 — 25 mA —
TST Storage Temperature -55 — +125 °C —
TLD Lead Temperature — — +260 °C Soldering, for max 10s

TABLE 5-2: RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Typ Max Unit Conditions/Notes
VDD Supply Voltage 1.8 2.7 3.6 V On VDD pin
VIN Voltage on any pin 0.0 — VDD V Except VDD and RFO pins
VRF Voltage on RFO pin 0.2 — 7.2 V RF peak values
TOP Operating Temperature -40 +27 +85 °C Ambient

Typical parameter values in Table 5-3 through Table 5-6 are valid at typical VDD and TOP except where indicated
otherwise.

TABLE 5-3: DC CHARACTERISTICS

Symbol Parameter Min Typ Max Unit Conditions/Notes
— 0.2 — µA Sleep mode
IDD Supply Current
— 11.7 — mA Transmit mode(1)
VTP POR Level Threshold — 1.2 — V VDD < VTP needed for POR
VTG POR Glitch Threshold — 0.8 — V Larger glitch generates POR
VIL Digital in Low Level — — 0.35 x VDD V —
VIH Digital in High Level 0.65 x VDD — — V —
RPD Input Pull Down — 134 — k On SCK pin
Note 1: OOK transmission with +10 dBm power and 50% duty cycle.

 2015 Microchip Technology Inc. Preliminary DS50002416A-page 23

MICRF114
TABLE 5-4: AC CHARACTERISTICS
Symbol Parameter Min Typ Max Unit Conditions/Notes
fTX Transmit Frequency 285 — 445 MHz 32 times the crystal frequency
CTX Output Capacitance 0 — 3 pF Selectable with 0.2 pF steps
— +13 — dBm Maximum setting(1)
PTX Output Power -2 — +13 dBm Typical control range
— 1 — dB Power control step
PSP Spurious Emission — — -45 dBc Excluding harmonics
— — -76 dBc/Hz 100 kHz from carrier
LOUT Phase Noise
— — -92 dBc/Hz 1 MHz from carrier
— 7.5-j50.9 —  At 315 MHz
ZOUT RF Output Impedance(2)
— 6.0-j32.2 —  At 433 MHz
0 — 115.2 kbps NRZ
DR Modulation Data Rate
0 — 57.6 kbps Manchester encoded
hMOD Modulation Depth — 60 — dB —
SRVDD VDD Slew Rate 0.1 — — V/ms For proper POR operation
CXT Crystal Load Capacitor 7 — 22.5 pF Selectable with 0.5 pF steps
RXT Crystal Loss Resistance — — 80  —
Note 1: Valid with optimum matching circuit at TOP = 27°C and VDD = 2.7V to 3.3V
2: The RF output impedance varies with the operating frequency, the output power setting PTX (which is not
necessarily equal to the actual output power) and the output tuning capacitance setting CTX. The values
given: PTX = +10 dBm and CTX = 0 pF.

TABLE 5-5: TIMING CHARACTERISTICS

Symbol Parameter Min Typ Max Unit Conditions/Notes
tDP POR Delay Time — — 20 ms —
tWK Wake-up Time — — 3 ms Without calibration
tCL Calibration Time — — 2 ms —

DS50002416A-page 24 Preliminary  2015 Microchip Technology Inc.

 MICRF114
TABLE 5-6: MCU INTERFACE TIMING
Symbol Parameter Min Typ Max Unit Conditions/Notes
tCHI Clock High Time 30 — — ns VSCK > VIH(1)
tCLO Clock Low Time 30 — — ns VSCK < VIL(1)
tCS Clock Setup Time 15 — — ns
Before and after start or stop edge
tCH Clock Hold Time 15 — — ns
tDHI Data High Time 100 — — ns Between stop and start edges
tDS Data Setup Time 15 — — ns —
tDH Data Hold Time 15 — — ns —
tFI Input Signal Fall Time — — 500 ns
Between VIL and VIH
tRI Input Signal Rise Time — — 500 ns
Note 1: For the definition of VIL and VIH see Table 5-3.

FIGURE 5-1: MCU INTERFACE TIMING

SDI
tDHI

SCK

tDS tDH tCHI tCLO tCS tCH tCS tCH

 2015 Microchip Technology Inc. Preliminary DS50002416A-page 25

MICRF114
NOTES:

DS50002416A-page 26 Preliminary  2015 Microchip Technology Inc.

