Scribd
Upload
86 views8 pages

Reflow Xbox 360 Guide with Heat Gun

This document provides instructions for reflowing an Xbox 360 motherboard using a heat gun. It involves cutting foil to make heat shields for the CPU and GPU chips, applying liquid flux around the edges of the chips, and then carefully heating each chip area for 20 seconds using a heat gun from 1-2 inches away to re-flow the solder joints. Special care must be taken not to move the board for 15 minutes after heating to avoid short circuits from the newly melted solder. The same process is then repeated for additional problem solder joints between other chips.

Uploaded by

russelloakey
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
86 views8 pages

Reflow Xbox 360 Guide with Heat Gun

This document provides instructions for reflowing an Xbox 360 motherboard using a heat gun. It involves cutting foil to make heat shields for the CPU and GPU chips, applying liquid flux around the edges of the chips, and then carefully heating each chip area for 20 seconds using a heat gun from 1-2 inches away to re-flow the solder joints. Special care must be taken not to move the board for 15 minutes after heating to avoid short circuits from the newly melted solder. The same process is then repeated for additional problem solder joints between other chips.

Uploaded by

russelloakey
Copyright
© Attribution Non-Commercial (BY-NC)
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

Reflow xbox 360 using heat gun.

You will need: 60cm x 30cm foil Scissors Pencil Ruler No clean liquid flux Heat gun *Dont breath fumes from liquid flux* *do in well ventilated area*

Clean off the chips using alco wipes.

Cut foil 60cm long and fold in half, shiny side out. Mark, with pencil, a cross going from corner to corner to find the center. In the centre mark a square.... 35mm x 35mm for the cpu 45mm x 45mm for the gpu

Punch a hole in the middle with the pencil. Cut along the cross marks to make 4 triangular flaps.

Fold them out to make a square hole.

Thricky part... Place your new heat shield over the processor. Flatten it to the board and find the 4 holes and push the foil into them to make 4 indentations where the holes are. Use your pencil again to make 4 holes in the indentations...

Put 4 screws back through, the opposite way they should go so the heads are foil side. On the other side put 2 washers on each screw and put the aluminium heat sink on. The washers are to space the heatsynk off the components on the underside of the board The heatsynk is to help hold your heatshield in place. You dont want to melt the capacitors.

Next you need to apply the liquid flux...

Hold the board vertical and apply a small amount of liquid flux to the top edge of the processor, between the processor board and the main board until it starts to come out of the bottom edge. Turn the board 90 degrees and do the same. Do this for all 4 edges.

It it critical in this next bit that the board isnt moved or knocked during or for 15 mins after heating. The solder under the chip will be liquid and movement will definitely cause a short.

You need to find a level, heat resistant serface like tiles or a wooden board. Place the xbox board on this surface chip side up. Pull your shield away from any capacitors slightly. If your heat gun has 2 heat settings..... Use the lower setting, hover the heat gun 1-2 inches away from processor and turn on. Keep the heat gun moving in circular movements, i go corner to corner of the chip. Count to 20 and turn off heat gun. Leave 15 mins before removing shield and moving onto the next chip. If your heat gun has only 1 setting... The process is the same as above but you gun is too hot.

You need to do the same but in 4 x 5second bursts with 5 second gaps.

Do the same on the other chip.

Finally one more place. On the underside of the main board between the gpu (larger chip) and the hana or ana chip are a lot of tracks that go to a load of solder joints. These break down. Apply a few drops of flux to these solder joints and apply heat, the same distance, time and way as before. No need for heat shield.

Thats it.

You might also like