Dell PowerEdge R760

Technical Guide

Regulatory Model: E82S Series

Regulatory Type: E82S001
June 2025
Rev. A03
Notes, cautions, and warnings

NOTE: A NOTE indicates important information that helps you make better use of your product.

CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.

WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

Copyright © 2025 Dell Inc. All Rights Reserved. Dell Technologies, Dell, and other trademarks are trademarks of Dell Inc. or its subsidiaries.
Other trademarks may be trademarks of their respective owners.
 Contents

Chapter 1: System overview.......................................................................................................... 5

Key workloads...................................................................................................................................................................... 5
New technologies................................................................................................................................................................ 5

Chapter 2: System features and generational comparison............................................................. 7

Chapter 3: Chassis views and features.........................................................................................10

Front view of the system.................................................................................................................................................10
Rear view of the system................................................................................................................................................... 11
Inside the system............................................................................................................................................................... 13

Chapter 4: Processor................................................................................................................... 16
Processor features ........................................................................................................................................................... 16
Supported processors................................................................................................................................................. 16

Chapter 5: Memory subsystem.................................................................................................... 19

Supported memory............................................................................................................................................................ 19

Chapter 6: Storage......................................................................................................................20
Storage controllers........................................................................................................................................................... 20
Supported Drives............................................................................................................................................................... 21
Internal storage configuration.........................................................................................................................................21
External Storage................................................................................................................................................................ 22

Chapter 7: Networking................................................................................................................ 23
Overview............................................................................................................................................................................. 23
OCP 3.0 support................................................................................................................................................................23
Supported OCP cards................................................................................................................................................ 23
OCP NIC 3.0 vs. rack Network Daughter Card comparisons........................................................................... 24

Chapter 8: PCIe subsystem......................................................................................................... 25

PCIe risers...........................................................................................................................................................................25

Chapter 9: Power, thermal, and acoustics................................................................................... 35

Power................................................................................................................................................................................... 35
Power Supply Units.....................................................................................................................................................36
Thermal................................................................................................................................................................................ 38
Thermal design............................................................................................................................................................. 38
Acoustics............................................................................................................................................................................. 39
Acoustical configurations of R760 ......................................................................................................................... 39

Chapter 10: Rack, rails, and cable management........................................................................... 42

Rails and cable management information....................................................................................................................42

Contents 3
 Chapter 11: Operating Systems and Virtualization........................................................................ 51
Supported Operating Systems........................................................................................................................................51

Chapter 12: Dell Systems Management........................................................................................ 52

Integrated Dell Remote Access Controller (iDRAC)................................................................................................. 52
Systems Management software support matrix....................................................................................................... 53

Chapter 13: Appendix D: Service and support.............................................................................. 55

Why attach service contracts........................................................................................................................................55
ProSupport Infrastructure Suite .................................................................................................................................. 55
Specialty Support Services............................................................................................................................................. 57
ProDeploy Infrastructure Suite...................................................................................................................................... 58
Supplemental Deployment Services ............................................................................................................................. 61
Unique Deployment Scenarios....................................................................................................................................... 62
DAY 2 – Automation Services with Ansible................................................................................................................ 62
Dell Technologies Consulting Services.........................................................................................................................63

Chapter 14: Appendix A: Additional specifications....................................................................... 65

Chassis dimension............................................................................................................................................................. 65
Chassis weight................................................................................................................................................................... 66
NIC port specifications.................................................................................................................................................... 66
Video specifications..........................................................................................................................................................66
USB Ports............................................................................................................................................................................67
PSU rating...........................................................................................................................................................................68
Environmental specifications..........................................................................................................................................69
Thermal restriction matrix.......................................................................................................................................... 71
Thermal air restrictions.............................................................................................................................................. 87

Chapter 15: Appendix B. Standards compliance........................................................................... 89

Chapter 16: Appendix C Additional resources...............................................................................90

Appendix A: Dell PowerEdge R760 NEBS level 3........................................................................... 91

4 Contents
 1
System overview
The Dell PowerEdge R760 is Dell’s latest two-socket, rack server that is designed to run complex workloads using highly scalable
memory, I/O, and network options.
The system features:
● Up to 2 x 4 th Gen Intel® Xeon® Scalable or Intel® Xeon® Max Processors with up to 56 cores
● Up to 2 x 5 th Gen Intel® Xeon® Scalable Processors with up to 64 cores
● Optional Direct Liquid Cooling for required CPU SKU and/or configurations
● 32 DDR5 DIMM slots
● Two redundant AC or DC power supply units
● Up to 12 x 3.5-inch SAS/SATA, or 24 x 2.5-inch, 16 x 2.5-inch, 8 x 2.5-inch, or 2 x 2.5-inch (rear), 4 x 2.5-inch (rear), 4 x
EDSFF E3.S (rear) SAS, SATA, or NVMe (HDD/SSD) drives
● Up to 16 x EDSFF E3.S Gen5 NVMe (SSD) drives
● PCI Express® (PCIe) 5.0 enabled expansion slots
● Network interface technologies to cover Network Interface Card (NIC)
Topics:
• Key workloads
• New technologies

Key workloads
The Dell PowerEdge R760 offers powerful performance in a purpose-built, cyber resilient, mainstream server. Ideal for:
● Mixed Workload Standardization
● Database and Analytics
● Virtual Desktop Infrastructure
● Artificial Intelligence and Machine Learning

New technologies
Table 1. New technologies
Technology Detailed Description
5 th Gen Intel® Xeon® Scalable Processors Core count: Up to 64 core processor
UPI speed: Up to 4 links per CPU, speed: 12.8 GT/s, 14.4
GT/s, 16 GT/s, 20 GT/s
Maximum number of PCIe lanes per CPU: Integrated 80 PCIe
5.0 lanes @ 32 GT PCIe Gen5
Maximum TDP: 350 W
5600 MT/s DDR5 Memory Max 16 DIMMs per processor and 32 DIMMs per system
Supports DDR5 ECC RDIMM
4 th Gen Intel® Xeon® Scalable or Intel® Xeon® Max Core count: Up to 56 core processor
Processors
UPI speed: Up to 4 links per CPU, speed: 12.8 GT/s, 14.4
GT/s, 16 GT/s
Maximum number of PCIe lanes per CPU: Integrated 80 PCIe
5.0 lanes @ 32 GT PCIe Gen5

System overview 5
Table 1. New technologies (continued)
Technology Detailed Description
Maximum TDP: 350 W
4800 MT/s DDR5 Memory Max 16 DIMMs per processor and 32 DIMMs per system
Supports DDR5 ECC RDIMM
Flex I/O Optional LOM board, 2x1Gb with BCM5720 LAN controller
Rear I/O with:
● 1x Dedicated iDRAC Ethernet port
● 1 x USB 3.0
● 1 x USB 2.0
● 1 x VGA port (optional for Direct Liquid Cooling
configuration)
Serial Port Option with STD RIO board
Optional OCP Mezz 3.0 (supported by x8 PCIe lanes)
Front I/O with:
● 1 x USB 2.0
● 1x iDRAC Direct (Micro-AB USB) port
● 1 x VGA port
CPLD 1-wire Support payload data of Front PERC, Riser, BP, and Rear IO
to BOSS-N1 and iDRAC
Dedicated PERC Front Storage module PERC with Front PERC11 & PERC12
Software RAID OS RAID/S160
Power Supplies 60 mm dimension is the new PSU form factor on a 15G design
Titanium 700 W mixed mode HLAC
Platinum 800 W mixed mode
Titanium 1100 W mixed mode
Platinum 1400 W mixed mode
Titanium 1400 W mixed mode 277 Vac and HVDC
1100 W -48 V DC
Titanium 1800 W mixed mode HLAC
86 mm dimension PSU
Platinum 2400 W mixed mode
Titanium 2800 W mixed mode HLAC
Titanium 3200 W mixed mode 277 Vac and HVDC

6 System overview
 2
System features and generational
comparison
The following table shows the comparison between the PowerEdge R760 with the PowerEdge R750.

Table 2. Features comparison

Features PowerEdge R760 PowerEdge R750
Processors ● 2x 4 thGen Intel® Xeon® Scalable or 2 x 3 rd Generation Intel® Xeon® Processor Scalable
Intel® Xeon® Max Processors Family
● 2 x 5 th Gen Intel® Xeon® Scalable
Processors
CPU interconnect Intel Ultra Path Interconnect (UPI) Intel Ultra Path Interconnect (UPI)
Memory ● 32 x DDR5 RDIMM ● 32 x DDR4 RDIMM, LRDIMM
● Up to 4800 MT/s (1 DPC) / 4400 MT/s (2 ● 16 x PMem ( Intel Optane Persistent Memory 200
DPC) Series)
● Up to 5600 MT/s (1DPC) / 4400 MT/s (2
DPC) *
Storage Controllers ● PERC 11G: H755, H755N, H355 ● PERC 10G: H345, H745, H840
● PERC 12G: H965i, H965e ● PERC 11G: H755, H755N, H355
● HBA 11: HBA355i, HBA355e ● HBA 11: HBA355i, HBA355e
● HBA 12: HBA465i, ● BOSS-S1 adapter
● BOSS-N1 ● BOSS-S2
● Software RAID: S160 ● Software RAID: S150
Drive Bays Front bays: Front bays:
● 3.5 inches, 2.5 inches - 24 Gb SAS, 6 Gb ● 3.5 inches, 2.5 inches - 12 Gb SAS, 6 Gb SATA
SATA ● 2.5 inches - Gen3/4 NVMe
● 2.5 inches - Gen3/4 NVMe
Rear bay:
● EDSFF E3.S - Gen5 NVMe
● 2.5 inches - 12 Gb SAS, 6 Gb SATA, Gen3/4
Rear bay:
NVMe
● 2.5 inches - 24 Gb SAS, 6 Gb SATA,
Gen3/4 NVMe
● EDSFF E3.S - Gen5 NVMe
Power Supplies ● AC (Platinum): 800 W, 1400 W, 2400 W ● AC (Platinum): 800 W, 1400 W, 2400 W
● AC (Titanium): 700 W, 1100 W, 1400 W, ● AC (Titanium): 700 W, 1100 W
1800 W, 2800 W, 3200 W ● LVDC @-48 VDC Input: 1100 W
● LVDC @-48 VDC Input: 1100 W
Cooling Options ● Air Cooling ● Air Cooling
● Optional Direct Liquid Cooling (DLC) ● Optional Direct Liquid Cooling (DLC)

NOTE: DLC is a rack solution and requires NOTE: DLC is a rack solution and requires rack
rack manifolds and a cooling distribution manifolds and a cooling distribution unit (CDU) to
unit (CDU) to operate. operate.

Fans Standard (STD) fans /High performance Silver Standard (STD) fans /High performance Silver (HPR
(HPR Silver) fans/ High performance Gold Silver) fans/ High performance Gold (HPR Gold)
(HPR Gold) fans fans
Up to six hot swap fans Up to six hot swap fans

System features and generational comparison 7

Table 2. Features comparison (continued)
Features PowerEdge R760 PowerEdge R750
Dimension Height: 86.8 mm (3.41 inches) Height: 86.8 mm (3.41 inches)
Width: 482 mm (18.97 inches) Width: 482 mm (18.97 inches)
Depth: 772.13 mm (30.39 inches) with bezel Depth: 772.13 mm (30.39 inches) with bezel
758.29 mm (29.85 inches) without bezel 758.29 mm (29.85 inches) without bezel
Form Factor 2U rack server 2U rack server
Embedded ● iDRAC9 ● iDRAC9
Management ● iDRAC Direct ● iDRAC Direct
● iDRAC RESTful API with Redfish ● iDRAC Service Module
● iDRAC Service Module ● Quick Sync 2 wireless module
● Quick Sync 2 wireless module
Bezel Optional LCD bezel or security bezel Optional LCD bezel or security bezel
OpenManage ● OpenManage Enterprise ● OpenManage Enterprise
Software ● OpenManage Power Manager plugin ● OpenManage Power Manager plugin
● OpenManage Service plugin ● OpenManage SupportAssist plugin
● OpenManage Update Manager plugin ● OpenManage Update Manager plugin
● CloudIQ for PowerEdge plug in
● OpenManage Enterprise Integration for
VMware vCenter
● OpenManage Integration for Microsoft
System Center
● OpenManage Integration with Windows
Admin Center
Mobility OpenManage Mobile OpenManage Mobile
Integrations ● BMC Truesight ● BMC TrueSight
● Microsoft System Center ● Microsoft System Center
● OpenManage Integration with ServiceNow ● Red Hat Ansible Modules
● Red Hat Ansible Modules ● VMware vCenter
● Terraform Providers
● VMware vCenter and vRealize Operations
Manager
Connections ● IBM Tivoli Netcool/OMNIbus ● IBM Tivoli Netcool/OMNIbus
● IBM Tivoli Network Manager IP Edition ● IBM Tivoli Network Manager IP Edition
● Micro Focus Operations Manager ● Micro Focus Operations Manager
● Nagios Core ● Nagios Core
● Nagios XI ● Nagios XI
Security ● Cryptographically signed firmware ● Cryptographically signed firmware
● Data at Rest Encryption (SEDs with local or ● Secure Boot
external key mgmt) ● Secure Erase
● Secure Boot ● Silicon Root of Trust
● Secured Component Verification (Hardware ● System Lockdown (requires iDRAC9 Enterprise or
integrity check) Datacenter)
● Secure Erase ● TPM 1.2/2.0 FIPS, CC-TCG certified, TPM 2.0
● Silicon Root of Trust China NationZ
● System Lockdown (requires iDRAC9
Enterprise or Datacenter)
● TPM 2.0 FIPS, CC-TCG certified, TPM 2.0
China NationZ
Embedded NIC 2 x 1 GbE LOM (optional) 2 x 1 GbE LOM
Networking Options OCP x16 (optional) Mezz 3.0 OCP x8 Mezz 3.0

8 System features and generational comparison

Table 2. Features comparison (continued)
Features PowerEdge R760 PowerEdge R750

NOTE: The system allows either LOM card

or an OCP card or both to be installed in
the system.

GPU Options Up to two double wide 350 W, or six single Up to two double wide 300 W, or six single wide 75
wide 75 W accelerators W accelerators
Ports Front Ports Rear Ports Front Ports Rear Ports
● 1 x USB 2.0 ● 1 x USB 2.0 ● 1 x USB 2.0 ● 1 x USB 2.0
● 1 x VGA ● 1 x Dedicated ● 1 x VGA ● 1 x Dedicated iDRAC
● 1 x iDRAC Direct iDRAC Ethernet ● 1 x iDRAC Direct Ethernet port
(Micro-AB USB) port (Micro-AB USB) ● 1 x USB 3.0
port ● 1 x USB 3.0 port ● 1 x Serial port (optional)
● 1 x Serial port ● 1 x VGA (optional for
(optional) Direct Liquid Cooling
● 1 x VGA configuration)
(optional for Direct
Liquid Cooling
configuration)
Internal Port: 1 x USB 3.0 (optional) Internal Port: 1 x USB 3.0 (optional)
PCIe Up to 8 x PCIe Gen4 or up to 4 x PCIe Gen5 UP to 8 x PCIe Gen4 slots
slots
Operating System and ● Canonical Ubuntu Server LTS ● Canonical Ubuntu Server LTS
Hypervisors ● Microsoft Windows Server with Hyper-V ● Citrix Hypervisor
● Red Hat Enterprise Linux ● Windows Server LTSC with Hyper-V
● SUSE Linux Enterprise Server ● Red Hat Enterprise Linux
● VMware ESXi ● SUSE Linux Enterprise Server
For specifications and interoperability details, ● VMware ESXi
see Dell Enterprise Operating Systems on For specifications and interoperability details, see
Servers, Storage, and Networking page at Dell Enterprise Operating Systems on Servers,
[Link]/OSsupport. Storage, and Networking page at [Link]/
OSsupport.

NOTE: * Applicable for 5 th Gen Intel® Xeon® Scalable Processors.

System features and generational comparison 9

 3
Chassis views and features
Topics:
• Front view of the system
• Rear view of the system
• Inside the system

Front view of the system

Figure 1. Front view of 24 x 2.5-inch drive system

Figure 2. Front view of 16 x 2.5-inch drive system (Smart Flow)

Figure 3. Front view of 8 x 2.5-inch drive system

Figure 4. Front view of 12 x 3.5-inch drive system

10 Chassis views and features

Figure 5. Front view of 16 x EDSFF E3.S Gen5 NVMe drive system

Figure 6. Front view of 16 x EDSFF E3.S Gen5 NVMe Raid drive system

Rear view of the system

Figure 7. Rear view of the system

Figure 8. Rear view of the system with optional liquid cooling

Figure 9. Rear view of the system with 2 x 2.5-inch rear drive module

Chassis views and features 11

Figure 10. Rear view of the system with 4 x 2.5-inch rear drive module

Figure 11. Rear view of the system with 4 x EDSFF E3.S rear drive module

12 Chassis views and features

Inside the system

Figure 12. Inside the system

Chassis views and features 13

Figure 13. Inside the system with full length risers and GPU shroud

14 Chassis views and features

Figure 14. Inside the system with processor liquid cooling module

NOTE: Air shroud is hidden in the above image to show the processor liquid cooling configuration.

Chassis views and features 15

 4
Processor
Topics:
• Processor features

Processor features
The 4 th Generation Intel ® Xeon ® Processors stack is the next generation data center processor offering with significant
performance increases, integrated acceleration, and next generation memory and I/O. Sapphire Rapids accelerate customer
usages with unique workload optimizations.
The following lists the features and functions that are in the 4 th Generation Intel ® Xeon ® Scalable Processor offering:
● Faster UPI with up to four Intel Ultra Path Interconnect (Intel UPI) at up to 16 GT/s, increasing multisocket bandwidth
● More, faster I/O with PCI Express 5 and up to 80 lanes (per socket)
● Enhanced Memory Performance with DDR5 support and memory speed up to 4800 MT/s in one DIMM per channel (1DPC)
and 4400 MT/s in two DIMM per channel (2DPC)
● New built-in accelerators for data analytics, networking, storage, crypto, and data compression
● New Xeon Max processor with integrated 64 GB High Bandwidth Memory (HBM) to increase performance in memory-bound
applications

Xeon Max processor modes

1. Xeon Max only mode: Provides best performance when workloads fit into 1 GB/core of capacity and no software changes or
DDR required.
2. Flat mode: DDR can be added for workloads needing capacity >1 GB/core with Xeon Max processor and DDR exposed as
separate regions and software updates that are needed to optimize performance (higher performance than cache mode).
3. Cache mode: Provides improved performance when workloads need >1 GB/core of capacity with no change to software
required and Xeon Max processor caches DDR (symmetric DDR population required).
The 5 th Generation Intel ® Xeon ® Scalable Processor stack is the next generation data center processor offering improved
performance, standard increased memory speeds, expanded UPI speeds and enhanced security.
The following lists the features and functions that are in the 5 th Generation Intel ® Xeon ® Scalable Processor offering:
● Increased core counts with up to 64 cores
● Enhanced memory performance with DDR5 and memory speed up to 5600 MT/s in one DIMM per channel (1DPC) and up to
4400 MT/s in two DIMM per channel (2DPC), 24 Gb and 16 Gb DRAM
● Faster UPI with up to four Intel Ultra Path Interconnect (Intel ® UPI) at up to 20 GT/s, increasing multi-socket bandwidth
● Enhanced security for virtualized environments with Intel Trust Domain Extensions (Intel ® TDX) for confidential computing

Supported processors
The following table shows the Intel Sapphire Rapids (4 th Gen Intel® Xeon® Scalable or Intel® Xeon® Max Processors) and Intel
Emerald Rapids (5 th Gen Intel® Xeon® Scalable Processors) SKUs that are supported on the R760.

