CHAPTER 30

Brazing, Soldering, Adhesive-Bonding,

and Mechanical-Fastening Processes

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 Brazing

Figure 30.1 (a) Brazing and (b) braze welding operations.

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 Typical Filler Metals for Brazing Various
Metals and Alloys

TABLE 30.1
Brazing temperature,
Base metal Filler metal (°C)
Aluminum and its alloys Aluminum-silicon 570–620
Magnesium alloys Magnesium-aluminum 580–625
Copper and its alloys Copper-phosphorus 700–925
Ferrous and nonferrous (except aluminum and Silver and copper alloys, 620–1150
magnesium) copper- phosphorus
Iron-, nickel-, and cobalt-base alloys Gold 900–1100
Stainless steels, nickel- and cobalt-base alloys Nickel-silver 925–1200

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 Furnace Brazing

Figure 30.2 An example of furnace brazing: (a) before, (b) after. Note that the filler
metal is a shaped wire.

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 Induction Brazing

Figure 30.3 Schematic illustration of

a continuous induction-brazing setup,
for increased productivity. Source:
ASM International.

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 Joint Designs Used in Brazing

Figure 30.4 Joint designs commonly used in brazing operations. The clearance between
the two parts being brazed is an important factor in joint strength. If the clearance is too
small, the molten braze metal will not fully penetrate the interface. If it is too large, there
will be insufficient capillary action for the molten metal to fill the interface.

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 Brazing Design
Figure 30.5 Examples
of good and poor design
for brazing.

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 (a)
Figure 30.6
(a) Screening
or stenciling
paste onto a
printed circuit
board: 1.
Schematic
illustration of
the stenciling
process; 2. A
Stenciling section of a
typical stencil
pattern.
(continued)

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 (b)

Wave
Soldering
(c)
Figure 30.6 (continued) (b)
Schematic illustration of the
wave soldering process. (c)
SEM image of wave-soldered
joint on surface-mount device.

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 Types of Solders and their Applications

TABLE 30.2
Tin-lead General purpose
Tin-zinc Aluminum
Lead-silver Strength at higher than room temperature
Cadmium-silver Strength at high temperatures
Zinc-aluminum Aluminum; corrosion resistance
Tin-silver Electronics
Tin-bismuth Electronics

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Joint Designs
Used in
Soldering

Figure 30.7 Joint designs commonly used for soldering. Note that
examples (e), (g), (i), and (j) are mechanically joined prior to being
soldered, for improved strength. Source: American Welding Society.
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 Typical Properties and Characteristics of
Chemically Reactive Structural Adhesives
TABLE 30.3
Modified
Epoxy Polyurethane acrylic Cyanoacrylate Anaerobic
Impact resistance Poor Excellent Good Poor Fair
Tension-shear
3
strength, MPa (10 psi) 15.4 (2.2) 15.4 (2.2) 25.9 (3.7) 18.9 (2.7) 17.5 (2.5)
Peel strength, N/m
(lbf/in.) < 525 (3) 14,000 (80) 5250 (30) < 525 (3) 1750 (10)
Substrates bonded Most Most Most Most nonporous Metals, glass,
materials smooth, smooth, metals or plastics thermosets
nonporous nonporous
Service temperature –55 to 120 –160 to 80 70 to 120 –55 to 80 –55 to 150
range, °C (°F) (-70 to 250) (-250 to 175) (-100 to 250) (-70 to 175) (-70 to 300)
Heat cure or mixing
required Yes Yes No No No
Solvent resistance Excellent Good Good Good Excellent
Moisture resistance Excellent Fair Good Poor Good
Gap limitation, mm
(in.) None None 0.75 (0.03) 0.25 (0.01) 0.60 (0.025)
Odor Mild Mild Strong Moderate Mild
Toxicity Moderate Moderate Moderate Low Low
Flammability Low Low High Low Low
Source: Advanced Materials & Processes, July 1990, ASM International.

