"Use 3D Convolutional Neural Network to Inspect Solder Ball Defects."

Bing-Jhang Lin et al. (2018)

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DOI: 10.1007/978-3-030-04167-0_24

access: closed

type: Conference or Workshop Paper

metadata version: 2018-12-03

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  dblp key:
  - conf/iconip/LinTTLF18
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Bing-Jhang Lin, Ting-Chen Tsan, Tzu-Chia Tung, You-Hsien Lee, Chiou-Shann Fuh:
Use 3D Convolutional Neural Network to Inspect Solder Ball Defects. ICONIP (1) 2018: 263-274

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