Table 3. 4th Gen Intel® Xeon® Scalable or Intel® Xeon® Max Processors supported in R760
Processor Clock Cache UPI Cores Threads Turbo Memory Memory TDP
Speed (M) (GT/s) Speed Capacity
(GHz) (MT/s)
9480 1 1.9 113 16 56 112 Turbo 4800 64 GB 350 W

16 Processor
Table 3. 4th Gen Intel® Xeon® Scalable or Intel® Xeon® Max Processors supported in R760 (continued)
Processor Clock Cache UPI Cores Threads Turbo Memory Memory TDP
Speed (M) (GT/s) Speed Capacity
(GHz) (MT/s)
9470 1 2 105 16 52 104 Turbo 4800 64 GB 350 W
9460 1 2.2 98 16 40 80 Turbo 4800 64 GB 350 W
9462 1 2.7 75 16 32 64 Turbo 4800 64 GB 350 W
8480+ 1 2 105 16 56 112 Turbo 4800 4 TB 350 W
8471N 1 1.8 98 16 52 104 Turbo 4800 4 TB 300 W
8470Q 1 2.1 105 16 52 104 Turbo 4800 4 TB 350 W
8470N 1 1.7 98 16 52 104 Turbo 4800 4 TB 300 W
8470 1 2 105 16 52 104 Turbo 4800 4 TB 350 W
8468 1 2.1 105 16 48 96 Turbo 4800 4 TB 350 W
8460Y+ 1 2 105 16 40 80 Turbo 4800 4 TB 300 W
8452Y 1 2 68 16 36 72 Turbo 4800 4 TB 300 W
6454S 1 2.2 60 16 32 64 Turbo 4800 4 TB 270 W
6430 1 2.1 60 16 32 64 Turbo 4800 4 TB 270 W
6414U 1 2 60 16 32 64 Turbo 4800 4 TB 250 W
8462Y+ 1 2.8 60 16 32 64 Turbo 4800 4 TB 300 W
6458Q 1 3.1 60 16 32 64 Turbo 4800 4 TB 350 W
6448Y 2 2.2 60 16 32 64 Turbo 4800 4 TB 225 W
6444Y 1 3.5 45 16 16 32 Turbo 4800 4 TB 270 W
6442Y 2 2.6 60 16 24 48 Turbo 4800 4 TB 225 W
6438Y+ 2 2 60 16 32 64 Turbo 4800 4 TB 205 W
6438N 2 2 60 16 32 64 Turbo 4800 4 TB 205 W
6438M 2 2.2 60 16 32 64 Turbo 4800 4 TB 205 W
6434 2 3.7 23 16 8 16 Turbo 4800 4 TB 205 W
6428N 2 1.8 60 16 32 64 Turbo 4800 4 TB 185 W
6426Y 2 2.6 38 16 16 32 Turbo 4800 4 TB 185 W
6421N 2 1.8 60 16 32 64 Turbo 4800 4 TB 185 W
5420+ 2 2 53 16 28 56 Turbo 4400 4 TB 205 W
5418Y 2 2 45 16 24 48 Turbo 4400 4 TB 185 W
5418N 2 1.8 45 16 24 48 Turbo 4400 4 TB 165 W
5416S 2 2 30 16 16 32 Turbo 4400 4 TB 150 W
5415+ 2 2.9 23 16 8 16 Turbo 4400 4 TB 150 W
5412U 2 2.1 45 16 24 48 Turbo 4400 4 TB 185 W
5411N 2 1.9 45 16 24 48 Turbo 4400 4 TB 165 W
4416+ 2 2 38 16 20 40 Turbo 4000 4 TB 165 W
4410Y 2 2 30 16 12 24 Turbo 4000 4 TB 150 W
3408U 2 1.8 23 16 8 16 No Turbo 4000 4 TB 125 W

Processor 17
 NOTE: 9480, 9470, 8470Q and 6458Q are supported only in liquid cooling configuration.

Table 4. 5th Gen Intel® Xeon® Scalable Processors supported in R760

Processor Clock Cache UPI Cores Threads Turbo Memory Memory TDP
Speed (M) (GT/s) Speed Capacity
(GHz) (MT/s)
8592+ 1 1.9 320 20 64 128 Turbo 5600 4 TB 350 W
8580 1 2.0 300 20 60 120 Turbo 5600 4 TB 350 W
8568Y+ 1 2.3 300 20 48 96 Turbo 5600 4 TB 350 W
8562Y+ 1 2.8 60 20 32 64 Turbo 5600 4 TB 300 W
8558U 1 2.0 260 N/A 48 96 Turbo 4800 4 TB 300 W
6548N 1 2.8 60 20 32 64 Turbo 5200 4 TB 250 W
6548Y+ 1 2.5 60 20 32 64 Turbo 5200 4 TB 250 W
6542Y 1 2.9 60 20 24 48 Turbo 5200 4 TB 250 W
6534 2 3.9 22.5 20 8 16 Turbo 4800 4 TB 195 W
6526Y 2 2.8 37.5 20 16 32 Turbo 5200 4 TB 195 W
5512U 2 2.1 52.5 N/A 28 56 Turbo 4800 4 TB 185 W
4514Y 2 2.0 30 16 16 32 Turbo 4400 4 TB 150 W
4510 2 2.4 30 16 12 24 Turbo 4400 4 TB 150 W
4509Y 2 2.6 23 16 8 16 Turbo 4400 4 TB 125 W

NOTE: The platform supports Maximum (MAX) and Mainstream (MS) system boards.
● 1 supports MAX system board
● 2 supports MS system board
For more information, see System board jumpers and connectors section.

18 Processor
 5
Memory subsystem
Topics:
• Supported memory

Supported memory
Table 5. Memory technology comparison
Feature PowerEdge R760 (DDR5)
DIMM type RDIMM
Transfer speed 4800 MT/s (1DPC), 4400 MT/s (2DPC)
5600 MT/s (1DPC), 4400 MT/s (2DPC)*
Voltage 1.1 V

NOTE: *Applicable for 5 th Gen Intel® Xeon® Scalable Processors.

Table 6. Supported memory matrix

DIMM type Rank Capacity DIMM rated Operating Speed
voltage and
speed 1 DIMM per 2 DIMMs per
channel (DPC) channel (DPC)
RDIMM 1R 16 GB DDR5 (1.1 V), 4800 4800 MT/s 4400 MT/s
MT/s
2R 32 GB, 64 GB DDR5 (1.1 V), 4800 4800 MT/s 4400 MT/s
MT/s
4R 128 GB DDR5 (1.1 V), 4800 4800 MT/s 4400 MT/s
MT/s
8R 256 GB DDR5 (1.1 V), 4800 4800 MT/s 4400 MT/s
MT/s
1R 16 GB DDR5 (1.1 V), 5600 5600 MT/s 4400 MT/s
MT/s
2R 32 GB, 64 GB, 96 DDR5 (1.1 V), 5600 5600 MT/s 4400 MT/s
GB MT/s
4R 128 GB DDR5 (1.1 V), 5600 5600 MT/s 4400 MT/s
MT/s
8R 256 GB* DDR5 (1.1 V), 5600 5600 MT/s 4400 MT/s
MT/s

NOTE: 5600 MT/s RDIMMs are applicable for 5 th Gen Intel® Xeon® Scalable Processors.

NOTE: The processor may reduce the performance of the rated DIMM speed.

NOTE: *256 GB RDIMM with 5 th Gen Intel® Xeon® Scalable Processors will be supported in the future release.

Memory subsystem 19
 6
Storage
Topics:
• Storage controllers
• Supported Drives
• Internal storage configuration
• External Storage

Storage controllers
Dell RAID controller options offer performance improvements, including the fPERC solution. fPERC provides a base RAID HW
controller without consuming a PCIe slot by using a small form factor and high-density connector to the base planar.
16G PERC Controller offerings are a heavy leverage of the 15G PERC family. The Value and Value Performance levels carry
over to 16G from 15G. New to 16G is the Avenger-based Premium Performance tier offering. This high-end offering drives IOPs
performance and enhanced SSD performance.

NOTE: The size of the RAID 1 drives must be less than that of the second RAID container.

Table 7. PERC Series controller offerings

Performance Level Controller and Description
Entry S160
Value H355, HBA355 (internal/external), HBA465 (internal/
external)
Value Performance H755, H755N
Premium Performance H965i, H965e

Avenger 1
Memory: 8GB DDR4 NV cache

72-bit memory 2133 MHz

Low profile form factors

Dual A15 1.2 GHz CPU

X8PCIe 3.0, x8 12Gb SAS

NOTE: PowerEdge does not support Tri-Mode, the mixing of SAS, SATA, and NVMe behind the same controller.

NOTE: For more information about the features of the Dell PowerEdge RAID controllers (PERC), Software RAID
controllers, or BOSS card, and on deploying the cards, see the storage controller documentation at Storage Controller
Manuals.

NOTE: From December 2021, H355 replaces H345 as the entry raid controller. H345 is deprecated in January 2022.

NOTE: HBA465e is available post-RTS.

20 Storage
Supported Drives
The table that is shown below lists the internal drives that are supported in R760.

Table 8. Supported drives

Form Factor Type Speed Rotational Capacities
Speed
2.5 inches vSAS 12 Gb SSD 1.92 TB, 3.84 TB, 960 GB, 7.62 TB
2.5 inches SAS 24 Gb SSD 1.92 TB, 1.6 TB, 800 GB, 3.84 TB, 960 GB, 7.68 TB
2.5 inches SATA 6 Gb SSD 1.92 TB, 480 GB, 960 GB, 3.84 TB
2.5 inches NVMe Gen4 SSD 1.6 TB, 3.2 TB, 6.4 TB, 1.92 TB, 3.84 TB, 15.63 TB, 7.68 TB, 800
GB, 400 GB
2.5 inches DC NVMe Gen4 SSD 3.84 TB, 960 GB
2.5 inches SAS 12 Gb 10 K 600 GB, 1.2 TB, 2.4 TB
EDSFF E3.S NVMe Gen5 SSD 3.84 TB, 7.68 TB
3.5 inches SATA 6 Gb 7.2 K 2 TB, 4 TB, 8 TB, 12 TB, 16 TB, 20 TB
3.5 inches SAS 12 Gb 7.2 K 2 TB, 4 TB, 8 TB, 12 TB, 16 TB, 20 TB

Internal storage configuration

R760 available internal storage configurations:
● Zero drive (no backplane)
● 12 x 3.5" (SAS/SATA)
● 12 x 3.5" (SAS/SATA) w/ rear 2 x 2.5" (SAS/SATA)
● 12 x 3.5" (SAS/SATA) w/ rear 2 x 2.5" NVMe Direct
● 12 x 3.5" (SAS/SATA) + 4 x 2.5" (SAS/SATA)
● 12 x 3.5" (SAS/SATA) + 4 x 2.5" (NVMe Direct)
● 12 x 3.5" (SAS/SATA) + 4 x EDSFF E3.S (Gen5 x 4 NVMe Direct)
● 8 x 2.5" NVMe Direct
● 8 x 2.5" (NVMe RAID)
● 8 x 2.5" Universal (SAS/SATA HWRAID + NVMe Direct)
● 16 x 2.5" (NVMe RAID) Smart Flow
● 16 x 2.5" (NVMe Direct) Smart Flow
● 16 x 2.5" (SAS4/SATA) Smart Flow
● 16 x 2.5"(SAS4/SATA)+ 8 x 2.5" NVMe Direct
● 24 x 2.5" (SAS4/SATA) with 8 x Universal slots (SAS/SATA HWRAID + NVMe Direct)
● 24 x 2.5" (SAS4/SATA)
● 24 x 2.5" (SAS4/SATA) + 2 x 2.5" (NVMe Direct)
● 24 x 2.5"(SAS4/SATA) + 2 x 2.5" (SAS/SATA)
● 24 x 2.5"(SAS4/SATA) + 4 x 2.5" (SAS/SATA)
● 24 x 2.5" (SAS4/SATA) + 4 x 2.5" (NVMe Direct)
● 24 x 2.5" (SAS4/SATA) - Dual Controller
● 24 x 2.5" + 2 x 2.5" (SAS4/SATA) - Dual Controller
● 24 x 2.5" (SAS4/SATA) with 8 x Universal slots (SAS/SATA HWRAID + NVMe Direct)
● 24 x 2.5" (SAS4/SATA)
● 24 x 2.5" (SAS4/SATA) - Dual Controller
● 24 x 2.5" (SAS4/SATA) with 4 x Universal slots (SAS/SATA HWRAID + NVMe Direct) + 4 x 2.5" (SAS4/SATA)
● 24 x 2.5 inches (SAS4/SATA) + 4 x EDSFF E3.S (Gen5 x 4 NVMe Direct)
● 16 x 2.5" (8 x SAS4/SATA + 8 x NVMe RAID)

Storage 21
● 16 x EDSFF E3.S (Gen5 x 4 NVMe Direct)
● 16 x EDSFF E3.S (NVMe RAID) - Dual Controller
● 24 x 2.5 inches (NVMe Gen5 switched)
● 24 x 2.5 inches (NVMe RAID - Gen5 Switched) - Dual Controller
● 16 x 2.5" (8 x NVMe RAID + 8 x SAS4/SATA) Smart Flow
● 24 x 2.5" (NVMe Gen4 Direct) Passive
● 8 x 2.5" Universal (SAS/SATA HWRAID + NVMe Direct)
NOTE: The Universal backplane (with universal slot supports SAS/SATA/NVMe drives) supports HW RAID for SAS/SATA
with direct attach NVMe, and does not support HW RAID for NVMe.

External Storage
The R760 supports the external storage device types that are listed in the table below.

Table 9. Support external storage devices

Device Type Description
External Tape Supports connection to external USB tape products
NAS/IDM appliance software Supports NAS software stack
JBOD Supports connection to 12 Gb MD-series JBODs

22 Storage
 7
Networking
Topics:
• Overview
• OCP 3.0 support

Overview
PowerEdge offers a wide variety of options to get information moving to and from our servers. Industry best technologies are
chosen, and systems management features are added by our partners to firmware to tie in with iDRAC. These adapters are
rigorously validated for worry-free, fully supported use in Dell servers.

OCP 3.0 support

Table 10. OCP 3.0 feature list
Feature OCP 3.0
Form factor SFF
PCIe Gen Gen4
Max PCIe width x8, x16 (with OCP cable)
Max number of ports 4
Port type BT/SFP/SFP+/SFP28/QSFP56
Max port speed 25 GbE, 100 GbE (with OCP cable)
NC-SI Yes
SNAPI Yes
WoL Yes
Power consumption 15 W–35 W

Supported OCP cards

Table 11. Supported OCP cards

Form factor Vendor Port type Port speed Port count
OCP 3.0 Broadcom QSFP56 100 GbE 2
Mellanox QSFP56 100 GbE 2
Intel SFP28 25 GbE 4
Broadcom SFP28 25 GbE 4
Intel SFP28 25 GbE 2
Broadcom SFP28 25 GbE 2

Networking 23
Table 11. Supported OCP cards (continued)
Form factor Vendor Port type Port speed Port count
Mellanox SFP28 25 GbE 2
Broadcom BT 10 GbE 4
Intel BT 10 GbE 2
Intel BT 10 GbE 4
Broadcom BT 10 GbE 2
Broadcom BT 1 GbE 4
Intel BT 1 GbE 4

NOTE: A 100 GbE OCP card of PCIe width x16 can be used by connecting the OCP cable from SL11_CPU1_PB7 to
SL13_CPU1_PB7 on the MAX system board.

NOTE: For storage configurations that already use the SL11_CPU1_PB7 or SL13_CPU1_PB7 connector on the Max system
board, there is a restriction on supporting OCP cable.

OCP NIC 3.0 vs. rack Network Daughter Card comparisons

Table 12. OCP 3.0, 2.0, and rNDC NIC comparison
Form Factor Dell rNDC OCP 2.0 (LOM Mezz) OCP 3.0 Notes
PCIe Gen Gen 3 Gen 3 Gen 4 Supported OCP3 is SFF
(small form factor).
Max PCIe Lanes x8 Up to x16 Up to x16 See server slot priority
matrix.
Shared LOM Yes Yes Yes This is iDRAC port
redirect.
Aux Power Yes Yes Yes Used for Shared LOM

24 Networking
 8
PCIe subsystem
Topics:
• PCIe risers

PCIe risers
Shown below are the riser offerings for the platform.