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 General Properties of Adhesives
TABLE 30.4
Type Comments Applications
Acrylic Thermoplastic; quick setting; tough bond at room Fiberglass and steel sandwich bonds,
temperature; two component; good solvent chemical tennis racquets, metal parts,
and impact resistance; short work life; odorous; plastics.
ventilation required
Anaearobic Thermoset; easy to use; slow curing; bonds at room Close fitting machine parts such as
temperature; curing occurs in absence of air, will not shafts and pulleys, nuts and bolts,
cure where air contacts adherents; one component; not bushings and pins.
good on permeable surfaces
Epoxy Thermoset; one or two component; tough bond; Metal, ceramic and rigid plastic parts.
strongest of engineering adhesives; high tensile and low
peel strengths; resists moisture and high temperature;
difficult to use
Cyanoacrylate Thermoplastic; quick setting; tough bond at room “Crazy glue.” ™
temperature; easy to use; colorless.
Hot melt Thermoplastic; quick setting; rigid or flexible bonds; Bonds most materials. Packaging,
easy to apply; brittle at low temperatures; based on book binding, metal can joints.
ethylene vinyl acetate, polyolefins, polyamides and
polyesters
Pressure sensitive Thermoplastic; variable strength bonds. Primer anchors Tapes, labels, stickers.
adhesive to roll tape backing material, a release agent
on the back of web permits unwinding. Made of
polyacrylate esters and various natural and synthetic
rubber

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 General Properties of Adhesives (cont.)

TABLE 30.4 (continued)

Type Comments Applications
Phenolic Thermoset; oven cured, strong bond; High tensile and Acoustical padding, brake lining and
low impact strength; brittle, easy to use; cures by clutch pads, abrasive grain bonding,
solvent evaporation. honeycomb structures.

Silicone Thermoset; slow curing, flexible; bonds at room Gaskets, sealants.

temperature; high impact and peel strength; rubber like
Formaldehyde: Thermoset; strong with wood bonds; urea is Wood joints, plywood, bonding.
-urea inexpensive, available as powder or liquid and requires
-melamine a catalyst; melamine is more expensive, cures with heat,
-phenol bond is waterproof; resorcinol forms waterproof bond
-resorcinol at room temperature. Types can be combined
Urethane Thermoset; bonds at room temperature or oven cure; Fiberglass body parts, rubber, fabric.
good gap filling qualities
Water-base Inexpensive, nontoxic, nonflammable. Wood, paper, fabric, leather, dry seal
-animal envelopes.
-vegetable
-rubbers

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 Adhesive Peeling Test

Figure 30.8 Characteristic behavior of (a) brittle and (b) tough adhesives in a peeling test. This test is
similar to the peeling of adhesive tape from a solid surface.

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 Joint Designs in Adhesive Bonding
Figure 30.9 Various joint designs
in adhesive bonding. Note that
good designs require large contact
areas between the members to be
joined.

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 Configurations of Adhesively Bonded Joints
Figure 30.10 Various
configurations for
adhesively bonded
joints: (a) single lap, (b)
double lap, (c) scarf, (d)
strap.

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 Rivets

Figure 30.11 Examples of rivets: (a) solid, (b) tubular, (c) split (or bifurcated), (d) compression.

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 Design Guidelines for Riveting

Figure 30.12 Design guidelines for riveting. (a) Exposed shank is too long; the result is buckling
instead of upsetting. (b) Rivets should be placed sufficiently far from edges to avoid stress
concentrations. (c) Joined sections should allow ample clearance for the riveting tools. (d) Section
curvature should not interfere with the riveting process. Source: J. G. Bralla.

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 Metal Stitching and a Double-Lock Seam

Figure 30.13 Various examples of metal stitching.

Figure 30.14 Stages in forming a double-lock seam.

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 Crimping

Figure 30.15 Two examples

of mechanical joining by
crimping.

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 Spring and Snap-In Fasteners
Figure 30.16 Examples of
spring and snap-in fasteners
used to facilitate assembly.

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