SPECIFICATION (Reference sheet)
· Supplier : Samsung electro-mechanics · Samsung P/N: CL21B105KAFNNNE
· Product : Multi-layer Ceramic Capacitor · Description : CAP, 1uF, 25V, ±10%, X7R, 0805
A. Samsung Part Number
CL 21 B 105 K A F N N N E
① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪
① Series Samsung Multi-layer Ceramic Capacitor
② Size 0805 (inch code) L: 2.00 ± 0.10 ㎜ W: 1.25 ± 0.10 ㎜
③ Dielectric X7R ⑧ Inner electrode Ni
④ Capacitance 1 uF Termination Cu
⑤ Capacitance ±10 % Plating Sn 100% (Pb Free)
tolerance ⑨ Product Normal
⑥ Rated Voltage 25 V ⑩ Special Reserved for future use
⑦ Thickness 1.25 ± 0.10 ㎜ ⑪ Packaging Embossed Type, 7" reel
B. Structure & Dimension
Dimension(㎜)
Samsung P/N
L W T BW
CL21B105KAFNNNE 2.00 ± 0.10 1.25 ± 0.10 1.25 ± 0.10 0.50 +0.20/-0.30
C. Samsung Reliablility Test and Judgement Condition
Judgement Test condition
Capacitance Within specified tolerance 1㎑ ±10% / 1.0±0.2Vrms
*A capacitor prior to measuring the capacitance is heat
Tan δ (DF) 0.1 max. treated at 150℃+0/-10℃ for 1 hour and maintained in
ambient air for 24±2 hours.
Insulation 10,000Mohm or 100Mohm×㎌ Rated Voltage 60~120 sec.
Resistance Whichever is smaller
Appearance No abnormal exterior appearance Microscope (×10)
Withstanding No dielectric breakdown or 250% of the rated voltage
Voltage mechanical breakdown
Temperature X7R
Characteristics (From-55℃ to 125℃, Capacitance change should be within ±15%)
Adhesive Strength No peeling shall be occur on the 500g·f, for 10±1 sec.
of Termination terminal electrode
Bending Strength Capacitance change : within ±12.5% Bending to the limit (1㎜)
with 1.0mm/sec.
Solderability More than 75% of terminal surface SnAg3.0Cu0.5 solder
is to be soldered newly 245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to Capacitance change : within ±7.5% Solder pot : 270±5℃, 10±1sec.
Soldering Heat Tan δ, IR : initial spec.
Vibration Test Capacitance change : within ± 5% Amplitude : 1.5mm
Tan δ, IR : initial spec. From 10㎐ to 55㎐ (return : 1min.)
2hours × 3 direction (x, y, z)
Moisture Capacitance change : within ±12.5% With rated voltage
Resistance Tan δ : 0.125 max 40±2℃, 90~95%RH, 500+12/-0hrs
IR : 500Mohm or 12.5Mohm × ㎌
Whichever is smaller
High Temperature Capacitance change : within ±12.5% With 150% of the rated voltage
Resistance Tan δ : 0.125 max Max. operating temperature
IR : 1,000Mohm or 25Mohm × ㎌ 1000+48/-0hrs
Whichever is smaller
Temperature Capacitance change : within ±7.5% 1 cycle condition
Cycling Tan δ, IR : initial spec. Min. operating temperature → 25℃
→ Max. operating temperature → 25℃
5 cycle test
※ The reliability test condition can be replaced by the corresponding accelerated test condition.
D. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )
Product specifications included in the specifications are effective as of March 1, 2013.
Please be advised that they are standard product specifications for reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications,
please contact our sales personnel or application engineers.
- Disclaimer & Limitation of Use and Application -
The products listed in this Specification sheet are NOT designed and manufactured for any use
and applications set forth below.
Please note that any misuse of the products deviating from products specifications or information
provided in this Spec sheet may cause serious property damages or personal injury.
We will NOT be liable for any damages resulting from any misuse of the products, specifically
including using the products for high reliability applications as listed below.
If you have any questions regarding this 'Limitation of Use and Application', you should first contact
our sales personnel or application engineers.
① Aerospace/Aviation equipment
② Automotive or Transportation equipment (vehicles, trains, ships, etc)
③ Medical equipment
④ Military equipment
⑤ Disaster prevention/crime prevention equipment
⑥ Any other applications with the same as or similar complexity or reliability to the applications
set forth above.