Figure 15. Riser connector location on system board

1. Riser 1 2. Riser 2
3. Riser 3 4. Riser 4

PCIe subsystem 25
Figure 16. Riser 1B
1. Slot 1
2. Slot 2

Figure 17. Riser 1R

1. Slot 1
2. Slot 2

26 PCIe subsystem
Figure 18. Riser 1R FL
1. Slot 1
2. Slot 2

Figure 19. Riser 1P

1. Slot 2

PCIe subsystem 27
Figure 20. Riser 1P FL
1. Slot 2

Figure 21. Riser 1Q

1. Slot 1
2. Slot 2

Figure 22. Riser R1 Paddle

28 PCIe subsystem
Figure 23. Riser 2A
1. Slot 6
2. Slot 3

Figure 24. Riser 3A

1. Slot 5

PCIe subsystem 29
Figure 25. Riser 3A FL
1. Slot 5

Figure 26. Riser 3B

1. Slot 4
2. Slot 5

30 PCIe subsystem
Figure 27. Riser 4P
1. Slot 7

Figure 28. Riser 4P - FL

1. Slot 7

PCIe subsystem 31
Figure 29. Riser 4B
1. Slot 8
2. Slot 7

Figure 30. Riser 4Q

1. Slot 7
2. Slot 8

32 PCIe subsystem
Figure 31. Riser 4R
1. Slot 7
2. Slot 8

Figure 32. Riser R4 Paddle

Table 13. PCIe Riser Configurations

Config No. Riser configuration No. of Processors PERC type supported Rear storage possible
0 NO RSR 2 Front PERC No
1 R1B+R2A+R3B+R4B 2 Front PERC/PERC No
Adapter
2 R1Q+R2A+R3B+R4Q 2 Front PERC/PERC No
Adapter
3-1 R1P+R2A+R3B+R4P 2 Front PERC/PERC No
(HL) Adapter
3-2 R1P+R2A+R3B+R4P 2 Front PERC/PERC No
(FL) Adapter
4-1 R1P+R2A+R3B+R4R 2 Front PERC/PERC No
(HL) Adapter
5-1 R1R+R2A+R3A+R4P 2 Front PERC/PERC No
(HL) Adapter
5-2 R1R+R2A+R3A+R4P 2 Front PERC/PERC No
(FL) Adapter
6 R2A+R4Q 2 Front PERC/PERC Yes
Adapter

PCIe subsystem 33
Table 13. PCIe Riser Configurations (continued)
Config No. Riser configuration No. of Processors PERC type supported Rear storage possible
7 R1Q+R2A+R4Q 2 Front PERC/PERC Yes
Adapter
8 R1B+R2A 1 PERC Adapter No
9 R1Q+R2A+R4R 1 Front PERC No
10-1 R1P+R2A+R4R (HL) 1 Front PERC No
10-2 R1P+R2A+R4R (FL) 1 Front PERC No
11 R1 Paddle + R2A + R3B 2 N/A No
+ R4 Paddle
12 R1Q+R2A+R4Q 2 Front PERC/PERC Yes
Adapter

34 PCIe subsystem
 9
Power, thermal, and acoustics
PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps to regulate
temperature by reducing server noise and power consumption. The table below lists the tools and technologies Dell offers to
lower power consumption and increase energy efficiency.
Topics:
• Power
• Thermal
• Acoustics

Power
Table 14. Power tools and technologies
Feature Description
Power Supply Units(PSU) Dell's PSU portfolio includes intelligent features such as dynamically optimizing efficiency while
portfolio maintaining availability and redundancy. Find additional information in the Power supply units
section.
Tools for right sizing Enterprise Infrastructure Planning Tool (EIPT) is a tool that can help you determine the most
efficient configuration possible. With Dell's EIPT, you can calculate the power consumption of
your hardware, power infrastructure, and storage at a given workload. Learn more at Dell EIPT.
Industry Compliance Dell's servers are compliant with all relevant industry certifications and guide lines, including 80
PLUS, Climate Savers and ENERGY STAR.
Power monitoring accuracy PSU power monitoring improvements include:

● Dell's power monitoring accuracy is currently 1%, whereas the industry standard is 5%
● More accurate reporting of power
● Better performance under a power cap
Power capping Use Dell's systems management to set the power cap limit for your systems to limit the output
of a PSU and reduce system power consumption. Dell is the first hardware vendor to leverage
Intel Node Manager for circuit-breaker fast capping.
Systems Management iDRAC Enterprise and Datacenter provides server-level management that monitors, reports and
controls power consumption at the processor, memory and system level.

Dell OpenManage Power Center delivers group power management at the rack, row, and data
center level for servers, power distribution units, and uninterruptible power supplies.

Active power management Intel Node Manager is an embedded technology that provides individual server-level power
reporting and power limiting functionality. Dell offers a complete power management solution
comprised of Intel Node Manager accessed through Dell iDRAC9 Datacenter and OpenManage
Power Center that allows policy-based management of power and thermal at the individual
server, rack, and data center level. Hot spare reduces power consumption of redundant power
supplies. Thermal control off a speed optimizes the thermal settings for your environment to
reduce fan consumption and lower system power consumption.

Idle power enables Dell servers to run as efficiently when idle as when at full workload.

Rack infrastructure Dell offers some of the industry's highest-efficiency power infrastructure solutions, including:

Power, thermal, and acoustics 35

Table 14. Power tools and technologies (continued)
Feature Description
● Power distribution units (PDUs)
● Uninterruptible power supplies (UPSs)
● Energy Smart containment rack enclosures
Find additional information at: Power and Cooling.

Power Supply Units

Energy Smart power supplies have intelligent features, such as the ability to dynamically optimize efficiency while maintaining
availability and redundancy. Also featured are enhanced power-consumption reduction technologies, such as high-efficiency
power conversion and advanced thermal-management techniques, and embedded power-management features, including high-
accuracy power monitoring. The table below shows the power supply unit options that are available for the R760.

Table 15. PSU specifications

PSU Clas Heat Frequen AC Voltage DC Voltage Current (A)
s dissipat cy (Hz)
ion 200—240 V 100—120 277 V 240 V - (48— 336 V
(maxim V 60) V
um)
(BTU/
hr)
700 W Tita 2625 700 W N/A N/A N/A N/A N/A 4.1
50/60
mixed nium
mode
HLAC N/A 2625 N/A N/A N/A N/A 700 W N/A N/A 3.4

800 W Plati 3000 800 W 800 W N/A N/A N/A N/A 9.2—4.7
50/60
mixed num
mode
N/A 3000 N/A N/A N/A N/A 800 W N/A N/A 3.8
1100 W Tita 4100 1100 W 1050 W N/A N/A N/A N/A 12—6.3
50/60
mixed nium
mode
N/A 4100 N/A N/A N/A N/A 1100 W N/A N/A 5.2
1400 Plati 5250 1400 W 1050 W N/A N/A N/A N/A 12—8
50/60
W num
mixed
mode N/A 5250 N/A N/A N/A N/A 1400 W N/A N/A 6.6

1400 Tita 5250 50/60 N/A N/A 1400 W N/A N/A N/A 5.8
W nium
mixed 5250 N/A N/A N/A N/A N/A 1400 W 5.17
mode
277 N/A
Vac
and
HVDC
1800 Tita 6750 1800 N/A N/A N/A N/A N/A 10
50/60
W nium
mixed
mode N/A 6750 N/A N/A N/A 1800 W N/A N/A 8.2
N/A
HLAC
2400 Plati 9000 2400 W 1400 W N/A N/A N/A N/A 16—13.5
50/60
W num
mixed
mode N/A 9000 N/A N/A N/A N/A 2400 W N/A N/A 11.2

36 Power, thermal, and acoustics

Table 15. PSU specifications (continued)
PSU Clas Heat Frequen AC Voltage DC Voltage Current (A)
s dissipat cy (Hz)
ion 200—240 V 100—120 277 V 240 V - (48— 336 V
(maxim V 60) V
um)
(BTU/
hr)
2800 Tita 10500 2800 W N/A N/A N/A N/A N/A 15.6
50/60
W nium
mixed
mode N/A 10500 N/A N/A N/A 2800 W N/A N/A 13.6
N/A
HLAC
1100 W N/A 4265 N/A N/A N/A 1100 W N/A N/A 27
-48 V N/A
DC
3200 Tita 12000 50/60 N/A N/A 3200 W N/A N/A N/A 13
W nium
mixed 12000 N/A N/A N/A N/A N/A 3200 W 11.5
mode
277 N/A
Vac
and
HVDC

NOTE: If a system with AC 2400 W PSUs operates at low line 100-120 Vac, and then the power rating per PSU is degraded
to 1400 W.

NOTE: If a system with AC 1400 W or 1100 W PSUs operates at low line 100-120 Vac, and then the power rating per PSU is
degraded to 1050 W.

Figure 33. PSU power cables

Figure 34. 277VAC/HVDC power cable

Table 16. PSU power cables

Form factor Output Power cable
Redundant 60 mm 700 W mixed mode HLAC C13
800 W mixed mode C13
1100 W mixed mode C13

Power, thermal, and acoustics 37

Table 16. PSU power cables (continued)
Form factor Output Power cable
1400 W mixed mode C13
1400 W mixed mode 277 Vac 277VAC/HVDC
and HVDC
1800 W mixed mode HLAC C15
Redundant 86 mm 2400 W mixed mode C19
2800 W mixed mode HLAC C21
3200 W mixed mode 277 Vac 277VAC/HVDC
and HVDC

NOTE: C19 power cable combined with C20 to C21 jumper power cable can be used to adapt a 2800 W PSU.

NOTE: C13 power cable combined with C14 to C15 jumper power cable can be used to adapt a 1800 W PSU.

NOTE: The 277VAC/HVDC power cables are not available in the APJ region.

Thermal
PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulate
temperature thereby reducing server noise and power consumption.

Thermal design
Thermal management of the platform helps deliver high performance with the right amount of cooling to components, while
maintaining the lowest fan speeds possible. This is done across a wide range of ambient temperatures from 10°C to 35°C (50°F
to 95°F) and to extended ambient temperature ranges.

Figure 35. Thermal design characteristics

The thermal design of the PowerEdge R760 reflects the following:

● Optimized thermal design: The system layout is architected for optimum thermal design.
● System component placement and layout are designed to provide maximum airflow coverage to critical components with
minimum expense of fan power.

38 Power, thermal, and acoustics

● Comprehensive thermal management: The thermal control system regulates the fan speed based on several different
responses from all system-component temperature sensors, and inventory for system configurations. Temperature
monitoring includes components such as processors, DIMMs, chipset, the inlet air ambient, hard disk drives, and OCP.
● Open and closed loop thermal fan speed control: Open loop thermal control uses system configuration to determine fan
speed based on inlet air ambient temperature. A closed loop thermal control method uses feedback temperatures to
dynamically determine proper fan speeds.
● User-configurable settings: With the understanding and realization that every customer has a unique set of circumstances or
expectations from the system, in this generation of servers, we have introduced limited user- configurable settings residing
in the iDRAC BIOS setup screen. For more information, see the Dell PowerEdge R760 Installation and Service Manual at
PowerEdge Manuals and “Advanced Thermal Control: Optimizing across Environments and Power Goals” on [Link].
● Cooling redundancy: The R760 allows N+1 fan redundancy, allowing continuous operation with one fan failure in the system.
● Environmental Specifications: The optimized thermal management makes the R760 reliable under a wide range of operating
environments.

Acoustics
Acoustical configurations of R760
Dell PowerEdge R760 is a rack or tower server appropriate for attended data center environment. However, lower acoustical
output is attainable with proper hardware or software configurations.

Table 17. Configurations tested for acoustical experience

Configuration Quietest GPU Entry/ Typical-1, 2.5- Typical-2, 3.5- GPU NVMe Box
configuration Quietest inch inch configuration
configuration
CPU TDP 125 W 125 W 165 W 165 W 205 W 300 W
CPU Quantity 2 2 2 2 2 2
RDIMM 16 GB DDR5 16 GB DDR5 16 GB DDR5 32 GB DDR5 32 GB DDR5 16 GB DDR5
Memory
Memory 8 8 16 16 32 32
Quantity
Backplane Type 8 x 2.5-inch BP 12x 3.5-inch BP 8 x 2.5-inch exp 12 x 3.5-inch 16 x 2.5-inch 24 x 2.5-inch exp
BP x2 BP + 2 x 2.5- exp BP BP (NVMe)
inch rear BP
HDD Type X SATA 3.5-inch X 12 x 3.5-inch X X
4 TB front 12 TB, 2 x
2.5-inch rear
SSD
HDD Quantity X 2 X 12 + 2 X X
Flash Drives PCIe SSD X PCIe SSD X PCIe SSD PCIe SSD
Flash Quantity 8 X 8 X 16 24
PSU Type 1400 W 800 W 800 W 1400 W 2400 W 2400 W
PSU Quantity 2 2 2 2 2 2
OCP 2x10 G 2x10 G 10/25 2-port 10/25 2-port 10/25 2-port 2x25 G
PCI 1 X H355 X H755 X X
PCI 2 X X X X GPU X
PCI 3 X X X X X X
PCI 4 X X 2-port 25 Gb 2-port 10 Gb 2-port 25 Gb X
PCI 5 X X 2-port 25 Gb 2-port 10 Gb 2-port 25 Gb 100 Gb PCI

Power, thermal, and acoustics 39

Table 17. Configurations tested for acoustical experience (continued)
Configuration Quietest GPU Entry/ Typical-1, 2.5- Typical-2, 3.5- GPU NVMe Box
configuration Quietest inch inch configuration
configuration
PCI 6 25/50 Gb X X X X X
PCI 7 A30 X X X GPU 100 Gb PCI
PCI 8 X X X X X X
PERC Front H755n Adapt H355 Front H7455n Adapt H755 Front H755n Front H755n

Table 18. Acoustical experience of R760 configurations

Configuration Quietest Entry/ Typical-1, Typical-2, GPU NVMe Box
GPU Quietest 2.5-inch 3.5-inch configuratio
configura configuratio n
tion n
Acoustical Performance: Idle/ Operating @ 25°C Ambient
L wA,m (B) Idle (4) 6.5 5.1 5.5 6.4 6.9 6.8
Operating/ 8.1 5.1 5.5 6.4 8.5 6.8
Customer usage
operating (5)(6)
K (B) Idle (4) 0.4 0.4 0.4 0.4 0.4 0.4
v

Operating/ 0.4 0.4 0.4 0.4 0.4 0.4

Customer usage
operating (5)(6)
L pA,m (dB) Idle (4) 51 36 41 48 55 54
Operating/ 69 36 41 48 74 54
Customer usage
operating (5)(6)
Prominent discrete tones (3) Prominenc No audible tones Prominence Prominence Prominence
e ratio ≤ ratio < 15 dB ratio ≤ 17 dB ratio < 15 dB
17 dB
Acoustical Performance: Idle @ 28°C Ambient
L (1) (B) 7.3 5.4 5.9 6.7 7.3 7.1
wA,m

K v (B) 0.4 0.4 0.4 0.4 0.4 0.4

L (2) (dB) 59 36 45 52 59 57
pA,m

Acoustical Performance: Max. loading @ 35°C Ambient

L (1) (B) 9.0 6.0 7.0 7.8 9.0 7.8
wA,m

K v (B) 0.4 0.4 0.4 0.4 0.4 0.4

L (2) (dB) 79 44 58 66 79 65
pA,m

(1) LwA,m: The declared mean A-weighted sound power level (LwA) is calculated per section 5.2 of ISO 9296 (2017) with data
collected using the methods that are described in ISO 7779 (2010). Engineering data presented here may not be fully compliant
with the ISO 7779 declaration requirement.
(2) LpA,
m: The declared mean A-weighted emission sound pressure level is at the bystander position per section 5.3 of ISO 9296
(2017) and measured using methods that are described in ISO 7779 (2010). The system is placed in a 24U rack enclosure, 25 cm
above a reflective floor. Engineering data presented here may not be fully compliant with the ISO 7779 declaration requirement.
(3) Prominent tones: Criteria of Annex D of ECMA-74 and the Prominence Ratio method of ECMA-418 are followed to determine
if discrete tones are prominent and to report them, if so.
(4) Idle mode: The steady-state condition in which the server is energized but not operating any intended function.

40 Power, thermal, and acoustics

(5) Operating mode: The maximum of the steady state acoustical output at 50% of CPU TDP or active storage drives for the

respective sections of Annex C of ECMA-74.

(6)Customer Usage Operating mode: The operating mode is represented by the maximum of the steady state acoustical output
at 25%~30% of CPU TDP, 2.5%~10% IOPs load, and >80% GPU load as the components showed in the above configurations.

Power, thermal, and acoustics 41

 10
Rack, rails, and cable management
Topics:
• Rails and cable management information

Rails and cable management information

The rail offerings for the PowerEdge R760 consist of two general types: sliding and static. The cable management offerings
consist of an optional cable management arm (CMA) and an optional strain relief bar (SRB).
See the Enterprise Systems Rail Sizing and Rack Compatibility Matrix available at Dell site for information regarding:
● Specific details about rail types.
● Rail adjustability ranges for various rack mounting flange types.
● Rail depth with and without cable management accessories.
● Rack types that are supported for various rack mounting flange types.
Key factors governing proper rail selection include the following:
● Spacing between the front and rear mounting flanges of the rack.
● Type and location of any equipment that is mounted in the back of the rack such as power distribution units (PDUs).
● Overall depth of the rack.

Sliding rails features summary

The sliding rails allow the system to be fully extended out of the rack for service. There are two types of sliding rails available,
ReadyRails II sliding rails and Stab-in/Drop-in sliding rails. The sliding rails are available with or without the optional cable
management arm (CMA) or strain relief bar (SRB).
B21 ReadyRails sliding rails for 4-post racks
● Supports drop-in installation of the chassis to the rails.
● Support for tool-less installation in 19" EIA-310-E compliant square or unthreaded round hole 4-post racks including all
generations of the Dell racks.
● Support for tooled installation in 19" EIA-310-E compliant threaded hole 4-post racks.
● Support full extension of the system out of the rack to allow serviceability of key internal components.
● Support for optional strain relief bar (SRB).
● Support for an optional cable management arm (CMA).

NOTE: For situations where CMA support is not required, the outer CMA mounting brackets can be uninstalled from the
sliding rails. This reduces the overall length of the rails and eliminates the potential interference with rear-mounted PDUs
or the rear rack door.

42 Rack, rails, and cable management

Figure 36. Sliding rails with optional CMA

Figure 37. Sliding rails with optional SRB

B22 Stab-in/Drop-in sliding rails for 4-post racks

● Supports drop-in or stab-in installation of the chassis to the rails.
● Support for tool-less installation in 19" EIA-310-E compliant square, unthreaded round hole racks including all generations of
the Dell racks. Also supports tool-less installation in threaded round hole 4-post racks.
● Support for tool-less installation in Dell Titan or Titan-D racks.
● Support full extension of the system out of the rack to allow serviceability of key internal components.
● Support for an optional cable management arm (CMA).
● Support for optional strain relief bar (SRB).

NOTE: For situations where CMA support is not required, the outer CMA mounting brackets can be uninstalled from the
sliding rails. This reduces the overall length of the rails and eliminates the potential interference with rear-mounted PDUs
or the rear rack door.

Rack, rails, and cable management 43

Scan the QR code for the documentation and trouble-shooting information regarding the installation procedures for Drop-in/
Stab-in rail types.

B20 static rails summary

The static rails offer a greater adjustability range and a smaller overall mounting footprint than the sliding rails because of their
reduced complexity and lack of need for CMA support. The static rails support a wider variety of racks than the sliding rails.
However, they do not support serviceability in the rack and are thus not compatible with the CMA. The static rails are also not
compatible with SRB.

