Proton Damage in Light-Emitting Diodes
Proton Damage in Light-Emitting Diodes
Abstract 1
Proton degradation was investigated for several types of 850
light-emitting diodes with wavelengths in the near infrared
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Published in IEEE Transactions on Nuclear Science,46(6), 1781 (1999)
2
Published in IEEE Transactions on Nuclear Science,46(6), 1781 (1999)
Devices were removed from the irradiation area after each In contrast, the OD800 heterojunction devices exhibited
incremental irradiation step and tested over a range of little or no dependence on bias conditions during irradiation.
operating currents using a phototransistor (connected as a Note also that damage in the OD800s was about the same at
photodiode) to measure the light output. A Keithley low and high measurement currents, whereas significantly less
microammeter was used to measure the detector photocurrent. damage -- approximately 30%, depending on the fluence level
Measurements of the forward-biased diode characteristics -- occurred in the OD880s when they were measured at high
were also made before and after each irradiation step. forward current.
A special fixture was fabricated to allow twelve devices to
be irradiated simultaneously. Test devices were soldered to a Figure 4. Degradation of two Optodiode LED technologies
board in a circular pattern. A matching array of photodiodes measured at a forward current of 1 mA.
was used for optical measurements between irradiations (the
photodiodes were not irradiated). A spacer block -- carefully 1
machined to line up with the photodiode and LED arrays --
was used to provide a consistent way to align the LEDs and OD800 (DH)
OD800 (DH)
Light Output (Normalized)
0.8
OD880 (Diffused)
0.2
0 3
0 5x1010 1x1011 1.5x1011 2x1011
Proton Fluence (p/cm2)
Published in IEEE Transactions on Nuclear Science,46(6), 1781 (1999)
1 1
Best, worst and mean of 12 devices
Unbiased during irradiation
0.8 M ean of 15 parts
Measured at IF = 1 mA 0.8
0.4
Mean from second lot 0.4
0.2
Solid lines: 5 x 1010 p/cm 2
0.2
Dashed lines: 8 x 1010 p/cm 2
0
0 2 x 1010 4 x 1010 6 x 1010 1 x 1011
8 x 1010 0
Protons/cm2 0 20 40 60 80 100 120 140 160
LED CURRENT (mA)
Figure 6. Range of damage exhibited by a group of 12 OD880
LEDs, irradiated with no bias and measured at a forward current of 1 Figure 7. Dependence of normalized output power on forward
mA. The mean value of a second lot of six devices is also shown. current for the OD800 LED showing the behavior of an abnormal
unit.
Optodiode LEDs from the double-heterojunction process
exhibited much more variability than devices from the and a double-heterojunction AlGaAs device (850 nm). The
amphoterically doped process. Two of the 800 nm devices latter device is intended for a different class of applications,
degraded quite differently from the majority of the devices in and has a much higher bandwidth than the other LED
the test sample (a total of 17 devices). An example is shown technologies that were evaluated from that manufacturer.
in Figure 7. Initially all devices worked satisfactorily even at Degradation of the amphoterically doped AlGaAs LEDs
very low forward currents (1 mA). However, after the first from Optek are shown in Figure 8 (mean values are shown).
radiation level the minimum current for operation (effectively The magnitude of the degradation is very similar to that of the
a threshold current) increased to about 10 mA for one device. amphoteric AlGaAs LEDs from Optodiode (see Figure 4).
Its light output was far lower than that of typical devices from Both device types show 20-30% less degradation when they
the group until the forward current was increased to about 40 are biased at high operating current during irradiation.
mA. This threshold current continued to increase at higher
radiation levels, as shown in the figure. At low current the
1.0
forward voltage after irradiation was nearly 0.5 V lower than
the forward voltage of devices that behaved normally.