 MICRF114
6.0 PACKAGING INFORMATION

6.1 Package Marking Information

6-Lead SOT-23 Example

F1145
03XYZ

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
e3 Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

 2015 Microchip Technology Inc. Preliminary DS50002416A-page 27

MICRF114
6.2 Package Details

/HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU27>627@
1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
KWWSZZZPLFURFKLSFRPSDFNDJLQJ

N 4

E
E1

PIN 1 ID BY
LASER MARK
1 2 3

e
e1

A A2 c φ

L
A1
L1

8QLWV 0,//,0(7(56
'LPHQVLRQ/LPLWV 0,1 120 0$;
1XPEHURI3LQV 1 
3LWFK H %6&
2XWVLGH/HDG3LWFK H %6&
2YHUDOO+HLJKW $  ± 
0ROGHG3DFNDJH7KLFNQHVV $  ± 
6WDQGRII $  ± 
2YHUDOO:LGWK (  ± 
0ROGHG3DFNDJH:LGWK (  ± 
2YHUDOO/HQJWK '  ± 
)RRW/HQJWK /  ± 
)RRWSULQW /  ± 
)RRW$QJOH  ƒ ± ƒ
/HDG7KLFNQHVV F  ± 
/HDG:LGWK E  ± 
1RWHV
 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH
 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0
%6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV
0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%

DS50002416A-page 28 Preliminary  2015 Microchip Technology Inc.

 MICRF114

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
[Link]

 2015 Microchip Technology Inc. Preliminary DS50002416A-page 29

MICRF114
APPENDIX A: REVISION HISTORY

Revision A (September 2015)

This is the initial released version of the document.

DS50002416A-page 30 Preliminary  2015 Microchip Technology Inc.

 MICRF114
THE MICROCHIP WEB SITE CUSTOMER SUPPORT
Microchip provides online support via our WWW site at Users of Microchip products can receive assistance
[Link]. This web site is used as a means through several channels:
to make files and information easily available to • Distributor or Representative
customers. Accessible by using your favorite Internet
• Local Sales Office
browser, the web site contains the following
information: • Field Application Engineer (FAE)
• Technical Support
• Product Support – Data sheets and errata,
application notes and sample programs, design Customers should contact their distributor,
resources, user’s guides and hardware support representative or Field Application Engineer (FAE) for
documents, latest software releases and archived support. Local sales offices are also available to help
software customers. A listing of sales offices and locations is
• General Technical Support – Frequently Asked included in the back of this document.
Questions (FAQ), technical support requests, Technical support is available through the web site
online discussion groups, Microchip consultant at: [Link]
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives

CUSTOMER CHANGE NOTIFICATION

SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
[Link]. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.

 2015 Microchip Technology Inc. Preliminary DS50002416A-page 31

MICRF114
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office.

PART NO. [X](1) - X /XX Example:

MICRF114T-I/OT: Tape and Reel,
Device Tape and Reel Temperature Package Industrial temperature,
Option Range 6LD SOT-23 package

Device: MICRF114: Low-Power Integrated Sub-GHz Wireless RF

Transmitter

Tape and Reel T = Tape and Reel

Option:
Note 1: Tape and Reel identifier only appears in the
Temperature I = -40C to +85C(Industrial) catalog part number description. This
Range: identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
Package: OT = 6-Lead Plastic Small Outline Transistor Package availability with the Tape and Reel option.
(SOT-23)

DS50002416A-page 32 Preliminary  2015 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device Trademarks

applications and the like is provided only for your convenience
The Microchip name and logo, the Microchip logo, dsPIC,
and may be superseded by updates. It is your responsibility to FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
ensure that your application meets with your specifications.
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
MICROCHIP MAKES NO REPRESENTATIONS OR
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
WARRANTIES OF ANY KIND WHETHER EXPRESS OR SST, SST Logo, SuperFlash and UNI/O are registered
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
trademarks of Microchip Technology Incorporated in the
OTHERWISE, RELATED TO THE INFORMATION,
U.S.A. and other countries.
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR The Embedded Control Solutions Company and mTouch are
FITNESS FOR PURPOSE. Microchip disclaims all liability registered trademarks of Microchip Technology Incorporated
arising from this information and its use. Use of Microchip in the U.S.A.
devices in life support and/or safety applications is entirely at Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
the buyer’s risk, and the buyer agrees to defend, indemnify and CodeGuard, dsPICDEM, [Link], ECAN, In-Circuit
hold harmless Microchip from any and all damages, claims, Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
suits, or expenses resulting from such use. No licenses are KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
conveyed, implicitly or otherwise, under any Microchip Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
intellectual property rights unless otherwise stated. Omniscient Code Generation, PICDEM, [Link], PICkit,
PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,
Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63277-792-8

QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
== ISO/TS 16949 == devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