Figure 38. Static rails

Static rails features summary

Static rails for 4-post and 2-post racks:
● Supports Stab-in installation of the chassis to the rails.
● Support tool-less installation in 19" EIA-310-E compliant square or unthreaded round hole 4-post racks including all
generations of Dell racks.
● Support tooled installation in 19" EIA-310-E compliant threaded hole 4-post and 2-post racks.
● Support for tooled installation in Dell Titan or Titan-D rack.
NOTE:
● Screws are not included with the static rail kit since racks are offered with various thread types. The screws are
provided for mounting static rails in racks with threaded mounting flanges.
● Screw head diameter should be 10 mm or less.
2-Post racks installation
If installing to 2-Post (Telco) racks, the ReadyRails II static rails (B20) must be used. Sliding rails support mounting in 4-post
racks only.

44 Rack, rails, and cable management

Figure 39. Static rails in 2-post center mount configuration

Installation in the Dell Titan or Titan-D racks

For tool-less installation in Titan or Titan-D racks, the Stab-in/Drop-in sliding rails (B22) must be used. This rail collapses
down sufficiently to fit in the rack with mounting flanges that are spaced about 24 inches apart from front to back. The
Stab-in/Drop-in sliding rail allows bezels of the servers and storage systems to be aligned when installed in these racks. For
tooled installation, Stab-in Static rails (B20) must be used for bezel alignment with storage systems.

Cable management arm (CMA)

The optional cable management arm (CMA) organizes and secures the cords and cables exiting the back of the systems. It
unfolds to allow the systems to extend out of the rack without having to detach the cables. Some key features of the CMA
include:
● Large U-shaped baskets to support dense cable loads.
● Open vent pattern for optimal airflow.
● Ability to mount on either side by swinging the spring-loaded brackets from one side to the other.
● Utilizes hook-and-loop straps rather than plastic tie wraps to eliminate the risk of cable damage during cycling.
● Includes a low-profile fixed tray to both support and retain the CMA in its fully closed position.
● Both the CMA and the tray mount without the use of tools by simple and intuitive snap-in designs.
NOTE: CMA is not supported in the Direct Liquid Cooling configuration.

The CMA can be mounted to either side of the sliding rails without the use of tools or the need for conversion. For systems
with one power supply unit (PSU), it is recommended to mount on the side opposite to that of the power supply to allow easier
access to it and the rear drives (if applicable) for service or replacement.

Figure 40. Sliding rails with CMA

Rack, rails, and cable management 45

Figure 41. CMA Cabling

Strain Relief Bar (SRB)

The optional strain relief bar (SRB) for the PowerEdge R760 organizes and supports cable connections at the rear end of the
server to avoid damage from bending.

Figure 42. Cabled strain relief bar

● Tool-less attachment to the rails

● Two depth positions to accommodate various cable loads and rack depths
● Supports cable loads and controls stresses on server connectors
● Cables can be segregated into discrete purpose-specific bundles

46 Rack, rails, and cable management

Rack Installation
Drop-in design means that the system is installed vertically into the rails by inserting the standoffs on the sides of the system
into the J-slots in the inner rail members with the rails in the fully extended position. The recommended method of installation
is to first insert the rear standoffs on the system into the rear J-slots on the rails to free up a hand and then rotate the system
down into the remaining J-slots while using the free hand to hold the rail against the side of the system.
Stab-in design means that the inner (chassis) rail members must first be attached to the sides of the system and then inserted
into the outer (cabinet) members installed in the rack.

Installing the system into the rack (option A: Drop-In)

1. Pull the inner rails out of the rack until they lock into place.

Figure 43. Pull out inner rail

2. Locate the rear rail standoff on each side of the system and lower them into the rear J-slots on the slide assemblies.
3. Rotate the system downward until all the rail standoffs are seated in the J-slots.

Figure 44. Rail standoffs seated in J-slots

Rack, rails, and cable management 47

4. Push the system inward until the lock levers click into place.
5. Pull the blue side release lock tabs forward or backward on both rails and slide the system into the rack until the system is in
the rack.

Figure 45. Slide system into the rack

Installing the system into the rack (option B: Stab-In)

1. Pull the intermediate rails out of the rack until they lock into place.
2. Release the inner rail lock by pulling forward on the white tabs and sliding the inner rail out of the intermediate rails.

Figure 46. Pull out the intermediate rail

Table 19. Rail component label

Number Component
1 Intermediate rail

48 Rack, rails, and cable management

 Table 19. Rail component label (continued)
Number Component
2 Inner rail
3. Attach the inner rails to the sides of the system by aligning the J-slots on the rail with the standoffs on the system and
sliding forward on the system until they lock into place.

Figure 47. Attach the inner rails to the system

4. With the intermediate rails extended, install the system into the extended rails.

Figure 48. Install system into the extended rails

5. Pull blue slide release lock tabs forward or backward on both rails, and slide the system into the rack.

Rack, rails, and cable management 49

 Figure 49. Slide system into the rack

50 Rack, rails, and cable management

 11
Operating Systems and Virtualization
Topics:
• Supported Operating Systems

Supported Operating Systems

The PowerEdge system supports the following operating systems:
● Canonical® Ubuntu® Server LTS
● Microsoft® Windows Server® with Hyper-V
● Red Hat® Enterprise Linux
● SUSE® Linux Enterprise server
● VMware® ESXi®
Links to specific OS versions and editions, certification matrices, Hardware Compatibility Lists (HCL) portal, and Hypervisor
support are available at Dell Enterprise Operating Systems.

Operating Systems and Virtualization 51

 12
Dell Systems Management
Dell delivers management solutions that help IT administrators effectively deploy, update, monitor, and manage IT assets. Dell
solutions and tools enable you to quickly respond to problems by helping them to manage Dell servers efficiently; in physical,
virtual, local, and remote environments; all without the need to install an agent in the operating system.
The OpenManage portfolio includes:
● Innovative embedded management tools - integrated Dell Remote Access Controller (iDRAC)
● Consoles - OpenManage Enterprise
● Extensible with plug-ins - OpenManage Power Manager
● Update tools - Repository Manager
Dell has developed comprehensive systems management solutions that are based on open standards and has integrated with
management consoles from partners such as Microsoft and VMware, allowing advanced management of Dell servers. Dell
management capabilities extend to offerings from the industry's top systems management vendors and frameworks such as
Ansible, Splunk, and ServiceNow. OpenManage tools automate the full span of server life cycle management activities along
with powerful RESTful APIs to script or integrate with your choice of frameworks.
For more information about the entire OpenManage portfolio, see:
● The latest Dell Systems Management Overview Guide.
Topics:
• Integrated Dell Remote Access Controller (iDRAC)
• Systems Management software support matrix

Integrated Dell Remote Access Controller (iDRAC)

iDRAC9 delivers advanced, agent-free, local and remote server administration. Embedded in every PowerEdge server, iDRAC9
provides a secure means to automate a multitude of common management tasks. Because iDRAC is embedded within every
PowerEdge server, there is no additional software to install; just plug in power and network cables, and iDRAC is ready to go.
Even before installing an operating system (operating system) or hypervisor, IT administrators have a complete set of server
management features at their fingertips.
With iDRAC9 in-place across the Dell PowerEdge portfolio, the same IT administration techniques and tools can be applied
throughout. This consistent management platform allows easy scaling of PowerEdge servers as an organization's infrastructure
grows. Customers can use the iDRAC RESTful API for the latest in scalable administration methods of PowerEdge servers. With
this API, iDRAC enables support for the Redfish standard and enhances it with Dell extensions to optimize at-scale management
of PowerEdge servers. By having iDRAC at the core, the entire OpenManage portfolio of Systems Management tools allows
every customer to tailor an effective, affordable solution for any size environment.
Zero Touch Provisioning (ZTP) is embedded in iDRAC. ZTP - Zero Touch Provisioning is Intelligent Automation Dell's agent-free
management puts IT administrators in control. Once a PowerEdge server is connected to power and networking, that system
can be monitored and fully managed, whether you're standing in front of the server or remotely over a network. In fact,
with no need for software agents, an IT administrator can: • Monitor • Manage • Update • Troubleshoot and remediate Dell
servers. With features like zero-touch deployment and provisioning, iDRAC Group Manager, and System Lockdown, iDRAC9 is
purpose-built to make server administration quick and easy. For those customers whose existing management platform utilizes
in-band management, Dell does provide iDRAC Service Module, a lightweight service that can interact with both iDRAC9 and
the host operating system to support legacy management platforms.
When ordered with DHCP enabled from the factory, PowerEdge servers can be automatically configured when they are
initially powered up and connected to your network. This process uses profile-based configurations that ensure each server is
configured per your specifications. This feature requires an iDRAC Enterprise license.
iDRAC9 offers following license tiers:

52 Dell Systems Management

Table 20. iDRAC9 license tiers
License Description
iDRAC9 Basic ● Available only on 100-500 series rack/tower
● Basic instrumentation with iDRAC web UI
● For cost conscious customers that see limited value in management
iDRAC9 ● Default on 600+ series rack/tower, modular, and XR series
Express ● Includes all features of Basic
● Expanded remote management and server life-cycle features
iDRAC9 ● Available as an upsell on all servers
Enterprise ● Includes all features of Basic and Express. Includes key features such as virtual console, AD/LDAP
support, and more
● Remote presence features with advanced, Enterprise-class, management capabilities
iDRAC9 ● Available as an upsell on all servers
Datacenter ● Includes all features of Basic, Express, and Enterprise. Includes key features such as telemetry streaming,
Thermal Manage, automated certificate management, and more
● Extended remote insight into server details, focused on high end server options, granular power, and
thermal management

For a full list of iDRAC features by license tier, see Integrated Dell Remote Access Controller 9 User's Guide at [Link].
For more details on iDRAC9 including white papers and videos, see:
● Support for Integrated Dell Remote Access Controller 9 (iDRAC9) on the Knowledge Base page at [Link]

Systems Management software support matrix

Table 21. Systems Management software support matrix
Categories Features PE mainstream
Embedded Management and In-band iDRAC9 (Express, Enterprise, and Datacenter licenses) Supported
Services
OpenManage Mobile Supported
OM Server Administrator (OMSA) Supported
iDRAC Service Module (iSM) Supported
Driver Pack Supported
Change Management Update Tools (Repository Manager, DSU, Catalogs) Supported
Server Update Utility Supported
Lifecycle Controller Driver Pack Supported
Bootable ISO Supported
Console and Plug-ins OpenManage Enterprise Supported
Power Manager Plug-in Supported
Update Manager Plug-in Supported
SupportAssist Plug-in Supported
CloudIQ Supported
Integrations and connections OM Integration with VMware Vcenter/vROps Supported
OM Integration with Microsoft System Center (OMIMSC) Supported
Integrations with Microsoft System Center and Windows Supported
Admin Center (WAC)

Dell Systems Management 53

Table 21. Systems Management software support matrix (continued)
Categories Features PE mainstream
ServiceNow Supported
Ansible Supported
Third-party Connectors (Nagios, Tivoli, Microfocus) Supported
Security Secure Enterprise Key Management Supported
Secure Component Verification Supported
Standard operating system Red Hat Enterprise Linux, SUSE, Windows Server 2019 or Supported (Tier-1)
2022, Ubuntu, CentOS

54 Dell Systems Management

 13
Appendix D: Service and support
Topics:
• Why attach service contracts
• ProSupport Infrastructure Suite
• Specialty Support Services
• ProDeploy Infrastructure Suite
• Supplemental Deployment Services
• Unique Deployment Scenarios
• DAY 2 – Automation Services with Ansible
• Dell Technologies Consulting Services

Why attach service contracts

Dell PowerEdge servers include a standard hardware warranty that highlights our commitment to product quality by
guaranteeing repair or replacement of defective components. While industry-leading, our warranties are limited to 1 or 3 years,
depending on model, and do not cover software assistance. Call records show that customers are most often seeking Dell
technical support for software related issues like configuration guidance, troubleshooting, upgrade assistance or performance
tuning. Encourage customers to purchase ProSupport service contracts to supplement warranty coverage and ensure optimal
support for both hardware and software. ProSupport provides a complete hardware guarantee beyond the original warranty
period.

ProSupport Infrastructure Suite

ProSupport Infrastructure Suite is a set of support services that enable customers to build the solution that is right for their
organization. It is an industry-leading, enterprise-class support that aligns with the criticality of your systems, the complexity of
your environment, and the allocation of your IT resources.

Appendix D: Service and support 55

Figure 50. ProSupport Enterprise Suite

ProSupport Plus for Infrastructure

ProSupport Plus for Infrastructure is the ultimate solution for customers seeking preventative maintenance and optimal
performance on their business-critical assets. The service caters to customers who require proactive, predictive, and
personalized support for systems that manage critical business applications and workloads. When customers purchase
PowerEdge server, we recommend ProSupport Plus, our proactive and preventative support service for business-critical
systems. ProSupport Plus provides all the benefits of ProSupport, including the following “Top five reasons to buy ProSupport
Plus (PSP)”
1. Priority access to specialized support experts: Immediate advanced troubleshooting from an engineer that understands
Dell infrastructure solutions.
2. Mission Critical Support: When critical (Severity 1) support issues happen, the customer is assured that we do all that we
can to get them back up and running as quickly as possible.
3. Service Account Manager: A customer’s #1 support advocate, ensuring they get the best possible proactive and predictive
support experience.
4. Systems maintenance: On a semiannual basis, we will keep a customer’s ProSupport Plus system(s) up to date by
installing the latest firmware, BIOS, and driver updates to improve performance and availability.
5. Third-party software support: Dell is a customer’s single point of accountability for any eligible third-party software that
is installed on their ProSupport Plus system, whether they purchased the software from us or not.

ProSupport for Infrastructure

Comprehensive 24x7 support for hardware and software – best for production, but not critical, workloads and applications. The
ProSupport service offers highly trained experts around the clock and around the globe to address IT needs. We help minimize
disruptions and maximize availability of PowerEdge server workloads with:
● 24x7 support through phone, chat and online
● A central point of accountability for all hardware and software issues
● Hypervisor, operating system, and application support
● Dell security advisories
● Onsite response service levels 4 hour or Next Business Day options

56 Appendix D: Service and support

● Proactive issue detection with automated case creation
● Predictive hardware anomaly detection
● Incident Manager assigned for Severity 1 cases
● Collaborative third-party support
● Access to AIOps Platforms - (MyService360, TechDirect, and CloudIQ)
● Consistent experience regardless of where customers are located or what language that they speak.

Basic Hardware Support

Provides reactive hardware support during normal business hours, excluding local national holidays. No software support or
software-related guidance. For improved levels of support, choose ProSupport or ProSupport Plus.

Specialty Support Services

Optional specialty support services complement the ProSupport Infrastructure Suite to provide additional proficiencies that are
critical for modern data center operations.

Hardware coverage add-ons to ProSupport

● Keep Your Hard Drive (KYHD), Keep Your Component (KYC), or Keep Your GPU (KYGPU):

Normally if a device fails under warranty, Dell replaces it using a one-for-one exchange [Link]/KYCC/KYGPU gives
you the option to retain your device. It provides full control of sensitive data and minimizes security risk by letting you retain
possession of failed drives, components, or GPU when receiving replacement parts without incurring additional cost.
● Onsite Diagnosis Service:

Ideal for sites with non-technical staff. Dell field technician performs initial troubleshooting diagnosis onsite and transfers to
Dell remote engineers to resolve the issue.
● ProSupport Add-on for HPC:

Sold as an add-on to a ProSupport service contract, the ProSupport Add-on for HPC provides solution-aware support to
cover the additional requirements that are required to maintain an HPC environment such as:

○ Access to senior HPC experts

○ Advanced HPC cluster assistance: Performance, interoperability, and configuration
○ Enhanced HPC solution level end-to-end support
○ Remote pre-support engagement with HPC Specialists during ProDeploy implementation
● ProSupport Add-on for Telco (Respond & Restore):

An add-on service designed for the top 31 TELCO customers globally, Respond & Restore provides direct access to Dell
solution experts who specialize in TELCO carrier-grade support. This add-on also provides a hardware uptime guarantee,
meaning if a system fails, Dell has it installed and operational within 4 hours for Severity 1 issues. Dell incurs penalties and
fees if SLAs are not met.

Personalized Support and Supplemental Site-wide Expertise

● Technical Account Manager:

Designated technology lead who monitors and manages the performance and configuration of specific technology sets.
● Designated Remote Support:

Personalized support expert who manages all troubleshooting and resolution of IT assets.
● Multivendor Support Service:

Support your third-party devices as one service plan for servers, storage, and networking (includes coverage for: Broadcom,
Cisco, Fujitsu, HPE, Hitachi, Huawei, IBM, Lenovo, NetApp, Oracle, Quanta, SuperMicro and others).

Appendix D: Service and support 57

Services for large enterprises
● ProSupport One for Data Center:
ProSupport One for Data Center offers flexible site-wide support for large and distributed data centers with more than 1,000
assets (combined total of server, storage, networking, so forth). This offering is built on standard ProSupport features that
leverage our global scale and are tailored to specific customer needs. While not for everyone, this service option offers a
truly unique solution for our largest customers with the most complex environments.

○ Team of assigned Services Account Managers with remote or onsite options

○ Assigned technical and field engineers who are trained on the customer’s environment and configurations.
○ On-demand reporting and recommendations that are enabled by ProSupport AIOps tools (MyService360, TechDirect, and
CloudIQ)
○ Flexible onsite support and parts options that fit their operational model
○ A tailored support plan and training for their operations staff
● ProSupport One for CSPs (Cloud Serviced Providers)
ProSupport One for CSPs is a unique offer that is designed for a limited set of Dell accounts purchasing Gen AI computing
solutions greater than 1,000 servers and $250M in sales. PS1 for CSPs improves the entire services experience combining
support, deployment (rack integration), residency services, a designated support engineer and the LOIS parts locker as
one holistic bundle. Special pricing has been determined to compete effectively against competitors and provide the best
customer experience. PS1 for CSPs can only be sold with XE Servers and all networking platforms (Dell and NVIDIA). All
other products would be eligible for the standard PS1DC not this special bundle offer. More details on PS1 for CSPs here.
● Logistics Online Inventory Solution (LOIS)

Ideal for large organizations that have their own staff to support their data center. Dell offers a service that is called
Logistics Online Inventory Solution which is an onsite parts locker that provides self-maintainers with a local inventory
of common replacement components. Having access to these parts lockers allows the self-maintainer to replace a failed
component immediately without delay. Each replacement part would automatically initiate a replenishment of the parts
inventory that is shipped the next day or delivered onsite by Dell during a regular scheduled visit (called Scheduled Onsite
Service). As part of the LOIS system, customers can integrate their systems directly to Dell TechDirect using APIs to help
streamline the support management process.

