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Overview of Microelectromechanical Systems

This seminar report discusses Microelectromechanical Systems (MEMS). MEMS are integrated microdevices combining electrical and mechanical components fabricated using IC techniques and ranging in size from micrometers to millimeters. They can sense, search, control and actuate on the microscale. The report covers MEMS applications like biomems, moems and rfmems. It discusses MEMS fabrication methods including photolithography, bulk micromachining, surface micromachining and high aspect ratio micromachining. The report highlights advantages like low cost, compact size, and versatility and disadvantages such as limited maximum power. It concludes with future potential in combining MEMS with other technologies to create innovative systems offering outstanding functionality.

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0% found this document useful (0 votes)
377 views7 pages

Overview of Microelectromechanical Systems

This seminar report discusses Microelectromechanical Systems (MEMS). MEMS are integrated microdevices combining electrical and mechanical components fabricated using IC techniques and ranging in size from micrometers to millimeters. They can sense, search, control and actuate on the microscale. The report covers MEMS applications like biomems, moems and rfmems. It discusses MEMS fabrication methods including photolithography, bulk micromachining, surface micromachining and high aspect ratio micromachining. The report highlights advantages like low cost, compact size, and versatility and disadvantages such as limited maximum power. It concludes with future potential in combining MEMS with other technologies to create innovative systems offering outstanding functionality.

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MICRO ELECTROMECHANICAL SYSTEMS(MEMS)

SEMINAR REPORT

Submitted by

SHABEEL MP

(Reg. NO: 20033273)

in partial fulfilment for the award

DIPLOMA IN
ELECTRICAL AND ELECTRONICS ENGINEERING

ORPHANAGE POLYTECHNIC COLLEGE, EDAVANNA

DEPARTMENT OF ELECTRICAL AND ELECTRONICS


ENGINEERING

APRIL 2022
MICRO ELECTROMECHANICAL SYSTEMS(MEMS)

SEMINAR REPORT

Submitted by
SHABEEL MP

(Reg. NO: 20033273)

in partial fulfilment for the award

DIPLOMA IN

ELECTRICAL AND ELECTRONICS ENGINEERING

ORPHANAGE POLYTECHNIC COLLEGE, EDAVANNA

DEPARTMENT OF ELECTRICAL AND ELECTRONICS


ENGINEERING

APRIL 2022
BONAFIDE CERTIFICATE

It is Certified that this seminar report “MICRO ELECTROMECHANICAL


SYSTEMS(MEMS)” Is the Bonafide work of SHABEEL MP (Reg. NO:
20033273) who carried out the work under guidance for the partial fulfillment of the
requirement for the award of the Diploma in Electrical and Electronics Engineering at
Orphanage Polytechnic College, Edavanna.

Mr. ASHIKALI P MR. JASEEL JASIM V


HEAD OF DEPARTMENT SEMINAR CO-ORDINATOR
Electrical & Electronics Engineering Electrical & Electronics Engineering
Orphanage Polytechnic College Orphanage Polytechnic College
Edavanna Edavanna
ABSTRACT

Microelectromechanical Systems, or MEMS, are integrated micro devices or


systems combining electrical and mechanical components. They are fabricated
using integrated circuit (IC) batch processing techniques and can range in size
from micrometers to millimeters. These systems can sense, search control and
actuate on the micro scale, and function individually or in arrays to generate effects
on the macro scale.
Micromechanical systems can be combined with microelectronics, photonics or
wireless capabilities new generation of Microsystems can be developed which will
offer far reaching efficiency regarding space, accuracy, precision and so forth.
Micromechanical systems (MEMS) technology can be used fabricate both
application specific device. The associated micro packaging systems that will allow
for the integration of devices or circuits, made with non-compatible technologies,
with a System-on-Chip environment. The MEMS technology can be used for
permanent, semipermanent or temporary interconnection of sub modules in a
System-on-Chip implementation. The interconnection of devices using MEMS
technology is described with the help of a hearing instrument application and
related.
MEMS technology has enabled us to realize advanced micro devices by using
processes similar to VLSI technology. When MEMS devices are combined with
other technologies new generation of innovative technology will created. This will
offer outstanding Functionality. Such technologies will have wide scale applications
in fields ranging from automotive, aerodynamics, and hydrodynamics, biomedical
and so forth. The main challenge is to integrate all these potentially non-compatible
technologies into a single working microsystem that will offer outstanding
functionality.
ACKNOWLEDGEMENT

I very much grateful to the authorities of Orphanage Polytechnic College,


Edavanna for providing the facilities needed during the seminar presentation

My deepest gratitude and thanks to our Principal Mr. Mansoor Ali PP who has been
kind enough and encouraging us always during the entire period of our course.

I gratefully acknowledge the valuable help and advice received from


Mr. Ashikali.P Head of Department of Electrical and Electronics Engineering whose
continuous encouragement that has resulted in the completion of the present work. His
timely advice, meticulous scrutiny, scholarly advice and friendly approach have
helped us to a very great extent to accomplish this work.