Optek OD233
Forward voltage of typical devices from the group changed by 0.8
Light Output (normalized)
AlGaAs - 890 nm
less than 20 mV. A second unit from the population also measured at 1 mA
behaved abnormally, with similar characteristics. The extreme
damage that occurred for those two parts at low currents was 0.6
unaffected by operating current, and appeared to be a stable
condition that did not recover after irradiation. Six months
0.4
after they were irradiated, the I-V characteristics were
identical to the results obtained just after they were irradiated. biased at 37.5 mA
Results for these two types of LEDs from Optodiode 0.2
illustrate that variability in radiation response can be very unbiased
important for some types of LEDs. This must be taken into 0
account in planning radiation tests and in interpreting radiation 0 2x1010 4x1010 6x1010 8x1010 1x1011
test data. The two part technologies are intended for the same Proton Fluence (p/cm2)
types of basic applications. One technology performs much
better, on average, in a radiation environment, but appears to Figure 8. Degradation of AlGaAs LEDs from Optek (amphoterically
doped).
have far greater unit-to-unit variability. Potential hardness
assurance tools for identifying devices with abnormal response Degradation of the Optek GaAs LEDs, which have a
are discussed in Section VII of the paper. slightly longer wavelength, are shown in Figure 9. The
magnitude of the degradation is very similar to that of the two
other types of amphoterically doped LEDs. However, the
B. Devices Fabricated by Optek and Hewlett- GaAs LEDs show somewhat less dependence on bias
Packard conditions than the AlGaAs LEDs from either Optek or
Optek is a major manufacturer of optoelectronic devices, Optodiode. The optical efficiency of GaAs LEDs is
producing discrete light-emitting diodes as well as approximately a factor of two lower than that of AlGaAs
optocouplers. As shown in Table 1, three types of LEDs from LEDs, largely because of the longer wavelength which affects
Optek were evaluated: diffused, amphoterically doped GaAs internal absorption and coupling efficiency. Thus, AlGaAs
(930 nm); diffused amphoterically doped AlGaAs (890 nm) LEDs are probably a better choice for most applications.
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Published in IEEE Transactions on Nuclear Science,46(6), 1781 (1999)
Double-heterojunction LED
850 nm
1x10 -3 Diode Pretest that occurs at the same forward voltage that the device begins
Current to emit light. The threshold is not significantly affected by
1x10 -5
1.5x1011
irradiation, although the maximum light output is significantly
3x1011
reduced at higher forward voltages, which correspond to
3x1011
1x10 -7 1.5x10 11 actual use conditions. I-V characteristics are further discussed
Current in
Photodetector in Section VI.
Pretest
1x10 -9
V. CURRENT-ENHANCED ANNEALING
1x10-11
0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 Barry, et al. did annealing experiments on unbiased
Forward Voltage (V) amphoterically doped LEDs over a two-week time interval
Figure 10. Change in I-V and P-V characteristics of the Optek [10]. They found that less than 5% of the damage recovered.
OPF320 LED at high proton irradiation levels. Our measurements of amphoterically doped LEDs that
remained unbiased after irradiation are consistent with their
The OPF320 LEDs degrade far less than the DH LEDs results, leading to the conclusion that little or no damage
from Optodiode. Although only 12 units were tested none of recovery occurs in unbiased devices of that type.
the OPF320 LEDs exhibited the abnormal I-V characteristics However, LED damage can be annealed under forward
that were observed in many of the OD800 DH LEDs from injection [2,3]. This was also noted by D’Ordine in studies of
Optodiode. Optek does not make double-heterojunction optocouplers [11]. Only the amphoterically doped devices in
devices for applications that are equivalent to their extensive our study were sensitive to that effect. Figure 12 shows how
line of amphoterically doped LEDs. Consequently, direct the damage in the three different amphoterically doped devices
comparisons of the OPF320 with the other LEDs tested in the recovered when a moderate current, 5 mA, was passed through
study that were produced by Optek do not have the same the devices after they were irradiated. All the devices were
significance as the comparisons made earlier for the two irradiated without bias. They were irradiated to approximately
Optodiode LEDs. 8 x 1010 p/cm2, which reduced the light output to 9-12% of the
LEDs from a Hewlett-Packard optocoupler (the 6N140) initial value prior to irradiation. The ordinate
were also tested in order to directly compare LEDs from that
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Published in IEEE Transactions on Nuclear Science,46(6), 1781 (1999)
2
The amount of damage that recovered during post radiation
Optodiode OD880
annealing is roughly the same as the difference in the
Relative Light Output
1.5
degradation of devices that were irradiated at low and high
currents when the operating current during irradiation is taken
1 Optek OD130
into account (compare the degradation at high and low bias
conditions in Figures 4 and 5), implying that the same basic
effect is involved in reducing the damage for devices that are
0.5 Optek OP233
forward biased during irradiation.