End-of-Life Services
● Post Standard Support (PSS)

Extend service life beyond the initial seven years of ProSupport, adding up to five more additional years of hardware
coverage.
● Data Sanitization & Data Destruction

Renders data unrecoverable on repurposed or retired products, ensuring security of sensitive data and enabling compliance
and provides NIST-compliant certification.
● Asset Recovery Services

Recycle, resale, and disposal of hardware. Helps you securely and responsibly retire IT assets that are no longer needed while
protecting both your business and the planet.

ProDeploy Infrastructure Suite

ProDeploy Infrastructure Suite provides various deployment offerings that satisfy a customer's unique needs. It is made up
of various sub-offers: Factory Configuration Services, Rack Integration, Basic Deployment, ProDeploy, ProDeploy Plus, and
optionally ProDeploy FLEX which allows for some customization of the features listed.

58 Appendix D: Service and support

Figure 51. ProDeploy Infrastructure Suite

Factory-based Services
Pre-configured systems or complete racks, customized prior to shipping to the customer's site.
Rack Integration or ProDeploy FLEX Rack Integration
Ideal for customers buying servers in volume and seeking pre-configuration prior to shipping such as: custom image, system
settings, and asset tagging so it arrives ready to use out of the box. Furthermore, servers are packaged and bundled to meet
specific shipping and distribution requirements for each customer location to facilitate the rollout process. Once the server is
onsite, Dell can install and configure the server to the environment using any of the field-based deployment services outlined in
the next section.
● STANDARD SKUs for Rack Integration is available in then USA only and requires:
○ 20 or more devices (XE, R and C series servers, VxRail and all Dell or non-Dell switches).
○ Shipping to contiguous USA.
● USE CUSTOM QUOTE for Rack Integration scenarios that require:
○ Any Direct Liquid Cooling (DLC) implementation
○ Shipping to multiple locations or shipment to any country outside USA or shipping outside contiguous USA
○ Air-cooled racks containing less than 20 servers
○ Any rack that includes Storage
Factory Configuration
Ideal for customers buying servers in volume and seeking pre-configuration prior to shipping such as: custom image, system
settings, and asset tagging so it arrives ready to use out of the box. Furthermore, servers are packaged and bundled to meet
specific shipping and distribution requirements for each customer location to facilitate the rollout process. Once the server is
onsite, Dell can install and configure the server to the environment using any of the field-based deployment services outlined in
the next section.

Appendix D: Service and support 59

Figure 52. ProDeploy Flex modular services

Field-based services
Put PowerEdge servers to work faster with Dell field-based deployment services. Whether we are deploying one server to one
thousand – we have you covered. Dell provides versatile delivery options to fit every budget and operating model.
● ProDeploy Plus: Elevate Infrastructure deployments with our most complete service from planning through onsite hardware
installation and software configuration including the implementation of cybersecurity best practices. ProDeploy Plus provides
the skill and scale that is needed to successfully execute demanding deployments in today’s complex IT environments. The
deployment starts with a site readiness review and implementation plan. Certified deployment experts perform the software
configuration to include setup of leading operating systems and hypervisors. Dell will also configure PowerEdge software
tools to include iDRAC and OpenManage system utilities as well as support AIOps platforms: MyService360, TechDirect, and
CloudIQ. Unique to ProDeploy Plus, the cybersecurity implementation helps customers understand potential security risks
and make recommendations for reducing product attack surfaces. The system is tested, validated prior to completion. The
customer will also receive full project documentation and knowledge transfer to complete the process.
● ProDeploy: ProDeploy provides remote software configuration and choice of hardware installation (onsite or guided).
ProDeploy is great for customers who are price sensitive or willing to participate in some portion of the deployment
to include providing remote access to their network. The ProDeploy remote software includes everything mentioned in
ProDeploy Plus except it does not include the added value, cybersecurity implementation, and implementatiod best practices.
● Basic Deployment: Basic Deployment delivers worry-free professional installation by experienced technicians. This service
is often sold to Competency Enabled Partners who will have Dell do the hardware installation while they complete the
software configuration. Furthermore, Basic Deployment tends to be purchased by large enterprises who have smart
technical staff. These companies just need Dell to install the hardware, and they will perform the software configuration. The
last use case for Basic Deployment is when paired with Factory Configuration services. The servers are preconfigured in the
factory, and the basic deployment service will install the system into the rack to finalize the deployment.

60 Appendix D: Service and support

Figure 53. ProDeploy Infrastructure Suite - Field services

Supplemental Deployment Services

Additional ways to expand scope or deploy for unique scenarios.

Two Host Adder (requires PD/PDP)

Deploying new storage, compute, or networking devices may require interconnection to other servers (also called hosts). The
Dell delivery team will set up four hosts per device as part of every ProDeploy service. For example, if the customer is buying
two storage arrays the ProDeploy service will automatically include connectivity of four hosts each (4x2=8 total hosts per
project since there are two devices). This supplemental “Two Host Adder” service provides for the configuration of additional
hosts above what is already provided as part of the ProDeploy service. In many cases, customers can work with us while we set
up the included hosts, so they may understand how to do the rest themselves. Always ask the customer how many hosts are
being connected and sell the host adder depending on the customer’s technology skillset. Note that this service applies to the
connectivity of Dell devices not 3rd party devices.

Additional Deployment Services (ADT) – sold with or without PD/PDP

You can expand the scope of a ProDeploy engagement leveraging Additional Deployment Time (ADT). ADT covers additional
tasks above the normal deliverables of the ProDeploy offers. ADT can also be used as a standalone service without ProDeploy.
SKUs are available for both Project Management and Technical Resource Expertise. SKUs are sold as blocks of four hours
remote or eight hours onsite. The delivery team can help in scoping the number of hours required for additional tasks.

Data Migration Services

Migrating data sets is no easy task. Our experts use proven tools and process to streamline data migrations and avoid
compromising data. A customer project manager works with our experienced team of experts to create a migration plan. Data
migration is part of every technology upgrade, platform change, and shift to the cloud. You can rely on Dell data migration
services to perform a seamless transition.

Appendix D: Service and support 61

Residency Services
Certified technical professionals act like an extension of your IT staff to enhance internal capabilities and resources and
help you realize faster adoption and maximized ROI of new technology. Residency Services help customers transition to new
capabilities quickly by leveraging specific technology skill sets. Residency experts can provide post implementation management
and knowledge transfer that is related to a new technology acquisition or day-to-day operational management of the IT
infrastructure.
● Global experts available to serve in-person (onsite) or virtual (remote)
● Engagements starting at 2 weeks with flexibility to adjust
● Residency is available for project management needs, and many different technology skills sets such as: Server, storage, Gen
AI, networking, security, multi-cloud, data mgmt., and modern workforce application residents

Unique Deployment Scenarios

Custom Deployment Services
When a deployment is beyond the scope of the ProDeploy Infrastructure Suite, you can turn to the custom deployment services
team to address complex implementation scenarios and customer unique requirements. The Dell custom deployment team is
staffed with solution architects who will assist with customer scoping calls to define the project and develop the statement
of work. Custom services can handle a wide range of deployments that can be performed in the factory or onsite. All custom
engagement services are requested through SFDC.

Deployment of AI or HPC
Dell provides a number of deploy options for Artificial Intelligence (AI) or High-Performance Computing (HPC) implementations.
These complex environments require specialists that understand advanced feature sets. Dell deploys and understands the
complexities to optimize the environment. AI and HPC deployments are always scoped as custom service engagements.

Figure 54. Deployment choices for cluster implementation

DAY 2 – Automation Services with Ansible

Dell solutions are built as “automation ready” with integrated APIs (Application Programming Interfaces) to allow customers
to programmatically call actions on the product through code. Although Dell has published Anisble automation use cases,

62 Appendix D: Service and support

some customers need additional assistance with GitOps. By the end of the service, the customer will have the foundational
components required to accelerate automation and understand how the programming works together: Day 1 and Day 2 use case
automation scripts (ansible modules), CI/CD tool (Jenkins), and Version control (Git).

Dell Technologies Consulting Services

Our expert consultants help customers transform faster, and quickly achieve business outcomes for the high-value workloads
Dell PowerEdge systems can handle. From strategy to full-scale implementation, Dell Technologies Consulting can help
determine how to perform IT, workforce, or application transformation. We use prescriptive approaches and proven
methodologies that are combined with the portfolio and partner ecosystem of Dell Technologies to help achieve real business
outcomes. From multicloud, applications, DevOps, and infrastructure transformations, to business resiliency, data center
modernization, analytics, workforce collaboration, and user experiences-we are here to help.

Dell Managed Services

Some customers prefer Dell to manage the complexity and risk of daily IT operations, Dell Managed Services utilizes proactive,
AI enabled delivery operations and modern automation to help customers realize desired business outcomes from their
infrastructure investments. With these technologies, our experts run, update, and fine-tune customer environments that are
aligned with service levels, while providing environment-wide and down-to-the-device visibility. There are two types of managed
service offers. First the outsourcing model or CAPEX model where Dell manages the customer owned assets using our people
and tools. The second is the as-a-Service model or OPEX model called APEX. In this service, Dell owns all technology and all the
management of it. Many customers will have a blend of the two management types depending on the goals of the organization.

Figure 55. Dell Managed Services

Managed Detection and Response (MDR)

Dell Technologies Managed Detection and Response (MDR) is powered by Secureworks Taegis XDR software platform. MDR is
a managed service that secures the customer’s IT environment against malicious actors and provides remediation if and when a
threat is identified. When a customer purchases MDR, they will receive the following features from our team:
● Dell badge resources
● Agent rollout assistance to help deploy the Secureworks Endpoint Agent
● 24x7 threat detection and investigation
● Up to 40 hrs per quarter of response and active remediation activities
● If the customer experiences a breach, we will provide up to 40 hrs per year of Cyber incident response initiation
● Quarterly reviews with the customer to review the data

Appendix D: Service and support 63

Dell Technologies Education Services
Build the IT skills required to influence the transformational outcomes of the business. Enable talent and empower teams with
the right skills to lead and perform transformational strategy that drives competitive advantage. Leverage the training and
certification that is required for real transformation.
Dell Technologies Education Services offers PowerEdge server training and certifications that are designed to help customers
achieve more from their hardware investment. The curriculum delivers the information and the practical, firsthand skills that
their team must confidently install, configure, manage, and troubleshoot Dell servers.
To learn more or register for a class today, see [Link].

Resources
Service for powerEdge

64 Appendix D: Service and support

 14
Appendix A: Additional specifications
Topics:
• Chassis dimension
• Chassis weight
• NIC port specifications
• Video specifications
• USB Ports
• PSU rating
• Environmental specifications

Chassis dimension
The R760 has the following dimensions:

Figure 56. Chassis dimensions

Appendix A: Additional specifications 65

Table 22. Chassis dimensions
Model Xa Xb Y Za with Za Zb Zc Max Sys Chassis
number bezel without Wgt
bezel
R760 482 mm 434 mm 86.8 mm 35.84 mm 22 mm 700.7 mm 736.29 mm 36.1 kg 2U

Chassis weight
Table 23. Chassis weight
System Configuration Maximum Weight
A server with fully populated drives 36.1 kg (79.58 lbs)
A server without drives and PSU installed 25.1 kg (55.33 lbs)

NIC port specifications

The PowerEdge R760 system supports up to two Network Interface Controller (NIC) ports embedded on the LAN on
Motherboard (LOM) card and up to four ports integrated on the Open Compute Project (OCP) NIC card.

Table 24. NIC port specification for the system

Feature Specifications
LOM card (optional) 1 GbE x 2
OCP NIC card (OCP NIC 3.0) (optional) 1GbE x 4, 10 GbE x 2, 10 GbE x 4, 25 GbE x 2, 25 GbE x 4,
100GbE x 2
Management Interface Card (MIC) to support Dell Data 25 GbE x 2, 100 GbE x 2 or 200 GbE x 2
Processing Unit (DPU) card (optional)

NOTE: The system allows either LOM card or an OCP NIC card or both to be installed in the system.

NOTE: On the MS system board, the supported OCP NIC PCIe width is x8; when x16 PCIe width is installed, it is
downgraded to x8.

NOTE: A 100 GbE OCP NIC card of PCIe width x16 can be used by connecting the OCP NIC cable from SL11_CPU1_PB7 to
SL13_CPU1_PB7 on the MAX system board.

NOTE: For storage configurations that already use the SL11_CPU1_PB7 or SL13_CPU1_PB7 connector on the Max system
board, there is a restriction on supporting OCP NIC cable.

NOTE: The system allows either LOM card or MIC card to be installed in the system.

Video specifications
The PowerEdge R760 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 25. Video specifications for R760

Resolution Refresh rate (Hz) Color depth (bits)
1024 x 768 60 8, 16, 32
1280 x 800 60 8, 16, 32
1280 x 1024 60 8, 16, 32

66 Appendix A: Additional specifications

Table 25. Video specifications for R760 (continued)
Resolution Refresh rate (Hz) Color depth (bits)
1360 x 768 60 8, 16, 32
1440 x 900 60 8, 16, 32
1600 x 900 60 8, 16, 32
1600 x 1200 60 8, 16, 32
1680 x 1050 60 8, 16, 32
1920 x 1080 60 8, 16, 32
1920 x 1200 60 8, 16, 32

USB Ports

Figure 57. Front USB Port

Figure 58. Rear USB Port

Figure 59. Internal USB Port

Appendix A: Additional specifications 67

Table 26. Systems USB Specifications
Front Rear Internal
USB port type No. of ports USB port type No. of ports USB port type No. of ports
USB x.2.0 – 1 USB x.2.0 – compliant 1 USB x.3.0 – compliant 1
compliant port port
port
USB x.3.0 – compliant 1
port

PSU rating
Below table lists the power capacity of the PSUs in high/low line operation mode.

Table 27. PSUs highline and lowline ratings

PSU 700 W 800 W 1100 W 1100 W 1400 W 1400 W 1800 W 2400 W 2800 W 3200 W
Titaniu Platinu Titaniu -48 Platinum Titanium Titanium Platinum Titanium Titanium
m m m VDC
Peak 1190 W 1360 W 1870 W 1360 W 2380 W 2380 W 3060 W 4080 W 4760 W 5440 W
Power
(Highline
/-72
VDC)
Highline 700 W 800 W 1100 W 1100 W 1400 W 1400 W 1800 W 2400 W 2800 W 3200 W
/-72
VDC
Peak N/A 1360 W 1785 W 1785 W 1785 W 1785 W N/A 2380 W N/A N/A
Power
(Lowline
/-40
VDC)
Lowline/ N/A 800 W 1050 W 1100 W 1050 W 1050 W N/A 1400 W N/A N/A
-40 VDC
Highline 700 W 800 W 1100 W N/A 1400 W 1400 W 1800 W 2400 W 2800 W 3200 W
240
VDC
DC-(48 N/A N/A N/A 1100 W N/A N/A N/A N/A N/A N/A
—60) V

The PowerEdge R760 supports up to two AC power supplies with 1+1 redundancy, autosensing, and auto switching capability.
If two PSUs are present during POST, a comparison is made between the wattage capacities of the PSUs. In case the PSU
wattages do not match, the larger of the two PSUs is enabled. Also, there is a PSU mismatch warning that is displayed in the
BIOS, iDRAC, or on the system LCD.
If a second PSU is added at run-time, in order for that particular PSU to be enabled, the wattage capacity of the first PSU must
equal the second PSU. Otherwise, the PSU is flagged as unmatched in iDRAC and the second PSU is not enabled.
Dell PSUs have achieved Platinum efficiency levels as shown in the table below.

Table 28. PSU efficiency level

Efficiency Targets by Load
Form factor Output Class 10% 20% 50% 100%
Redundant 60 mm 700 W AC Titanium 90.00% 94.00% 96.00% 91.50%
800 W AC Platinum 89.00% 93.00% 94.00% 91.50%

68 Appendix A: Additional specifications

Table 28. PSU efficiency level (continued)
Efficiency Targets by Load
Form factor Output Class 10% 20% 50% 100%
1100 W AC Titanium 90.00% 94.00% 96.00% 91.50%
1100 W -48 V N/A 85.00% 90.00% 92.00% 90.00%
DC
1400 W AC Platinum 89.00% 93.00% 94.00% 91.50%
1400 W AC Titanium 90.00% 94.00% 96.00% 91.50%
1800 W AC Titanium 90.00% 94.00% 96.00% 94.00%
Redundant 86 mm 2400 W AC Platinum 89.00% 93.00% 94.00% 91.50%
2800 W AC Titanium 90.00% 94.00% 96.00% 94%
3200 W AC Titanium 90.00% 94.00% 96.00% 91%

Environmental specifications
NOTE: For additional information about environmental certifications, refer to the Product Environmental Datasheet located
with the Documentation on Dell Support.

Table 29. Continuous Operation Specifications for ASHRAE A2

Temperature Specifications
Allowable continuous operations
Temperature range for 10–35°C (50–95°F) with no direct sunlight on the equipment
altitudes <= 900 m (<=
2953 ft)
Humidity percent range 8% RH with -12°C (10.4°F) minimum dew point to 80% RH with 21°C (69.8°F) maximum dew
(non-condensing at all point
times)
Operational altitude de- Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900 m (2953 Ft)
rating

Table 30. Continuous Operation Specifications for ASHRAE A3

Temperature Specifications
Allowable continuous operations
Temperature range for 5–40°C (41–104°F) with no direct sunlight on the equipment
altitudes <= 900 m (<=
2953 ft) Excursion Limited Operation 5-35°C (41-95°F) Continuous Operation
35-40°C (95-104°F) 10% Annual Runtime
Humidity percent range 8% RH with -12°C (10.4°F) minimum dew point to 85% RH with 24°C (75.2°F) maximum dew
(non-condensing at all point
times)
Operational altitude de- Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900 m (2953 Ft)
rating

Table 31. Continuous Operation Specifications for ASHRAE A4

Temperature Specifications
Allowable continuous operations

Appendix A: Additional specifications 69

Table 31. Continuous Operation Specifications for ASHRAE A4 (continued)
Temperature Specifications
Temperature range for 5–45°C (41–113°F) with no direct sunlight on the equipment
altitudes <= 900 m (<=
2953 ft) Excursion Limited Operation 5-35°C (41-95°F) Continuous Operation
35-40°C (95-104°F) 10% Annual Runtime
40-45°C (104-113°F) 1% Annual Runtime
Humidity percent range 8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C (75.2°F) maximum dew
(non-condensing at all point
times)
Operational altitude de- Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900 m (2953 Ft)
rating

Table 32. Common Environmental Specifications for ASHRAE A2, A3 and A4

Temperature Specifications
Allowable continuous operations
Maximum temperature gradient (applies to both 20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15
operation and non-operation) minutes), 5°C in an hour* (9°F in an hour) for tape hardware
NOTE: * - Per ASHRAE thermal guidelines for tape hardware, these are
not instantaneous rates of temperature change.