I would also like to express my profound thanks to my class tutor Miss. Shifana.N P
Lecturer in Department of Electrical and Electronics Engineering whose thoughtful
words helped us in completing my seminar successfully. Also, I would like express
my sincere thanks to my seminar co-ordinator Mr. Jaseel Jasim.V demonstrator in
Department of Electrical and Electronics Engineering whose instructions helped more
to do my seminar presentation.

We thank profusely all the Teaching and non-teaching Faculty members of


Electrical and Electronics Engineering Department and my family members for
being my supporting force during my seminar presentation.

SHABEEL MP

Reg. NO : 20033273
CONTENTS

Topic Page No.


LIST OF FIGURES

CHAPTER 1 INTRODUCTION 1

CHAPTER 2 WHAT IS MEMS? 2


CHAPTER 3 NEW MEMS APPLICATIONS 5
3.1 BIOMEMS 6
3.2 MOEMS 6
3.3 RFMEMS 7

CHAPTER 4 MEMS FABRICATION METHODS 10


4.1 PHOTOLITHOGRAPHY 10

4.2 BULK MICROMACHINING 11

4.3 SURFACE MICRO MACHINING 14

4.4 HIGH ASPECT RATIO 17


MICROMACHINING
4.5 COMPUTER AIDED DESIGN 19

CHAPTER 5 ADVANTAGES 20

CHAPTER 6 DISADVANTAGES 21

CHAPTER 7 CONCLUSION AND FUTURE SCOPE 22

REFERECES 23
LIST OF FIGURES

Fig No. Title Page


No.
Fig 2.1.a A MEMS silicon motor together with a strand of human hair. 3

Fig 2.1.b The legs of a spider mite standing on gears from a micro- 3
engine.
Fig 3.1.a Micromachined microtitreplate with 96 cavities filled by 6
capillary force.
Fig 3.1.b A bioMEMS device actuated with ‘microteeth’ to trap, hold 6
and release single red blood cells (unharmed). The little balls
in the channels are red blood cells.

Common questions

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One primary advantage of MEMS technology is its ability to combine electrical and mechanical components at a micro scale, resulting in systems that offer high precision and functionality in various applications, including biotechnology and automotive systems . However, a disadvantage is the complexity involved in the integration of MEMS with other technologies due to material and process incompatibilities, which can complicate device fabrication and increase production costs .

New applications of MEMS technology in the biomedical field include bioMEMS devices that can actuate with microstructures to manipulate biological entities such as red blood cells. These devices enhance precision in diagnostic applications and allow the trapping, holding, and releasing of cells for medical analysis without harming them, demonstrating potential for use in minimally invasive surgical procedures and in vivo diagnostics .

The future scope of MEMS technology is likely to expand as it integrates with emerging fields such as IoT and wearable technology. Current trends indicate increasing miniaturization and sophistication of devices, leading to innovations in personalized medicine, enhanced sensor networks, and more efficient and compact energy systems. The continued development of MEMS could reshape numerous industries by providing critical infrastructure for smart devices and environmental monitoring solutions .

MEMS fabrication techniques leverage batch processing methods that are similar to those used in VLSI technology. This similarity allows for the efficient production of micro devices by using established semiconductor manufacturing processes. Both technologies utilize photolithography and micromachining techniques that enable precise control over micro-scale component fabrication .

High aspect ratio micromachining contributes to the functionality of MEMS devices by facilitating the creation of structures with significant height to width ratios. This enables the fabrication of complex 3D geometries that are essential for certain MEMS applications, such as creating precise mechanical components like gears and springs, which require high structural integrity and deflection capabilities .

Integrating MEMS technology into System-on-Chip environments offers the potential for increased efficiency and functionality within microsystems by allowing the incorporation of non-compatible technologies. This integration facilitates the creation of advanced microdevices that can operate efficiently on both micro and macro scales, enabling applications in diverse fields such as automotive, biomedical, and aerodynamics .

Design flexibility is crucial in MEMS fabrication because it enables the customization of devices to meet specific application requirements, such as miniaturization, efficiency, and functionality. Flexible design approaches allow for the integration of various technologies and materials, leading to innovative solutions that can be tailored to address unique operational environments and application constraints .

Micro packaging in MEMS systems is significant because it enables the protection and connection of microdevices in a compact form, crucial for systems-on-chip. It comprehensively supports temporary and semi-permanent interconnections by facilitating modular approaches to system assembly, allowing replacement or upgrade of system components without the need for total redesign, thereby improving the versatility and economic feasibility of MEMS applications .

The integration of MEMS with microelectronics, photonics, or wireless technologies poses challenges primarily due to potential incompatibilities among these systems. As they often use disparate materials and processes, achieving seamless integration requires overcoming obstacles related to alignment, bonding, and thermal expansion mismatches. This integration is crucial for creating advanced microsystems that offer enhanced functionality and reliability in various applications .

MEMS technology supports advancements in automotive applications by providing sensors and actuators that enhance vehicle performance, safety, and efficiency. These microdevices enable precise monitoring and control of mechanical systems, leading to improved engine management, airbag deployment, and fuel efficiency. They also facilitate the development of smart systems that enhance navigation and driver assistance features .

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