Forward current = 5 mA
Injection-enhanced annealing adds another layer of
0 complexity when interpreting test data for applications.
0 10 100 1000 10,000 100,000 Testing LEDs at high operating currents will cause some of the
Time Bias Is Applied after Irradiation (seconds) damage to anneal, underestimating the amount of damage that
will occur in applications that use lower operating currents, or
Figure 12. Effect of current on post-radiation damage for the three
types of amphoterically doped LEDs. involve devices that are unbiased during most of the time that
they are exposed to radiation. The best way to deal with this
issue is to carefully control the currents and operating time
is normalized to the value after irradiation. Thus, for an LED used for device characterization, and to split the test samples
that degraded to 10% of the initial light level, a factor of 1.5 into groups with low and high bias conditions for
on that scale corresponds to recovery of the damage from measurements. Unlike the double-heterojunction devices,
about 10% to 15% of the light output before the device was amphoterically doped LEDs undergo less damage when they
irradiated. are operated at high currents. The interplay between injection-
We examined the effects of different bias conditions on enhanced annealing and the actual difference in damage at
annealing by passing different amounts of current through high injection makes it difficult to separate these effects unless
irradiated devices. Recovery was much more rapid when high irradiation and measurement conditions closely mimic the
currents were used during the post-irradiation recovery period conditions in the application.
compared to low currents. The maximum current that was
used was 50 mA, one-half the maximum rated current of the
device. Approximately 1/2 of the damage recovered after
several hours of operation at 50 mA, in contrast to the
VI. PARAMETRIC DEGRADATION
unbiased devices which recovered less than 1% during The earlier studies on LED degradation showed that
comparable time periods. The temperature increase during lifetime damage was the mechanism that caused output
steady-state operation at these currents is very slight, so it is degradation [3-5]. Carrier removal, the dominant mechanism
highly unlikely that temperature is a contributing factor. for degradation in GaAs JFETs, is unimportant for 50 MeV
The effect of operating current on annealing could be proton fluences below 1013 cm2 for GaAs devices doped at
analyzed by considering the total charge that flowed through 1016 cm2 or more [13], which is the approximate doping
the device after irradiation. Figure 13 shows how data for concentration of the light-emitting region in the various LED
three different OD880 devices that were annealed under structures in this study. Thus, lifetime damage is expected to
different current conditions compared from the standpoint of be the dominant mechanism, at least within the range of
total charge. The recovery appears to be logarithmic with radiation levels considered here.
time, and begins to saturate for the device that was annealed Although optical output power is the most fundamental
with the largest current. parameter for light-emitting diodes, forward voltage
characteristics provide a way to evaluate the diode
Light Output (Normalized to Initial Value)
0.3
characteristics in a more fundamental way. Zhao, et al. have
OD880 LED used I-V characteristics to study radiation degradation in laser
0.25
Irradiated to 8 x 1010 p/cm2
diodes [12], and Lindquist used I-V characteristics to study
aging effects in diffused LEDs [9].
0.2 50 MeV Protons 10 mA
Basic junction theory predicts that the forward
50 mA characteristics of the LED can be described by the equation
0.15
6
Published in IEEE Transactions on Nuclear Science,46(6), 1781 (1999)
the second term (corresponding to diffusion current) begins to We also measured the wavelength of these devices before
contribute, and the slope increases. The change in slope and after irradiation. Neither the peak wavelength nor the
corresponds nearly exactly to the threshold for small light spectral width was significantly affected by proton damage.
output of the LED. That relationship appears to hold for all of Thus, the main parameters that are affected are the light output
the diffused LEDs that were examined in the present study. at moderate to high injection and the forward voltage
For example, a typical OD880 device has an initial slope of characteristics.