Non-operational temperature limits -40 to 65°C (-40 to 149°F)

Non-operational humidity limits 5% to 95% RH with 27°C (80.6°F) maximum dew point
Maximum non-operational altitude 12,000 meters (39,370 feet)
Maximum operational altitude 3,050 meters (10,006 feet)

Table 33. Maximum vibration specifications

Maximum vibration Specifications
Operating 0.21 G rms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)
Storage 1.88 G rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 34. Maximum shock pulse specifications

Maximum shock pulse Specifications
Operating Six consecutively executed shock pulses in the positive and negative x, y,
and z axis of 6 G for up to 11 ms
Storage Six consecutively executed shock pulses in the positive and negative x, y,
and z axis (one pulse on each side of the system) of 71 G for up to 2 ms

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous
contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage
or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of
the customer.

Table 35. Particulate contamination specifications

Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1
with a 95% upper confidence limit

70 Appendix A: Additional specifications

Table 35. Particulate contamination specifications (continued)
Particulate contamination Specifications

NOTE: This condition applies to data center environments only. Air

filtration requirements do not apply to IT equipment designed to be
used outside a data center, in environments such as an office or
factory floor.

NOTE: Air entering the data center must have MERV11 or MERV13
filtration.

Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles
NOTE: This condition applies to data center and non-data center
environments.

Corrosive dust ● Air must be free of corrosive dust

● Residual dust present in the air must have a deliquescent point less
than 60% relative humidity
NOTE: This condition applies to data center and non-data center
environments.

Walk-Up Edge Data Center or Cabinet (sealed, closed Filtration is not required for cabinets that are anticipated to be opened
loop environment) 6 times or less per year. Class 8 per ISO 1466-1 filtration as defined
above is required otherwise
NOTE: In environments commonly above ISA-71 Class G1 or that
may have known challenges, special filters may be required.

Table 36. Gaseous contamination specifications

Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013

Thermal restriction matrix

Table 37. Processor and heat sink matrix
Heat sink Processor TDP
STD HSK ≤ 165 W (supports only 2.5-inch drives and non-GPU
configuration)
2U HPR HSK 125 W–250 W (supports 3.5-inch drives and non-GPU
configuration)
165 W–350 W (supports 2.5-inch drives and non-GPU
configuration)
L-type HSK Supports all GPU/FPGA configurations

NOTE: All GPU/FGPA cards require 1U L-type HSK and GPU shroud.

Table 38. Label reference

Label Description
STD Standard
HPR (Silver) High performance Silver (HPR Silver) fan
HPR (Gold) High performance Gold (HPR Gold) fan

Appendix A: Additional specifications 71

Table 38. Label reference (continued)
Label Description
HSK Heat sink
LP Low profile
FH Full height
DLC Direct Liquid Cooling

NOTE: The ambient temperature of the configuration is determined by the critical component in that configuration. For
example, if the processor's supported ambient temperature is 35°C (95°F), the DIMM is 35°C (95°F), and the GPU is
30°C (86°F), the combined configuration can only support 30°C (86°F).

Thermal restriction matrix for 4th Gen Intel® Xeon® Scalable or Intel® Xeon® Max
Processors
Table 39. Thermal restriction matrix for air cooled configuration
16 x 16 x
16 x
8x 2.5- 2.5-
2.5- 24 x
No 2.5- inch inch
inch 2.5-
back inc SAS 24 x 2.5-inch SAS + 12 x 3.5-
Configuration or 16 x inch
plan h and SAS 8x inch
Split EDSFF NVM
e NV 2.5-
E3.S e
Me NVMe- NVMe inch
SAS NVMe
2.5-
2.5-inch inch or Ambien
No or
No No re EDSFF No No EDSFF t
No No No
rear rear ar E3.S rear rear E3.S temper
Rear storage rear rear rear rear
drive driv dri rear driv driv drives ature
drives drives drives
s es ve drives es es with
s with rear
rear fan fan
T-
Case
max HPR GOLD
CPU TDP/cTDP Cores Fan
cent fan 70%^
er
(°C)
3408U 125 W 1 8 79 STD STD STD STD ST HPR STD HPR HPR HPR 35°C
D SLVR GOL SLV GOLD (95°F)
D R
5415+ 150 W 1 8 78 STD STD STD STD ST HPR STD HPR HPR HPR 35°C
D SLVR GOL SLV GOLD (95°F)
4410Y 12 78 D R
5416S 16 78
5418N 165 W 1 24 84 STD STD STD STD ST HPR STD HPR HPR HPR 35°C
D SLVR GOL SLV GOLD (95°F)
5411N 24 84 D R
4416+ 20 82
6426Y 185 W 1 16 72 STD STD STD STD ST HPR HPR HPR HPR HPR 35°C
D SLVR SLVR GOL GOL GOLD (95°F)
5418Y 24 80 D D
5412U 24 80
6428N 32 85
6421N 32 85

72 Appendix A: Additional specifications

Table 39. Thermal restriction matrix for air cooled configuration (continued)
16 x 16 x
16 x
8x 2.5- 2.5-
2.5- 24 x
No 2.5- inch inch
inch 2.5-
back inc SAS 24 x 2.5-inch SAS + 12 x 3.5-
Configuration plan h and or 16 x inch
EDSFF SAS 8x NVM inch
e NV Split 2.5-
E3.S e
Me NVMe- NVMe inch
SAS NVMe
2.5-
2.5-inch inch or Ambien
No or
No No re EDSFF No No EDSFF t
No No No E3.S
rear rear ar E3.S rear rear temper
Rear storage rear rear rear rear
drive driv dri rear driv driv drives ature
drives drives drives
s es ve drives es es with
s with rear
rear fan fan
T-
Case
max HPR GOLD
CPU TDP/cTDP Cores Fan
cent fan 70%^
er
(°C)
6434 205 W 1 8 96 STD STD STD STD ST HPR HPR HPR HPR HPR 35°C
D SLVR SLVR GOL GOL GOLD (95°F)
5420+ 28 84 D D
6438Y+ 32 76
6438M 32 84
6438N 32 84
6442Y 225 W1 24 79 STD STD STD STD ST HPR HPR HPR HPR HPR 35°C
D SLVR SLVR GOL GOL GOLD* (95°F)
6448Y 32 79 D D*
6444Y 270 W 2 32 75 HPR HPR HPR HPR HP HPR HPR HPR Req Require 35°C
SLVR SLV SLVR SLVR R SLVR SLVR GOL uire d DLC (95°F)
R SL D d
VR DLC
8462Y+ 300 W 2 32 81 HPR HPR HPR HPR HP HPR HPR HPR Req Require 35°C
SLVR SLV SLVR SLVR R SLVR fan SLVR GOL uire d DLC (95°F)
R SL D d
VR DLC
6458Q 350 W 2 32 64 Requi Req Require Requir Re Required Requir Requ Req Require 35°C
red uire d DLC ed DLC qui DLC ed ired uire d DLC (95°F)
DLC d red DLC DLC d
DLC DL DLC
C
6414U 250 W 2 32 76 STD STD STD STD ST HPR HPR HPR HPR HPR 35°C
fan fan fan fan D SLVR fan SLVR GOL GOL GOLD* (95°F)
fan D D*
6454S 270 W 2 32 71 HPR HPR HPR HPR HP HPR HPR HPR Req Require 35°C
SLVR SLV SLVR SLVR R SLVR fan SLVR GOL uire d DLC (95°F)
6430 32 71 R SL D d
VR DLC
8471N 300 W 2 52 76 HPR HPR HPR HPR HP HPR HPR HPR Req Require 35°C
SLVR SLV SLVR SLVR R SLVR SLVR GOL uire d DLC (95°F)
8470N 52 76 R SL D d
8460Y+ 40 75 VR DLC

8452Y 36 75

Appendix A: Additional specifications 73

Table 39. Thermal restriction matrix for air cooled configuration (continued)
16 x 16 x
16 x
8x 2.5- 2.5-
2.5- 24 x
No 2.5- inch inch
inch 2.5-
back inc SAS 24 x 2.5-inch SAS + 12 x 3.5-
Configuration plan h and or 16 x inch
EDSFF SAS 8x NVM inch
e NV Split 2.5-
E3.S e
Me NVMe- NVMe inch
SAS NVMe
2.5-
2.5-inch inch or Ambien
No or
No No re EDSFF No No EDSFF t
No No No E3.S
rear rear ar E3.S rear rear temper
Rear storage rear rear rear rear
drive driv dri rear driv driv drives ature
drives drives drives
s es ve drives es es with
s with rear
rear fan fan
T-
Case
max HPR GOLD
CPU TDP/cTDP Cores Fan
cent fan 70%^
er
(°C)
8480+ 350 W 2 56 79 HPR HPR HPR HPR HP HPR HPR HPR Req Require 35°C
SLVR SLV SLVR SLVR R SLVR SLVR GOL uire d DLC (95°F)
8470 52 79 R SL D* d
8468 48 79 VR DLC

8470Q 350 W 2 52 57 Requi Req Require Requir Re Required Requir Requ Req Require 35°C
red uire d DLC ed DLC qui DLC ed ired uire d DLC (95°F)
DLC d red DLC DLC d
DLC DL DLC
C
9480 350 W 2 56 64 Requi Req Require Requir Re Required Requir Requ Req Require 35°C
red uire d DLC ed DLC qui DLC ed ired uire d DLC (95°F)
9470 52 64 DLC d red DLC DLC d
DLC DL DLC
C
9460 350 W 2 40 77 HPR HPR HPR HPR HP HPR HPR HPR Req Require 35°C
SLVR SLV SLVR SLVR R SLVR SLVR GOL uire d DLC (95°F)
9462 32 77 R SL D* d
VR DLC

NOTE: The platform supports Maximum (MAX) and Mainstream (MS) system boards.
● 1 supports MS system board (CPU TDP < 250 W)
● 2 supports MAX system board (CPU TDP => 250 W)

NOTE: ^The fan speed in the 3.5-inch chassis is limited to 70% due to the drive dynamic profile.

NOTE: *Supported ambient temperature is 30°C (86°F).

74 Appendix A: Additional specifications

Table 40. Thermal restriction matrix for memory with air cooled configuration (non-GPU)
16 x 16 x
2.5- 2.5-
16 x 2.5-
inch inch
No 8 x 2.5- SAS inch or 16 24 x 2.5-
24 x 2.5-inch SAS +
Configuration backpl inch and x EDSFF inch 12 x 3.5-inch
SAS 8x
ane NVMe Split E3.S 2.5- NVMe
NVMe
NVMe- inch
SAS NVMe
2.5-inch 2.5-inch
or or
No EDSFF EDSFF
No
No rear No rear No rear No rear rear E3.S No rear No rear E3.S
Rear storage rear
drives drives drives drives drive rear drives drives rear
s drives drives drives
with with rear
rear fan fan
HPR HPR
SLVR STD GOLD
2DP
DIMM fan fan fan HPR SLVR fan 70%
C/
Configur STD fan (CPU TDP <= 250 W) (CPU (CPU (CPU (CPU TDP up to
Pow
ation TDP up TDP <= TDP up 165 W)^
er to 350 165 W) to 350
W) W)
256 GB 12.7 30°C 30°C 30°C 30°C 30°C 35°C Require 35°C Required Required
RDIMM W (86°F) (86°F) (86°F) (86°F) (86°F (95°F) d DLC (95°F) DLC DLC
)
128 GB 8.9 35°C 35°C 35°C 35°C 30°C 35°C 30°C 35°C 30°C 30°C
RDIMM W (95°F) (95°F) (95°F) (95°F) (86°F (95°F) (86°F) (95°F) (86°F) (86°F)
)
64 GB 6.9 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 30°C 30°C
RDIMM W (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (86°F) (86°F)
)
32 GB 4.1 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
RDIMM W (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F) (95°F)
)
16 GB 3W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
RDIMM (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F) (95°F)
)
DIMM 2DP HPR SLVR fan (CPU TDP up to 350 W) HPR HPR GOLD fan
Configur C/ GOLD 70% (CPU TDP up
ation Pow fan to 250 W)
er (CPU
TDP up
to 350
W)
256 GB 12.7 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C Required Required
RDIMM W (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) DLC DLC
)
128 GB 8.9 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 30°C 30°C
RDIMM W (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (86°F) (86°F)
)
64 GB 6.9 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 30°C 30°C
RDIMM W (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (86°F) (86°F)
)
32 GB 4.1 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
RDIMM W (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F) (95°F)
)

Appendix A: Additional specifications 75

Table 40. Thermal restriction matrix for memory with air cooled configuration (non-GPU) (continued)
16 x 16 x
2.5- 2.5-
16 x 2.5-
inch inch
No 8 x 2.5- SAS inch or 16 24 x 2.5-
24 x 2.5-inch SAS +
Configuration backpl inch and x EDSFF inch 12 x 3.5-inch
SAS 8x
ane NVMe Split E3.S 2.5- NVMe
NVMe
NVMe- inch
SAS NVMe
2.5-inch 2.5-inch
or or
No EDSFF EDSFF
No
No rear No rear No rear No rear rear E3.S No rear No rear E3.S
Rear storage rear
drives drives drives drives drive rear drives drives rear
s drives drives drives
with with rear
rear fan fan
HPR HPR
SLVR STD GOLD
2DP
DIMM fan fan fan HPR SLVR fan 70%
C/
Configur STD fan (CPU TDP <= 250 W) (CPU (CPU (CPU (CPU TDP up to
Pow
ation TDP up TDP <= TDP up 165 W)^
er to 350 165 W) to 350
W) W)
16 GB 3W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
RDIMM (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F) (95°F)
)

NOTE: In 12 x 3.5-inch with rear module configuration, for CPU TDP greater than 270 W and specific Low Temperature-
case CPUs are not supported.

NOTE: ^The fan speed in the 3.5-inch chassis is limited to 70% due to the drive dynamic profile.

Table 41. Thermal restriction matrix for rear NVMe drives with air cooled configuration (non-GPU)
Configuration 24 x 2.5-inch SAS 12 x 3.5-inch
2 x 2.5-inch 4 x 2.5-inch 2 x 2.5-inch 4 x 2.5-inch
Rear storage with rear fan with rear fan with rear fan with rear fan
Drive type Drives capacity Power HPR SLVR fan HPR GOLD fan 70%
Kioxia CD7 15.36 TB 19 W 35°C (95°F) 35°C (95°F) 30°C (86°F) 30°C (86°F)
Samsung PM9A3 7.68 TB 14 W 35°C (95°F) 35°C (95°F) 30°C (86°F) 30°C (86°F)
Samsung PM1733 15.36 TB 22 W 30°C (86°F) 30°C (86°F) N/A N/A
Samsung 15.36 TB 19.7 W 35°C (95°F) 30°C (86°F) 30°C (86°F) N/A
PM1733a
Samsung 12.8 TB 19.8 W 35°C (95°F) 30°C (86°F) 30°C (86°F) N/A
PM1735a
Redtail 7.68 TB 24.5 W 30°C (86°F) 30°C (86°F) N/A N/A
Hynix PE8010 7.68/3.84/1.92 17 W 35°C (95°F) 30°C (86°F) 30°C (86°F) N/A
TB
Intel P5520 15.36 TB 20 W 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F)
Kioxia CM7 30.72 TB 25 W 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F)
Kioxia CD8 15.36 TB 19 W 35°C (95°F) 35°C (95°F) 35°C (95°F) 35°C (95°F)
PE8110 7.68 TB 20 W 30°C (86°F) N/A N/A N/A
PE8110 3.84/1.92 TB 20 W 35°C (95°F) 30°C (86°F) 30°C (86°F) N/A
PS1010 15.36 TB 20 W 35°C (95°F) 35°C (95°F) 30°C (86°F) 30°C (86°F)

76 Appendix A: Additional specifications

Table 41. Thermal restriction matrix for rear NVMe drives with air cooled configuration (non-
GPU) (continued)
Configuration 24 x 2.5-inch SAS 12 x 3.5-inch
2 x 2.5-inch 4 x 2.5-inch 2 x 2.5-inch 4 x 2.5-inch
Rear storage
with rear fan with rear fan with rear fan with rear fan
Drive type Drives capacity Power HPR SLVR fan HPR GOLD fan 70%
PS1030 12.8 TB 20 W 35°C (95°F) 35°C (95°F) 30°C (86°F) 30°C (86°F)

Table 42. Thermal restriction matrix for GPU configurations

16 x
8 x 2.5- 16 x 2.5- 2.5-
8x inch 16 x inch or 24 x inch 24 x
No 2.5- NVMe + 2.5- 16 x 2.5- SAS + 2.5-
Configuration back inch 8 x 2.5- inch EDSFF inch 8x inch
plane NVMe inch SAS E3.S SAS 2.5- NVMe
SAS NVMe inch
NVMe
No No No No No
rear No rear No rear rear No rear rear
Rear storage rear rear
drive drives drives drives
drives drives drives drives
s
T-Case
max
CPU TDP/cTDP Cores HPR GOLD fan with 1U HPR L-Type HSK
center
(°C)
3408U 125 W 1 8 79 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
(95°F (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F)
) )
5415+ 150 W 1 8 78 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
(95°F (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F)
4410Y 12 78 ) )
5416S 16 78
5418N 165 W 1 24 84 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
(95°F (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F)
5411N 24 84 ) )
4416+ 20 82
6426Y 185 W 1 16 72 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
(95°F (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F)
5418Y 24 80 ) )
5412U 24 80
6428N 32 85
6421N 32 85
6434 205 W 1 8 96 35°C 35°C 35°C 35°C 35°C 35°C 35°C 30°C
(95°F (95°F) (95°F) (95°F (95°F) (95°F) (86°F) (86°F)
5420+ 28 84 ) )
6438Y+ 32 76
6438M 32 84
6438N 32 84
6442Y 225 W 1 24 79 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
(95°F (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F)
6448Y 32 79 ) )
6444Y 270 W 2 32 75 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
(95°F (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F)
) )

Appendix A: Additional specifications 77

Table 42. Thermal restriction matrix for GPU configurations (continued)
16 x
8 x 2.5- 16 x 2.5- 2.5-
8x inch 16 x inch or 24 x inch 24 x
No 2.5- NVMe + 2.5- 16 x 2.5- SAS + 2.5-
Configuration back inch 8 x 2.5- inch EDSFF inch 8x inch
plane NVMe inch SAS E3.S SAS 2.5- NVMe
SAS NVMe inch
NVMe
No No No No No
rear No rear No rear rear No rear rear
Rear storage rear rear
drive drives drives drives drives drives drives drives
s
T-Case
max
CPU TDP/cTDP Cores HPR GOLD fan with 1U HPR L-Type HSK
center
(°C)
8462Y+ 300 W 2 32 81 35°C 35°C 35°C 35°C 35°C 30°C 30°C 30°C
(95°F (95°F) (95°F) (95°F (95°F) (86°F) (86°F) (86°F)
) )
6458Q 350 W 2 32 64 Requi Requir Required Requir Required Requir Require Requir
red ed DLC ed DLC ed DLC d DLC ed
DLC DLC DLC DLC
6414U 250 W 2 32 76 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
(95°F (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F)
) )
6454S 270 W 2 32 71 35°C 35°C 35°C 35°C 35°C 30°C 30°C 30°C
(95°F (95°F) (95°F) (95°F (95°F) (86°F) (86°F) (86°F)
6430 32 71 ) )
8471N 300 W 2 52 76 35°C 35°C 35°C 35°C 35°C 30°C 30°C 30°C
(95°F (95°F) (95°F) (95°F (95°F) (86°F) (86°F) (86°F)
8470N 52 76 ) )
8460Y+ 40 75
8452Y 36 75
8480+ 350 W 2 56 79 30°C 30°C 30°C 30°C 30°C Requir Require Requir
(86°F (86°F) (86°F) (86°F (86°F) ed DLC d DLC ed
8470 52 79 ) ) DLC
8468 48 79
8470Q 350 W 2 52 57 Requi Requir Required Requir Required Requir Require Requir
red ed DLC ed DLC ed DLC d DLC ed
DLC DLC DLC DLC
9480 350 W 2 56 64 Requi Requir Required Requir Required Requir Require Requir
red ed DLC ed DLC ed DLC d DLC ed
9470 52 64 DLC DLC DLC DLC
9460 350 W 2 40 77 30°C 30°C 30°C 30°C 30°C Requir Require Requir
(86°F (86°F) (86°F) (86°F (86°F) ed DLC d DLC ed
9462 32 77 ) ) DLC

NOTE: The platform supports Maximum (MAX) and Mainstream (MS) system boards.
● 1 supports MS system board (CPU TDP < 250 W)
● 2 supports MAX system board (CPU TDP => 250 W)

NOTE: ^The fan speed in the 3.5-inch chassis is limited to 70% due to the drive dynamic profile.