 2015 Microchip Technology Inc. Preliminary DS50002416A-page 33

 Worldwide Sales and Service
AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
Corporate Office Asia Pacific Office China - Xiamen Austria - Wels
2355 West Chandler Blvd. Suites 3707-14, 37th Floor Tel: 86-592-2388138 Tel: 43-7242-2244-39
Chandler, AZ 85224-6199 Tower 6, The Gateway Fax: 86-592-2388130 Fax: 43-7242-2244-393
Tel: 480-792-7200 Harbour City, Kowloon China - Zhuhai Denmark - Copenhagen
Fax: 480-792-7277 Hong Kong Tel: 86-756-3210040 Tel: 45-4450-2828
Technical Support: Tel: 852-2943-5100 Fax: 86-756-3210049 Fax: 45-4485-2829
[Link] Fax: 852-2401-3431 India - Bangalore France - Paris
support
Australia - Sydney Tel: 91-80-3090-4444 Tel: 33-1-69-53-63-20
Web Address:
Tel: 61-2-9868-6733 Fax: 91-80-3090-4123 Fax: 33-1-69-30-90-79
[Link] Fax: 61-2-9868-6755 India - New Delhi Germany - Dusseldorf
Atlanta Tel: 91-11-4160-8631 Tel: 49-2129-3766400
China - Beijing
Duluth, GA
Tel: 86-10-8569-7000 Fax: 91-11-4160-8632 Germany - Karlsruhe
Tel: 678-957-9614
Fax: 86-10-8528-2104 India - Pune Tel: 49-721-625370
Fax: 678-957-1455
China - Chengdu Tel: 91-20-3019-1500 Germany - Munich
Austin, TX Tel: 86-28-8665-5511
Tel: 512-257-3370 Japan - Osaka Tel: 49-89-627-144-0
Fax: 86-28-8665-7889 Tel: 81-6-6152-7160 Fax: 49-89-627-144-44
Boston Fax: 81-6-6152-9310
China - Chongqing Italy - Milan
Westborough, MA
Tel: 86-23-8980-9588 Japan - Tokyo Tel: 39-0331-742611
Tel: 774-760-0087 Fax: 86-23-8980-9500
Fax: 774-760-0088 Tel: 81-3-6880- 3770 Fax: 39-0331-466781
China - Dongguan Fax: 81-3-6880-3771 Italy - Venice
Chicago Tel: 86-769-8702-9880 Korea - Daegu Tel: 39-049-7625286
Itasca, IL
China - Hangzhou Tel: 82-53-744-4301 Netherlands - Drunen
Tel: 630-285-0071
Fax: 630-285-0075 Tel: 86-571-8792-8115 Fax: 82-53-744-4302 Tel: 31-416-690399
Fax: 86-571-8792-8116 Korea - Seoul Fax: 31-416-690340
Cleveland
China - Hong Kong SAR Tel: 82-2-554-7200 Poland - Warsaw
Independence, OH
Tel: 852-2943-5100 Fax: 82-2-558-5932 or Tel: 48-22-3325737
Tel: 216-447-0464
Fax: 216-447-0643 Fax: 852-2401-3431 82-2-558-5934
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China - Nanjing Malaysia - Kuala Lumpur Tel: 34-91-708-08-90
Dallas
Tel: 86-25-8473-2460 Tel: 60-3-6201-9857 Fax: 34-91-708-08-91
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Fax: 86-25-8473-2470 Fax: 60-3-6201-9859
Tel: 972-818-7423 Sweden - Stockholm
Fax: 972-818-2924 China - Qingdao Malaysia - Penang Tel: 46-8-5090-4654
Tel: 86-532-8502-7355 Tel: 60-4-227-8870
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Fax: 86-532-8502-7205 Fax: 60-4-227-4068
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Tel: 86-21-5407-5533 Tel: 63-2-634-9065
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Tel: 281-894-5983 Fax: 86-21-5407-5066 Fax: 63-2-634-9069
China - Shenyang Singapore
Indianapolis
Tel: 86-24-2334-2829 Tel: 65-6334-8870
Noblesville, IN
Fax: 86-24-2334-2393 Fax: 65-6334-8850
Tel: 317-773-8323
Fax: 317-773-5453 China - Shenzhen Taiwan - Hsin Chu
Tel: 86-755-8864-2200 Tel: 886-3-5778-366
Los Angeles
Mission Viejo, CA Fax: 86-755-8203-1760 Fax: 886-3-5770-955
Tel: 949-462-9523 China - Wuhan Taiwan - Kaohsiung
Fax: 949-462-9608 Tel: 86-27-5980-5300 Tel: 886-7-213-7828
Fax: 86-27-5980-5118 Taiwan - Taipei
New York, NY
Tel: 631-435-6000 China - Xian Tel: 886-2-2508-8600
Tel: 86-29-8833-7252 Fax: 886-2-2508-0102
San Jose, CA
Fax: 86-29-8833-7256 Thailand - Bangkok
Tel: 408-735-9110
Tel: 66-2-694-1351
Canada - Toronto
Fax: 66-2-694-1350
Tel: 905-673-0699
Fax: 905-673-6509
07/14/15

DS50002416A-page 34  2015 Microchip Technology Inc.