87 mV/decade with a nearly ideal transition to a slope of 110 A number of factors contribute to the differences in
mV/decade at the threshold. At radiation levels up to about 1 sensitivity of different types of LEDs. Amphoterically doped
x 1011 p/cm2, the slope in both regions is essentially constant. LEDs in the wavelength range of 870-930 nm have very high
The threshold current is also unchanged. The main effect of efficiency, and can be produced at low cost. However, the
the radiation is to decrease the light output, although the processing used to produce those devices results in extended
forward I-V characteristics also shift slightly. transition regions between the n- and p-regions. They require
The heterojunction devices behaved quite differently. long lifetimes because of the extent of the physical structure
Typical heterojunction structures did not exhibit a clear [3-5]. This is also evident from the slow response time in their
transition region between the recombination-dominated and specifications (see Table 1).
diffusion-dominated regions. The slope changed gradually The diffused devices from Hewlett-Packard and the
over several decades of current, and it was generally not double-heterojunction devices from both manufacturers have
possible to identify the threshold region for light output from much shorter response times. Ikeda, et al. have reported an
the forward voltage characteristics alone. Furthermore, there inverse correlation between the doping concentration in the
were significant differences between different devices of the active layer and cutoff frequency in DH LEDs, as well as a
same type. In some cases the current-voltage characteristics dependence on active layer thickness [15]. Thus, high
exhibited a nonlinear region well below the threshold current. operating frequencies require high doping concentrations in
Figure 14 shows an example for the Optodiode OD880 where the active layer along with narrow thicknesses. This reduces
nonlinear I-V characteristics were present before irradiation. the dependence of LED operation on minority carrier lifetime,
For some of the devices this nonlinear region changed although it also reduces efficiency. The OPF320 devices have
markedly after irradiation. The effect on the device was to a response time of only 6 ns, and exhibited very slight
shift the threshold region to very high operating currents (see degradation in light output even at a fluence of 3 x 1011 p/cm2.
Figure 7). That behavior was only observed for a small These more advanced structures are less affected by radiation
number of the double-heterojunction devices, but is potentially than the best devices in earlier radiation studies [3-5]. Our
quite important because it could cause failures in space at experimental results suggest that for this class of devices
relatively low radiation levels. Similar changes in I-V degradation in I-V characteristics due to nonradiative
characteristics have been observed in reliability studies of DH recombination is likely to be a more important failure mode
LEDs by Wittpahl, et al. that appeared to correlate with device than degradation of optical power. Additional work needs to
sensitivity to current stress [14]. This suggests that I-V be done on high-speed LEDs to verify that this conclusion is
measurements should be included in parametric evaluations of valid for a broader range of device types.
LED degradation. However, the underlying mechanism for
the nonlinear I-V behavior is not understood, and warrants
further study.
VII. RECOMMENDATIONS FOR HARDNESS
ASSURANCE
1x100
The variability in the radiation response of LEDs is made
Optodiode OD800
even more important by their extreme sensitivity at very low
820 nm proton fluence levels. As shown in Section IV, some
1x10-2
amphoterically doped LEDs are degraded by more than a
Forward Current (A)
7
Published in IEEE Transactions on Nuclear Science,46(6), 1781 (1999)
Table 2. Annual Proton Fluences for Two Earth-Orbiting Systems relatively small -- approximately a factor of two after the light
output degraded by more than a factor of ten. Although
lifetime degrades, the differences in initial lifetime between
Annual 50 MeV
different samples of the same part are relatively slight. This
Altitude Inclination Equivalent Fluence
makes it difficult to use such measurements for hardness
Mission (km) (deg.) (p/cm2)
assurance at the moderate radiation levels where amphoteric
LEDs are severely damaged. Nevertheless, lifetime damage
Topex-Posiedon 1334 66 1.3 x 1010
remains a useful way to characterize damage at very high
radiation levels.
EOS 705 98 5.5 x 109
8
Published in IEEE Transactions on Nuclear Science,46(6), 1781 (1999)