NOTE: *Supported ambient temperature is 30°C (86°F).

78 Appendix A: Additional specifications

 NOTE: GPU configuration supports only High performance Gold (HPR Gold) fan.

Table 43. Thermal restriction matrix for memory with air cooled configuration (GPU)
16 x 2.5-
No inch SAS 16 x 2.5-inch or 24 x 2.5- 16 x 2.5-inch 24 x 2.5-
8 x 2.5-
Configuration backpla inch NVMe and Split 16 x EDSFF inch SAS + 8 x 2.5- inch
ne NVMe- E3.S NVMe ** SAS* inch NVMe*** NVMe***
SAS *
DIMM 2DPC/
Configura HPR GOLD fan with 1U HPR L-Type HSK
Power
tion
256 GB 12.7 W 35°C 35°C 35°C 35°C (95°F) Required Required DLC Required
RDIMM (95°F) (95°F) (95°F) DLC DLC
128 GB 8.9 W 35°C 35°C 35°C 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F)
RDIMM (95°F) (95°F) (95°F) (95°F)
64 GB 6.9 W 35°C 35°C 35°C 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F)
RDIMM (95°F) (95°F) (95°F) (95°F)
32 GB 4.1 W 35°C 35°C 35°C 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F)
RDIMM (95°F) (95°F) (95°F) (95°F)
16 GB 3W 35°C 35°C 35°C 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F)
RDIMM (95°F) (95°F) (95°F) (95°F)

NOTE: *In 16 x 2.5-inch SAS and 8 x 2.5-inch NVMe configurations, for CPU TDP 350 W supported ambient temperature is
30°C (86°F).

NOTE: **In 16 x 2.5-inch NVMe configuration, for CPU TDP greater than 300 W supported ambient temperature is 30°C
(86°F).

NOTE: ***In 24 x 2.5-inch SAS/NVMe configuration and 16 x 2.5-inch SAS + 8 x 2.5-inch NVMe, for CPU TDP 270 W -
300 W and specific Low Temperature-case CPUs supported ambient temperature is 30°C (86°F).

Table 44. Optimized Ecological upgrade thermal restriction matrix for air cooled configuration
16 x 16 x
2.5- 16 x 2.5-
8 x inch 2.5- inch 24 x
No 2.5- SAS inch SAS 2.5-
bac inch and or 16 x 24 x SAS
2.5-inch
Configuration +8x inch 12 x 3.5-inch
kpla NV split EDSF 2.5- NV
ne Me NV F E3.S inch Me
Me- NVMe NVM
SAS e
2.5- 2.5-
inch or EDSFF
inch
No EDSFF E3.S Amb
No No No No No rear
No E3.S No rear ient
rear rear rear rear rear rear rear rear drive
Rear storage rear drives tem
driv driv driv drives driv drive driv drives s
drives with pera
es es es es s es with
with rear ture
rear
rear fan
fan
fan
T-
Cas
e
ma
CPU TDP/cTDP Cores x Fan/HSK HPR GOLD fan 70%^
cen
ter
(°C
)
5415+ 150 W 8 78 STD STD STD STD / STD HPR STD / HPR HPR HPR HPR 35°
/2U /2U /2U 2U /2U SLVR / 2U GOL SLVR GOL SLVR / C
4410Y 12 78 HPR HPR HPR HPR HPR 2U HPR HPR D/ 2U HPR

Appendix A: Additional specifications 79

Table 44. Optimized Ecological upgrade thermal restriction matrix for air cooled
configuration (continued)
16 x 16 x
2.5- 16 x 2.5-
8 x inch 2.5- inch 24 x
No 2.5- SAS inch SAS 2.5-
bac inch and or 16 x 24 x 2.5-inch
Configuration +8x inch 12 x 3.5-inch
kpla NV split EDSF SAS 2.5- NV
ne Me NV F E3.S inch Me
Me- NVMe NVM
SAS e
2.5- 2.5-
inch or EDSFF
inch
No EDSFF E3.S Amb
No No No No No rear
No E3.S No rear ient
rear rear rear rear rear rear rear drive
Rear storage rear rear drives tem
driv driv driv drives driv drives drive driv drives s with pera
es es es es with s es with rear ture
rear
rear fan
fan
fan
T-
Cas
e
ma
CPU TDP/cTDP Cores x Fan/HSK HPR GOLD fan 70%^
cen
ter
(°C
)
5416S 16 78 D/ /2U 2U (95°
STD HPR HPR F)
5418N/ 165 W 24 84 STD STD STD STD / STD HPR STD / HPR HPR HPR HPR 35°
5411N /2U /2U /2U 2U /2U SLVR / 2U GOL SLVR GOL SLVR / C
HPR HPR HPR HPR HPR 2U HPR HPR D/ /2U D/ 2U HPR (95°
4416+ 20 82 STD HPR 2U F)
HPR

NOTE: ^The fan speed in the 3.5-inch chassis is limited to 70% due to the drive dynamic profile.

80 Appendix A: Additional specifications

Thermal restriction matrix for 5th Gen Intel® Xeon® Scalable Processors
Table 45. Thermal restriction matrix for air cooled configuration
16 x 16 x
2.5- 16 x 2.5-
8x
2.5- inch 2.5- inch 24 x
No inc SAS inch or SAS 2.5-
24 x 2.5-inch
Configuration back h and 16 x + 8 x inch 12 x 3.5-inch^
SAS
plane NV Split EDSFF 2.5- NV
Me NVM E3.S inch Me
e- NVMe NVM
SAS e
2.5-
2.5- inch or Ambien
No inch or EDSFF t
No No No rea EDSFF No No No E3.S temper
rear rear rear No rear E3.S rear rear rear
Rear storage r rear ature
drive driv drive drives dri rear drive driv drive drives
s es s ves drives s es s with
with rear
rear fan fan
T-
Case
Core max
CPU TDP/cTDP Fan
s cent
er
(°C)
4509Y 125 W 1 8 84 STD STD STD STD ST HPR STD HPR HPR HPR 35°C
D SLVR GOL SLVR GOLD (95°F)
D
4510 150 W 1 12 84 STD STD STD STD ST HPR STD HPR HPR HPR 35°C
D SLVR GOL SLVR GOLD (95°F)
4514Y 16 79 D
5512U 185 W 1 28 89 STD STD STD STD ST HPR HPR HPR HPR HPR 35°C
D SLVR SLVR GOL GOL GOLD (95°F)
D D
6534 195 W 1 8 64 STD STD STD STD ST HPR HPR HPR HPR HPR 35°C
D SLVR SLVR GOL GOL GOLD (95°F)
6526Y 16 82 D D
6542Y 250 W 1 24 83 STD STD STD STD ST HPR HPR HPR HPR HPR 35°C
D SLVR SLVR GOL GOL GOLD* (95°F)
6548Y+ 32 83 D D*
6548N 32 83
8562Y+ 300 W 2 32 81 HPR HPR HPR HPR HP HPR HPR HPR Requi Require 35°C
SLVR SLV SLVR SLVR R SLVR SLVR GOL red d DLC (95°F)
R SLV D DLC
R
8558U 300 W 2 48 78 HPR HPR HPR HPR HP HPR HPR HPR Requi Require 35°C
SLVR SLV SLVR SLVR R SLVR SLVR GOL red d DLC (95°F)
R SLV D DLC
R
8568Y+ 350 W 2 48 81 HPR HPR HPR HPR HP HPR HPR HPR Requi Require 35°C
SLVR SLV SLVR SLVR R SLVR SLVR GOL red d DLC (95°F)
8580 60 81 R SLV fan fan D* DLC
8592+ 64 81 R

NOTE: The platform supports Maximum (MAX) and Mainstream (MS) system boards.
● 1 supports MS system board (CPU TDP < 250 W)
● 2 supports MAX system board (CPU TDP ≥ 250 W)

Appendix A: Additional specifications 81

 NOTE: *Supported ambient temperature is 30°C (86°F).

NOTE: ^The fan speed in the 3.5-inch chassis is limited to 70% due to the drive dynamic profile.

Table 46. Thermal restriction matrix for memory with air cooled configuration (non-GPU)
16 x 16 x
2.5- 2.5-
16 x 2.5-
inch inch
No 8 x 2.5- SAS inch or 16 24 x 2.5-
24 x 2.5-inch SAS +
Configuration backpl inch and x EDSFF inch 12 x 3.5-inch
SAS 8x
ane NVMe Split E3.S 2.5- NVMe
NVMe
NVMe- inch
SAS NVMe
2.5-inch 2.5-inch
or or
No EDSFF EDSFF
No
No rear No rear No rear No rear rear E3.S No rear No rear E3.S
Rear storage drives drives drives drives drive rear rear drives drives rear
drives
s drives drives
with with rear
rear fan fan
HPR HPR
SLVR STD GOLD
2DP
DIMM fan fan fan HPR SLVR fan 70%
C/
Configur STD fan (CPU TDP <= 250 W) (CPU (CPU (CPU (CPU TDP up to
Pow
ation TDP up TDP <= TDP up 165 W)^
er to 350 165 W) to 350
W) W)
256 GB 12.7 30°C 30°C 30°C 30°C 30°C 35°C Require 35°C Required Required
RDIMM W (86°F) (86°F) (86°F) (86°F) (86°F (95°F) d DLC (95°F) DLC DLC
)
128 GB 8.9 35°C 35°C 35°C 35°C 30°C 35°C 30°C 35°C 30°C 30°C
RDIMM W (95°F) (95°F) (95°F) (95°F) (86°F (95°F) (86°F) (95°F) (86°F) (86°F)
)
96 GB 8.3 35°C 35°C 35°C 35°C 30°C 35°C 30°C 35°C 30°C 30°C
RDIMM W (95°F) (95°F) (95°F) (95°F) (86°F (95°F) (86°F) (95°F) (86°F) (86°F)
)
64 GB 6.9 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 30°C 30°C
RDIMM W (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (86°F) (86°F)
)
32 GB 4.1 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
RDIMM W (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F) (95°F)
)
16 GB 3W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
RDIMM (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F) (95°F)
)
DIMM 2DP HPR SLVR fan (CPU TDP up to 350 W) HPR HPR GOLD fan
Configur C/ GOLD 70% (CPU TDP up
ation Pow fan to 250 W)^
er (CPU
TDP up
to 350
W)
256 GB 12.7 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C Required Required
RDIMM W (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) DLC DLC
)
128 GB 8.9 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 30°C 30°C
RDIMM W (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (86°F) (86°F)
)

82 Appendix A: Additional specifications

Table 46. Thermal restriction matrix for memory with air cooled configuration (non-GPU) (continued)
16 x 16 x
2.5- 2.5-
16 x 2.5-
inch inch
No 8 x 2.5- SAS inch or 16 24 x 2.5-
24 x 2.5-inch SAS +
Configuration backpl inch and x EDSFF inch 12 x 3.5-inch
SAS 8x
ane NVMe Split E3.S 2.5- NVMe
NVMe
NVMe- inch
SAS NVMe
2.5-inch 2.5-inch
or or
No EDSFF EDSFF
No
No rear No rear No rear No rear rear E3.S No rear No rear E3.S
Rear storage rear
drives drives drives drives drive rear drives drives rear
s drives drives drives
with with rear
rear fan fan
HPR HPR
SLVR STD GOLD
2DP
DIMM fan fan fan HPR SLVR fan 70%
C/
Configur STD fan (CPU TDP <= 250 W) (CPU (CPU (CPU (CPU TDP up to
Pow
ation TDP up TDP <= TDP up 165 W)^
er to 350 165 W) to 350
W) W)
96 GB 8.3 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 30°C 30°C
RDIMM W (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (86°F) (86°F)
)
64 GB 6.9 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 30°C 30°C
RDIMM W (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (86°F) (86°F)
)
32 GB 4.1 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
RDIMM W (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F) (95°F)
)
16 GB 3W 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
RDIMM (95°F) (95°F) (95°F) (95°F) (95°F (95°F) (95°F) (95°F) (95°F) (95°F)
)

NOTE: ^The fan speed in the 3.5-inch chassis is limited to 70% due to the drive dynamic profile.

Table 47. Supported ambient temperature for processors with GPU

16 x 2.5-
16 x 2.5-
8x inch or 16 x 2.5-inch 24 x
No inch SAS
2.5- 16 x 24 x 2.5- SAS + 8 x 2.5-
Configuration backpl and Split
inch EDSFF inch SAS 2.5-inch inch
ane NVMe-
NVMe E3.S NVMe NVMe
SAS NVMe
No
No No No rear No rear No rear No rear rear
Rear storage rear rear drives drives drives drives drive
drives drives s
T-Case
max
CPU TDP/cTDP Cores Support HPR GOLD fan with 1U HPR L-Type HSK
center
(°C)
4509Y 125 W 1 8 84 35°C 35°C 35°C 35°C 35°C 35°C 35°C
4510 150 W 1 12 84 35°C 35°C 35°C 35°C 35°C 35°C 35°C
4514Y 16 79
5512U 185 W 1 28 89 35°C 35°C 35°C 35°C 35°C 35°C 35°C
6534 195 W1 8 64 35°C 35°C 35°C 35°C 35°C 35°C 35°C

Appendix A: Additional specifications 83

Table 47. Supported ambient temperature for processors with GPU (continued)
16 x 2.5-
16 x 2.5-
8x inch or 16 x 2.5-inch 24 x
No inch SAS
2.5- 16 x 24 x 2.5- SAS + 8 x 2.5-
Configuration backpl inch and Split EDSFF inch SAS 2.5-inch inch
ane NVMe-
NVMe SAS E3.S NVMe NVMe
NVMe
No
No No No rear No rear No rear No rear rear
Rear storage rear rear
drives drives drives drives drives drives drive
s
T-Case
max
CPU TDP/cTDP Cores Support HPR GOLD fan with 1U HPR L-Type HSK
center
(°C)
6526Y 16 82
6542Y 250 W1 24 83 35°C 35°C 35°C 35°C 35°C 35°C 35°C
6548Y+ 32 83
6548N 32 83
8562Y+ 300 W 2 32 81 35°C 35°C 35°C 35°C 30°C 30°C 30°C
8558U 300 W 2 48 78 35°C 35°C 35°C 35°C 30°C 30°C 30°C
8568Y+ 350 W 2 48 81 30°C 30°C 30°C 30°C Required Required DLC Requir
DLC ed
8580 60 81 DLC
8592+ 64 81

NOTE: The platform supports Maximum (MAX) and Mainstream (MS) system boards.
● 1 supports MS system board (CPU TDP < 250 W)
● 2 supports MAX system board (CPU TDP ≥ 250 W)

NOTE: *Supported ambient temperature is 30°C (86°F).

Table 48. Thermal restriction matrix for memory with air cooled configuration (GPU)
16 x 2.5-
No inch SAS 16 x 2.5-inch
8 x 2.5- 16 x 2.5-inch 24 x 2.5- 24 x 2.5-
Configuration backpla inch and Split SAS + 8 x 2.5-
NVMe NVMe inch SAS inch NVMe
ne NVMe- inch NVMe
SAS
DIMM 2DPC/
Configura HPR GOLD fan with 1U HPR L-Type HSK
Power
tion
256 GB 12.7 W 35°C 35°C 35°C 35°C (95°F) Required Required DLC Required
RDIMM (95°F) (95°F) (95°F) DLC DLC
128 GB 8.9 W 35°C 35°C 35°C 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F)
RDIMM (95°F) (95°F) (95°F) (95°F)
96 GB 8.3 W 35°C 35°C 35°C 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F)
RDIMM (95°F) (95°F) (95°F) (95°F)
64 GB 6.9 W 35°C 35°C 35°C 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F)
RDIMM (95°F) (95°F) (95°F) (95°F)
32 GB 4.1 W 35°C 35°C 35°C 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F)
RDIMM (95°F) (95°F) (95°F) (95°F)
16 GB 3W 35°C 35°C 35°C 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F)
RDIMM (95°F) (95°F) (95°F) (95°F)

84 Appendix A: Additional specifications

 NOTE: *256 GB RDIMM with 5 th Gen Intel® Xeon® Scalable Processors will be supported in the future release.

Common thermal restrictions for both 4th and 5th Gen Intel processors
Table 49. GPU types support thermal restriction for both air cooling and liquid cooling configuration
16 x 2.5-
16 x 2.5-inch 16 x 2.5-inch
8 x 2.5- inch SAS
SAS and NVMe or 16 24 x 2.5- 24 x 2.5-
Configuration No backplane inch split NVMe- x EDSFF inch SAS + 8 x 2.5- inch NVMe
NVMe inch
SAS E3.S NVMe NVMe
No rear No rear No rear No rear No rear No rear
Rear storage No rear drives drives drives drives drives drives drives
GPU HPR GOLD fan with 1U HPR L-Type HSK
A40 (Max 2) 35°C (95°F) 35°C 35°C (95°F) 30°C (86°F) 30°C 30°C 30°C (86°F)
(95°F) (86°F) (86°F)
Intel PVC (Max 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F) 30°C 30°C 30°C (86°F)
2) (95°F) (86°F) (86°F)
A100 80 GB (Max 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F) 35°C 35°C 35°C (95°F)
2) (95°F) (95°F) (95°F)
A16 (Max 2) 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F) 35°C 35°C 35°C (95°F)
(95°F) (95°F) (95°F)
A30 (Max 2) 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F) 35°C 35°C 35°C (95°F)
(95°F) (95°F) (95°F)
A2 (Max 6) 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F) 35°C 35°C 35°C (95°F)
(95°F) (95°F) (95°F)
H100 (Max 2) 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F) 35°C 35°C 35°C (95°F)
(95°F) (95°F) (95°F)
A800 (Max 2) 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F) 35°C 35°C 35°C (95°F)
(95°F) (95°F) (95°F)
L4 (Max 6) 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F) 35°C 35°C 35°C (95°F)
(95°F) (95°F) (95°F)
L40 (Max 2) 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F) 35°C 35°C 35°C (95°F)
(95°F) (95°F) (95°F)
Intel ASM (Max 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F) 35°C 35°C 35°C (95°F)
6) (95°F) (95°F) (95°F)
L40S (Max 2) 35°C (95°F) 35°C 35°C (95°F) 35°C (95°F) 35°C 35°C 35°C (95°F)
(95°F) (95°F) (95°F)

Appendix A: Additional specifications 85

Table 50. Thermal restriction for memory with liquid cooled configuration(non-GPU)
16 x 16 x
2.5- 16 x 2.5-
2.5-
8x inch inch 24 x
No 2.5- SAS orinch 24 x 2.5-inch SAS + 8 2.5-
Configuration backp inch and 16 x 12 x 3.5-inch^
SAS x 2.5- inch
lane NVMe Split EDSF inch NVMe
NVMe FNVMe
E3.S NVMe
-SAS
2.5-inch 2.5- Ambient
or inch or temperat
EDSFF EDSFF ure
No No No No No E3.S No No
No rear E3.S
Rear storage rear rear rear rear rear rear rear rear
drives rear
drives drives drives drives drives drives drives drives drives
with with
rear fan rear fan
DIMM
Configur Pow Fan
er
ation
256 GB 12.7 HPR HPR HPR HPR HPR HPR HPR HPR HPR HPR 35°C
RDIMM W SLVR SLVR SLVR SLVR SLVR SLVR SLVR SLVR GOLD GOLD (95°F)
fan
128 GB 8.9 STD STD STD STD STD STD STD STD HPR HPR 35°C
RDIMM W GOLD GOLD (95°F)
96 GB 8.3 STD STD STD STD STD STD STD STD HPR HPR 35°C
RDIMM W GOLD GOLD (95°F)
64 GB 6.9 STD STD STD STD STD STD STD STD HPR HPR 35°C
RDIMM W GOLD GOLD (95°F)
32 GB 4.1 STD STD STD STD STD STD STD STD HPR HPR 35°C
RDIMM W GOLD GOLD (95°F)
16 GB 3W STD STD STD STD STD STD STD STD HPR HPR 35°C
RDIMM GOLD GOLD (95°F)

NOTE: ^The fan speed in the 3.5-inch chassis is limited to 70% due to the drive dynamic profile.

Table 51. Thermal restriction for memory with liquid cooled configuration(GPU)
16 x 2.5- 16 x 2.5-inch 16 x 2.5-
No 8 x 2.5- inch SAS 24 x 2.5-
or 16 x 24 x 2.5-inch inch SAS +
Configuration backp inch and Split inch
EDSFF E3.S SAS 8 x 2.5-
lane NVMe NVMe- NVMe
NVMe inch NVMe
SAS
Ambient
No temperat
rear No rear No rear No rear No rear No rear
Rear storage No rear drives ure
drive drives drives drives drives drives
s
DIMM
Config Power Fan
uration
256 GB 12.7 W HPR GOLD fan 35°C
RDIMM (95°F)
128 GB 8.9 W
RDIMM
96 GB 8.3 W
RDIMM
64 GB 6.9 W
RDIMM

86 Appendix A: Additional specifications

Table 51. Thermal restriction for memory with liquid cooled configuration(GPU) (continued)
16 x 2.5- 16 x 2.5-inch 16 x 2.5-
No 8 x 2.5- inch SAS 24 x 2.5-
or 16 x 24 x 2.5-inch inch SAS +
Configuration backp inch and Split inch
EDSFF E3.S SAS 8 x 2.5-
lane NVMe NVMe- NVMe
NVMe inch NVMe
SAS
Ambient
No temperat
rear No rear No rear No rear No rear No rear
Rear storage No rear drives ure
drive drives drives drives drives drives
s
DIMM
Config Power Fan
uration
32 GB 4.1 W
RDIMM
16 GB 3W
RDIMM

NOTE: *256 GB RDIMM with 5 th Gen Intel® Xeon® Scalable Processors will be supported in the future release.

Thermal air restrictions

Table 52. Air cooling configurations thermal restriction for AHSRAE A3 and A4
ASHRAE A3/40°C (104°F) A4/45°C (113°F)
PSU Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
PCIe card Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA Not supported
DIMM 128 GB, or greater capacity DIMMs are not supported.
PCIe SSD Not supported
Front storage Not supported in 12 x 3.5-inch SAS configuration.
Rear storage Not supported
Fan HPR SLVR fans are required.
Processor ≤ 165 W ≤ 125 W
OCP Supported with 85°C (185°F) active optic Supported with 85°C (185°F) active optic cable and
cable. cards tier ≤4.
BOSS BOSS-N1 is supported. BOS-N1 is not supported.

Table 53. Liquid cooling configurations thermal restriction for AHSRAE A3 and A4
ASHRAE A3/40°C (104°F) A4/45°C (113°F)
PSU Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
PCIe card Non-Dell qualified peripheral cards and peripheral cards greater than 25 W are not supported.
GPU/FPGA Not supported
DIMM 128 GB, or greater capacity DIMMs are not supported.
PCIe SSD Not supported
Front storage Not supported in 12 x 3.5-inch SAS configuration.
Rear storage Not supported
Fan HPR SLVR fans are required in 2.5-inch configurations systems.

Appendix A: Additional specifications 87

Table 53. Liquid cooling configurations thermal restriction for AHSRAE A3 and A4 (continued)
ASHRAE A3/40°C (104°F) A4/45°C (113°F)
OCP Supported with 85°C (185°F) active optic Supported with 85°C (185°F) active optic cable and
cable. cards tier ≤4.
BOSS BOSS-N1 is supported. BOSS-N1 is not supported.

88 Appendix A: Additional specifications

 15
Appendix B. Standards compliance
The system conforms to the following industry standards.

Table 54. Industry standard documents

Standard URL for information and specifications
ACPIAdvance Configuration and Power Interface Uefi specifications and tools
Specification, v6.4
Ethernet IEEE Std 802.3-2022 ieee standards
MSFT WHQL Microsoft Windows Hardware Quality Labs [Link]/whdc/system/platform/pcdesign/desguide/
[Link]
IPMI Intelligent Platform Management Interface, v2.0 [Link]/design/servers/ipmi
DDR5 Memory DDR5 SDRAM Specification [Link]/standards-documents/docs/[Link]
PCI Express PCI Express Base Specification, v5.0 [Link]/specifications/pciexpress
PMBus Power System Management Protocol Specification, pmbus specification and revisions
v1.2
SAS Serial Attached SCSI, 3 (SAS-3) (T10/INCITS 519) SCSI storage interfaces information
SATA Serial ATA Rev. 3.3 [Link] page
SMBIOS System Management BIOS Reference Specification, BIOS reference specification page
v3.3.0
TPM Trusted Platform Module Specification, v1.2 and v2.0 trustedcomputinggroup org page
UEFI Unified Extensible Firmware Interface Specification, v2.7 UEFIF specifications
PI Platform Initialization Specification, v1.7
USB Universal Serial Bus v2.0 and SuperSpeed v3.0 (USB 3.1 USB Implementers Forum, Inc. USB document library
Gen1)
NVMe Express Base Specification. Revision 2.0c NVME specifications
NVMe Command Set Specifications
1. NVM Express NVM Command Set Specification. Revision
1.1c
2. NVM Express Zoned Namespaces Command Set. Revision
1.0c
3. NVM Express® Key Value Command Set. Revision 1.0c
NVMe Transport Specifications
1. NVM Express over PCIe Transport. Revision 1.0c
2. NVM Express RDMA Transport Revision. 1.0b
3. NVM Express TCP Transport. Revision 1.0c
NVMe NVM Express Management Interface. Revision 1.2c
NVMe NVMe Boot Specification. Revision 1.0

Appendix B. Standards compliance 89

 16
Appendix C Additional resources
Table 55. Additional resources
Resource Description of contents Location
Installation and Service Manual This manual, available in PDF format, [Link]/Support/Manuals
provides the following information:

● Chassis features
● System Setup program
● System indicator codes
● System BIOS
● Remove and replace procedures
● Diagnostics
● Jumpers and connectors
Getting Started Guide This guide ships with the system, and is [Link]/Support/Manuals
also available in PDF format. This guide
provides the following information:

● Initial setup steps

Rack Installation Guide This document ships with the rack kits, [Link]/Support/Manuals
and provides instructions for installing a
server in a rack.
System Information Label The system information label documents Inside the system chassis cover
the system board layout and system
jumper settings. Text is minimized due
to space limitations and translation
considerations. The label size is
standardized across platforms.
QR code for system resources This code on the chassis can be scanned Inside the system chassis cover
by a phone application to access
additional information and resources for
the server, including videos, reference
materials, service tag information, and
Dell contact information.
Enterprise Infrastructure Planning Tool The Dell online EIPT enables easier [Link]/calc
(EIPT) and more meaningful estimates to
help you determine the most efficient
configuration possible. Use EIPT to
calculate the power consumption of
your hardware, power infrastructure, and
storage.

90 Appendix C Additional resources

 A
Dell PowerEdge R760 NEBS level 3
As IT and Operational Technologies converge, communications service providers are evaluating their infrastructures to meet the
demands of digital transformation. Dell is uniquely positioned to assist both service providers and network equipment providers
(NEPs) in succeeding. By working closely with customers to fully understand their needs, Dell offers global partnership and
collaboration.
● Network Equipment-Building System (NEBS) Level 3 and ETSI validated
● Commercial off the shelf hardware
● Comprehensive, global availability, service, and support

Telecom server solution

NEBS compliance is an important requirement in your environment. Dell Solutions, a global leader in enterprise platforms,
provides NEBS Level-3 (GR-63 and GR-1089) and ETSI compliant PowerEdge Servers with Intel® Xeon® Processors, ensuring
top stability and global availability. Rack-mount systems are designed to deliver high performance, maximum scalability, and safe
and reliable service.
Dell PowerEdge Servers offer:
1. Open standard systems:
● Improved compatibility based on industry-leading Dell products
● Rapidly scalable and expandable
2. Industry standards Solutions
● Validated to NEBS Level 3 standards, [Link].9205, and various ETSI standards
● Enabled for operation in warmer environments than traditional data centers – Designed for extreme conditions such as
high humidity, earthquakes, and dust
3. Global regulatory support and availability
Following are the additional NEBS validated technology devices available:
● Intel i350 Quad Port 1 GbE BASE-T
● OCP NIC 3.0 [540-BCOE]
● Intel Ethernet i350 Quad Port 1 GbE BASE-T Adapter, PCIe Full Height, V2, FIRMWARE RESTRICTIONS APPLY [540-BDIW]
● Intel E810-XXVDA4 Quad Port 10/25GbE SFP28 Adapter, PCIe Full Height [540-BDDR]
NOTE: We cannot include the Serial Com card as it has not undergone testing on any platforms. Therefore, we cannot
confirm it as an additional card.

Service and support

Bring game-changing innovations to market quickly with services including design, manufacturing, fulfillment, and global support.
Refine products or design new ones with the right services, allowing focus on IP. Choose from services that can help:
● Conduct applications testing on the hardware
● Integrate hardware, images, applications, peripheral, and documents as your systems are built
● Consolidate, stage, deliver, and support your orders globally
● Deliver Customer Support anywhere with over 30,000 Dell employees in tech support, parts, and field services across 100+
countries

More Features
● Combine density, performance, and scalability to optimize application performance
● Manage your clients more efficiently with industry-leading support

Dell PowerEdge R760 NEBS level 3 91

● Ensure server security from the factory to you
○ Rely on a secure component supply chain to ensure protection from the factory to the data center
○ Maintain data safety with cryptographically signed firmware packages and Secure Boot
○ Prevent unauthorized or malicious changes with Server Lockdown
○ Wipe all data from nonvolatile media including hard drives, SSDs, and system memory quickly and securely with
SystemErase

Table 56. Specifications

Feature Technical Specification
Processor: Available for the entire life ● Intel Xeon 6428N
cycle. ● Intel Xeon 5412U
Up to 2x 185W Intel Xeon SP ● Intel Xeon 5418N
● Intel Xeon 5411N
● Intel Xeon 4514Y
● Intel Xeon 4410Y
● Intel Xeon 6421N
● Intel Xeon 4509Y
● Intel Xeon 5415+
● Intel Xeon 5512U
● Intel Xeon 3408U
● Intel Xeon 6426Y
● Intel Xeon 5416S
● Intel Xeon 4416+
● Intel Xeon 5418Y
● Intel Xeon 4510
Memory 32 DDR4 DIMM slots supporting RDIMM, speeds up to 4800

8GB, 16GB, 32GB, 64GB capacities supported

Storage controllers Front Controllers: PERC H965i, PERC H755

Drive bays R760 Front Drive
Bays:

Up to 24 x 2.5 inch SAS or SATA SSD

including 8 Universal Slots (NVMe direct)

Power supplies Titanium redundant hot swap 1100 W DC, 1400 W AC, and 1800 W AC power supply
supported.
Sizing Form factor: Chassis depth:
1. R760: Rack (2U) 1. R760: 772.13 mm with Bezel
Embedded management iDRAC9 with Lifecycle Controller (Express, Enterprise)
Bezel NEBS Filtered, Dell branded
OpenManage Software ● OpenManage Enterprise
● OpenManage Power Manager plugin
● OpenManage Service plugin
● OpenManage Update Manager plugin
● CloudIQ for PowerEdge plug in
● OpenManage Enterprise Integration for VMware vCenter
● OpenManage Integration for Microsoft System Center
● OpenManage Integration with Windows Admin Center
Integrations and connections ● BMC Truesight ● IBM Tivoli Netcool/OMNIbus
● Microsoft System Center ● IBM Tivoli Network Manager IP Edition
● OpenManage Integration ● Micro Focus Operations Manager
with ServiceNow

92 Dell PowerEdge R760 NEBS level 3

Table 56. Specifications (continued)
Feature Technical Specification
● Red Hat Ansible Modules ● Nagios Core
● Terraform Providers ● Nagios XI
● VMware vCenter and
vRealize Operations
Manager
Security ● Cryptographically signed firmware
● Data at Rest Encryption (SEDs with local or external key mgmt)
● Secure Boot
● Secured Component Verification (Hardware integrity check)
● Secure Erase
● Silicon Root of Trust
● System Lockdown (requires iDRAC9 Enterprise or Datacenter)
● TPM 2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ
Embedded NIC Broadcom 5720 Dual Port 1 GbE LOM
I/O Adapter Options Additional card options:
● Intel Ethernet 100G 2P E810-C Adapter (FH and LP)
● Broadcom NetXtreme-E P2100D BCM57508 2x100G QSFP PCIE Ethernet (LP)
● Mellanox ConnectX-6 Dx Dual Port 100 GbE QSFP56 PCIe Adapter (FH and LP)
● Mellanox Bluefield 2 DP 25 GbE SFP Crypto DPU (FH)
● Broadcom NetXtreme-E P425D BCM57504 4x25G SFP28 PCIE Ethernet (FH)
● Intel(R) Ethernet 25G 2P E810-XXV Adapter (LP)
● NVIDIA ConnectX-6LX Dual Port 25G GbE SFP28 Network Adapter (LP)
● Broadcom BCM57414 25G SFP Dual Port PCIE adapter (LP)
● Intel(R) Ethernet 25G 4P E810-XXV OCP
● Broadcom BCM57414 25G SFP Dual Port OCP3 Mezz
● Intel(R) Ethernet 25G 4P E810-XXV OCP
Ports R760:
● Front ports: 1x VGA, 1x USB 2.0, 1x dedicated iDRAC Direct Micro-USB.
● Rear ports: 1x VGA, 1 x USB 2.0, 1x USB 3.0, 1x Dedicated iDRAC Ethernet.
Fans HPR Gold Fan
Rack rail support Combo Rails
Environmental specs (NEBS Level-3 ● Temperature: Continuous operating temperature of -5C to 40C; 96 hour operating
and ETSI) excursions from -5C to 55C
● Humidity water/kg of dry air: Operating Humidity of 5% to 85% with excursions
of 5% to 90%, but not to exceed 0.24 kg :
● Altitude: Up to 4000m; -60m to 1800 m; -61m to 1829m at 40C; 1829m–3960m at
30C
● Dust: Dust filter rated 80% per ASHRAE Std 52.1
● Seismic: Operational resiliency up to Richter 7.5 seismic event (Zone 4 seismic
event)
● EMI: Immunity up to 8kV contact or 15kV air discharge
● Fire resistance: Constructed from fire-retardant materials designed to contain and
extinguish any fires that may occur inside the box.

Dell PowerEdge R760 NEBS level 3 93